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1. 发明申请

US20090215287A1 Substrate Connecting Member and Connecting Structure 失效
标题翻译：基板连接构件和连接结构
公开(公告)号：US20090215287A1
公开(公告)日：2009-08-27
申请号：US11918121
申请日：2006-07-06
申请人： Masato Mori , Yoshihiko Yagi , Masahiro Ono , Yoshihiro Tomura , Kunio Hibino , Yasushi Nakagiri , Akihiro Miyashita , Kunio Sakurai
发明人： Masato Mori , Yoshihiko Yagi , Masahiro Ono , Yoshihiro Tomura , Kunio Hibino , Yasushi Nakagiri , Akihiro Miyashita , Kunio Sakurai
IPC分类号： H01R12/14
CPC分类号： H05K3/368 , H05K1/0271 , H05K1/144 , H05K1/145 , H05K2201/042 , H05K2201/09036 , H05K2201/09163 , H05K2201/2018
摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.
摘要翻译：衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

2. 发明授权

US07762819B2 Substrate connecting member and connecting structure 失效
标题翻译：基板连接构件和连接结构
公开(公告)号：US07762819B2
公开(公告)日：2010-07-27
申请号：US11918121
申请日：2006-07-06
申请人： Masato Mori , Yoshihiko Yagi , Masahiro Ono , Yoshihiro Tomura , Kunio Hibino , Yasushi Nakagiri , Akihiro Miyashita , Kunio Sakurai
发明人： Masato Mori , Yoshihiko Yagi , Masahiro Ono , Yoshihiro Tomura , Kunio Hibino , Yasushi Nakagiri , Akihiro Miyashita , Kunio Sakurai
IPC分类号： H01R12/00
CPC分类号： H05K3/368 , H05K1/0271 , H05K1/144 , H05K1/145 , H05K2201/042 , H05K2201/09036 , H05K2201/09163 , H05K2201/2018
摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.
摘要翻译：衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

3. 发明申请

US20080139013A1 Interconnecting Board and Three-Dimensional Wiring Structure Using it 有权
标题翻译：互连板和三维接线结构
公开(公告)号：US20080139013A1
公开(公告)日：2008-06-12
申请号：US11995339
申请日：2006-04-17
申请人： Yoshihiro Tomura , Yasushi Nakagiri , Kunio Hibino , Yoshihiko Yagi , Akihiro Miyashita , Masahiro Ono , Masato Mori
发明人： Yoshihiro Tomura , Yasushi Nakagiri , Kunio Hibino , Yoshihiko Yagi , Akihiro Miyashita , Masahiro Ono , Masato Mori
IPC分类号： H01R12/00 , H01R43/00
CPC分类号： H01R12/00 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/1627 , H01L2924/19105 , H01L2924/19106 , H05K1/0284 , H05K1/144 , H05K1/145 , H05K3/28 , H05K3/284 , H05K3/368 , H05K3/403 , H05K2201/09018 , H05K2201/09845 , H05K2201/09909 , H05K2201/10378 , H05K2201/2018 , Y10T29/49117 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.
摘要翻译：安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6）在互连板（3）上的埋设在互连板（3）的端接材料（9）中。因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

4. 发明授权

US07845954B2 Interconnecting board and three-dimensional wiring structure using it 有权
标题翻译：互连板和三维接线结构使用它
公开(公告)号：US07845954B2
公开(公告)日：2010-12-07
申请号：US11995339
申请日：2006-04-17
申请人： Yoshihiro Tomura , Yasushi Nakagiri , Kunio Hibino , Yoshihiko Yagi , Akihiro Miyashita , Masahiro Ono , Masato Mori
发明人： Yoshihiro Tomura , Yasushi Nakagiri , Kunio Hibino , Yoshihiko Yagi , Akihiro Miyashita , Masahiro Ono , Masato Mori
IPC分类号： H01R12/00
CPC分类号： H01R12/00 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/1627 , H01L2924/19105 , H01L2924/19106 , H05K1/0284 , H05K1/144 , H05K1/145 , H05K3/28 , H05K3/284 , H05K3/368 , H05K3/403 , H05K2201/09018 , H05K2201/09845 , H05K2201/09909 , H05K2201/10378 , H05K2201/2018 , Y10T29/49117 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.
摘要翻译：安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6）在互连板（3）上的埋设在互连板（3）的端接材料（9）中。因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

5. 发明申请

US20100187675A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100187675A1
公开(公告)日：2010-07-29
申请号：US12692872
申请日：2010-01-25
申请人： Kazumichi Shimizu , Yoshihiro Tomura , Masahiro Ono
发明人： Kazumichi Shimizu , Yoshihiro Tomura , Masahiro Ono
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L21/563 , H01L21/561 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/1815 , H01L2924/00 , H01L2224/0401
摘要： This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.
摘要翻译：该半导体装置是将半导体元件倒装芯片安装在电路基板上的半导体装置，半导体元件被密封树脂覆盖并密封。在与半导体元件的安装表面相对的表面上的密封树脂中形成凹部。通过该凹部的作用可以减小半导体器件的翘曲。

