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1. 发明授权

US09027364B2 Method of manufacturing glass substrate 有权
标题翻译：制造玻璃基板的方法
公开(公告)号：US09027364B2
公开(公告)日：2015-05-12
申请号：US13183173
申请日：2011-07-14
申请人： Toshiyuki Asai , Tetsuo Suzuki
发明人： Toshiyuki Asai , Tetsuo Suzuki
IPC分类号： C03B23/037 , C03B23/26 , G11B5/84
CPC分类号： C03B23/037 , C03B23/26 , G11B5/8404 , Y02P40/57
摘要： A method includes forming a glass ribbon by heating and softening a glass plate preform and drawing the glass plate preform to a predetermined thickness in a heating furnace; and performing coring on the glass ribbon in order to form circular substrates in a straight line along a longitudinal direction of the glass ribbon.
摘要翻译：一种方法包括通过加热和软化玻璃板预成型件并在加热炉中将玻璃板预成型件拉制成预定厚度来形成玻璃带; 并且在玻璃带上进行取芯，以沿着玻璃带的纵向在直线上形成圆形基板。

2. 发明申请

US20120006063A1 METHOD OF MANUFACTURING GLASS SUBSTRATE 有权
标题翻译：制造玻璃基板的方法
公开(公告)号：US20120006063A1
公开(公告)日：2012-01-12
申请号：US13183173
申请日：2011-07-14
申请人： Toshiyuki Asai , Tetsuo Suzuki
发明人： Toshiyuki Asai , Tetsuo Suzuki
IPC分类号： C03B23/037 , C03B21/00
CPC分类号： C03B23/037 , C03B23/26 , G11B5/8404 , Y02P40/57
摘要： A method includes forming a glass ribbon by heating and softening a glass plate preform and drawing the glass plate preform to a predetermined thickness in a heating furnace; and performing coring on the glass ribbon in order to form circular substrates in a straight line along a longitudinal direction of the glass ribbon.
摘要翻译：一种方法包括通过加热和软化玻璃板预成型件并在加热炉中将玻璃板预成型件拉制成预定厚度来形成玻璃带; 并且在玻璃带上进行取芯，以沿着玻璃带的纵向在直线上形成圆形基板。

3. 发明授权

US06736449B2 Front structure for a vehicle 有权
标题翻译：车辆的前部结构
公开(公告)号：US06736449B2
公开(公告)日：2004-05-18
申请号：US10206033
申请日：2002-07-29
申请人： Toshiyuki Takahashi , Yasushi Murakami , Toshiyuki Asai
发明人： Toshiyuki Takahashi , Yasushi Murakami , Toshiyuki Asai
IPC分类号： B60R2700
CPC分类号： B62D21/155 , B62D21/11
摘要： A vehicle front structure including a pair of front side members extending in a fore-and-aft direction of the vehicle, each including a first front end portion with a first leading end, and a pair of subframes extending along the front side members on a lower side thereof, each including a second front end portion with a second leading end. The first and second front end portions are connected with each other via a connecting portion therebetween. An abutment member in the form of a tie-down hook or a first cross member is connected with the subframes via the connecting portion. The abutment member includes a front end forward offset from the first and second leading ends of the front side members and the subframes and a portion placed at substantially same height as the second front end portion.
摘要翻译：一种车辆前部结构，包括沿着所述车辆的前后方向延伸的一对前侧构件，每个前侧构件包括具有第一前端的第一前端部和在所述前侧构件上延伸的一对子框架其每一个包括具有第二前端的第二前端部分。第一和第二前端部经由它们之间的连接部分相互连接。通过连接部分将联锁钩或第一横梁的形式的邻接构件与子框架相连接。抵接构件包括从前侧构件和子框架的第一和第二前端向前偏移的前端和与第二前端部分基本相同的高度的部分。

4. 发明申请

US20080014542A1 REFLOW FURNACE 失效
标题翻译：冷却炉
公开(公告)号：US20080014542A1
公开(公告)日：2008-01-17
申请号：US11689156
申请日：2007-03-21
申请人： Toshiyuki ASAI , Motohiro Yamane , Takayuki Matsuoka , Atsushi Tanaka
发明人： Toshiyuki ASAI , Motohiro Yamane , Takayuki Matsuoka , Atsushi Tanaka
IPC分类号： F27B9/14
CPC分类号： B23K1/008 , B23K2101/42
摘要： A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.
摘要翻译：回流炉包括：载体装置，用于承载安装有电子部件的印刷电路板; 加热室，其通过环境气体加热承载在其中的印刷电路板，以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备，其包括回收装置，用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分，用于将回收的环境气体加热至所需温度的加热装置，用于燃烧所含有的助熔剂组分的氧化催化剂加热环境气体和返回装置，以在燃烧到加热室之后返回高温气体。