6. 发明授权

US08207618B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08207618B2
公开(公告)日：2012-06-26
申请号：US12692872
申请日：2010-01-25
申请人： Kazumichi Shimizu , Yoshihiro Tomura , Masahiro Ono
发明人： Kazumichi Shimizu , Yoshihiro Tomura , Masahiro Ono
IPC分类号： H01L23/28
CPC分类号： H01L21/563 , H01L21/561 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/1815 , H01L2924/00 , H01L2224/0401
摘要： This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.
摘要翻译：该半导体装置是将半导体元件倒装芯片安装在电路基板上的半导体装置，半导体元件被密封树脂覆盖并密封。在与半导体元件的安装表面相对的表面上的密封树脂中形成凹部。通过该凹部的作用可以减小半导体器件的翘曲。

7. 发明授权

US07985078B2 Electrode junction structure and manufacturing method thereof 有权
标题翻译：电极结结构及其制造方法
公开(公告)号：US07985078B2
公开(公告)日：2011-07-26
申请号：US12644571
申请日：2009-12-22
申请人： Kentaro Kumazawa , Masahiro Ono , Yoshihiro Tomura
发明人： Kentaro Kumazawa , Masahiro Ono , Yoshihiro Tomura
IPC分类号： H01R12/00
CPC分类号： H01R13/52 , H05K1/142 , H05K3/284 , H05K3/361 , H05K2201/10977
摘要： The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.
摘要翻译：电极结结构包括：玻璃基板; 多个柔性基板在平面图中布置成跨过玻璃基板的边缘并且被布置成沿着边缘彼此具有空间; 用于接合玻璃基板和每个柔性基板的粘合剂; 以及密封树脂，用于覆盖玻璃基板和每个柔性基板之间的接合部分，其中形成密封树脂的边缘，使得密封树脂的边缘在平面图中具有连续的波形部分，其中凸部并且与假想线交替的凹部作为中心轴，所述假想线平行于所述玻璃基板的边缘并位于所述玻璃基板的边缘的外侧，并且其中所述凸部形成为位于所述柔性底物。

8. 发明申请

US20050168961A1 Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效
标题翻译：立体电子电路装置，其中使用的继电器板和继电器框架
公开(公告)号：US20050168961A1
公开(公告)日：2005-08-04
申请号：US10985325
申请日：2004-11-10
申请人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
发明人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
IPC分类号： H01L23/538 , H01L25/065 , H05K1/00 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H05K3/40 , H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译：立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

9. 发明授权

US07613010B2 Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效
标题翻译：立体电子电路装置，其中使用的继电器板和继电器框架
公开(公告)号：US07613010B2
公开(公告)日：2009-11-03
申请号：US10985325
申请日：2004-11-10
申请人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
发明人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译：立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

10. 发明授权

US07896657B2 Circuit device, circuit device manufacturing method and connecting member 失效
标题翻译：电路装置，电路装置制造方法及连接部件
公开(公告)号：US07896657B2
公开(公告)日：2011-03-01
申请号：US12442341
申请日：2006-09-22
申请人： Masahiro Ono , Hiroyuki Suzuki , Haruo Hayakawa , Iwao Matuura , Akihiro Miyashita
发明人： Masahiro Ono , Hiroyuki Suzuki , Haruo Hayakawa , Iwao Matuura , Akihiro Miyashita
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： H05K3/368 , H05K2201/042 , H05K2201/10378 , H05K2201/2018
摘要： A circuit device which can form terminal portions at narrow pitches a manufacturing method of the circuit device, and a connecting member are provided. A circuit device 10 includes: a first printed circuit board 11 and a second printed circuit board 15 which are arranged along the thickness direction of substrates 12, 16; and a connecting member 20 which is interposed between the first printed circuit board 11 and the second printed circuit board 15. The first printed circuit board 11 and the second printed circuit board 15 are electrically connected with each other by terminal portions 21 formed on the connecting member 20. The circuit device 10 integrally forms the terminal portions 21 on a frame body 25 by plating.
摘要翻译：提供可以以窄间距形成端子部分的电路装置，电路装置的制造方法和连接构件。电路装置10包括：沿着基板12,16的厚度方向布置的第一印刷电路板11和第二印刷电路板15; 以及连接构件20，其插入在第一印刷电路板11和第二印刷电路板15之间。第一印刷电路板11和第二印刷电路板15通过形成在连接件上的端子部分21彼此电连接电路装置10通过电镀在框体25上一体地形成端子部21。

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