5. 发明授权

US06871890B2 Bumper mounting structure for vehicle 失效
标题翻译：车辆保险杠安装结构
公开(公告)号：US06871890B2
公开(公告)日：2005-03-29
申请号：US10411360
申请日：2003-04-11
申请人： Manabu Sato , Toshiyuki Asai , Haruaki Nakatsukasa
发明人： Manabu Sato , Toshiyuki Asai , Haruaki Nakatsukasa
IPC分类号： B60R19/04 , B60R19/18 , B60R19/24 , B62D21/15 , B60R19/34
CPC分类号： B60R19/24 , B60R2019/1806
摘要： The bumper mounting structure includes a front side member 1 and a bumper reinforcing member 2. In assembly, the tip end of the front side member 1 is connected with the bumper reinforcing member 2. The tip end of the member 1 is opened and provided with a slant part 10, forming a weakened part in the member 1. When an impact load causes the bumper reinforcing member 2 to be deformed, the deformation of the front side member 1 is induced at its opened end because of its weakened structure. Consequently, it is possible to carry out the effective absorption of impact energy without elevating a reaction force abruptly.
摘要翻译：保险杠安装结构包括前侧构件1和保险杠加强构件2.组装中，前侧构件1的前端与保险杠加强构件2连接。构件1的前端打开并设置有倾斜部分10在构件1中形成弱化部分。当碰撞载荷使得保险杠加强构件2变形时，由于其结构变薄，所以前侧构件1的变形在其开口端被感应。因此，能够突然地提高冲击能量而不会有效地吸收冲击能量。

6. 发明授权

US07766651B2 Reflow furnace 失效
标题翻译：回流炉
公开(公告)号：US07766651B2
公开(公告)日：2010-08-03
申请号：US11689156
申请日：2007-03-21
申请人： Toshiyuki Asai , Motohiro Yamane , Takayuki Matsuoka , Atsushi Tanaka
发明人： Toshiyuki Asai , Motohiro Yamane , Takayuki Matsuoka , Atsushi Tanaka
IPC分类号： F27B9/04
CPC分类号： B23K1/008 , B23K2101/42
摘要： A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.
摘要翻译：回流炉包括：载体装置，用于承载安装有电子部件的印刷电路板; 加热室，其通过环境气体加热承载在其中的印刷电路板，以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备，其包括回收装置，用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分，用于将回收的环境气体加热至所需温度的加热装置，用于燃烧所含有的助熔剂组分的氧化催化剂加热环境气体和返回装置，以在燃烧到加热室之后返回高温气体。

7. 发明申请

US20070284408A1 REFLOW FURNACE 审中-公开
标题翻译：冷却炉
公开(公告)号：US20070284408A1
公开(公告)日：2007-12-13
申请号：US11755328
申请日：2007-05-30
申请人： Toshiyuki ASAI , Motohiro Yamane , Takayuki Matsuoka , Atsushi Tanaka
发明人： Toshiyuki ASAI , Motohiro Yamane , Takayuki Matsuoka , Atsushi Tanaka
IPC分类号： B23K1/012
CPC分类号： B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/08 , B23K2101/42
摘要： A reflow furnace comprises: carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, a control device to control an oxygen concentration in a high temperature gas after being burned, and a returning device to return the high temperature gas with the oxygen concentration controlled after being burned to the heating chamber.
摘要翻译：回流炉包括：载体装置，用于承载安装有电子部件的印刷电路板; 加热室，其通过环境气体加热承载在其中的印刷电路板，以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备，其包括回收装置，用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分，用于将回收的环境气体加热至所需温度的加热装置，用于燃烧所含有的助熔剂组分的氧化催化剂加热的环境气体，用于控制燃烧后的高温气体中的氧浓度的控制装置，以及返回装置，其将氧浓度返回到加热室后被控制。

8. 发明申请

US20070057020A1 FLUX COLLECTION SYSTEM 审中-公开
标题翻译：通路收集系统
公开(公告)号：US20070057020A1
公开(公告)日：2007-03-15
申请号：US11468155
申请日：2006-08-29
申请人： Motomu SHIBAMURA , Toshiyuki Asai , Takayuki Matsuoka , Takayuki Ando , Atsushi Tanaka
发明人： Motomu SHIBAMURA , Toshiyuki Asai , Takayuki Matsuoka , Takayuki Ando , Atsushi Tanaka
IPC分类号： A47J36/02
CPC分类号： B23K3/08 , B23K1/008 , B23K2101/42
摘要： A flux collection system is proposed in which in a buffering area between an inlet and a heating chamber of a reflow furnace, blowing in-furnace ambient gas to a printed circuit board from a position under a carrier device and sucking ambient gas at a lower section of the carrier device cause a device to prevent outside air from entering and ambient gas from releasing the ambient gas including flux component to be blown out from a narrowing mechanism to collide with a partition plate and promote mixture of solidified flux and liquefied flux to collect flux easily.
摘要翻译：提出一种助熔剂收集系统，其中在回流炉的入口和加热室之间的缓冲区域中，从载体装置下方的位置将炉内环境气体吹送到印刷电路板，并在下部吸入环境气体的载体装置引起装置防止外部空气进入并且环境气体释放包括助熔剂组分的环境气体从变窄机构吹出以与分隔板碰撞并促进凝固的助熔剂和液化助熔剂的混合物收集通量容易。

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