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1. 发明授权

US07759784B2 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules 失效
标题翻译： 3D电路模块，由其形成的多层3D电路模块，使用电路模块的移动终端装置和用于制造电路模块的方法
公开(公告)号：US07759784B2
公开(公告)日：2010-07-20
申请号：US11196269
申请日：2005-08-04
申请人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida
发明人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida
IPC分类号： H01L23/02
CPC分类号： H05K1/183 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1064 , H01L2924/1627 , H01L2924/3511 , H05K2201/0382 , H05K2201/10674 , H05K2201/2018 , H05K2203/0278
摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.
摘要翻译：通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。

2. 发明授权

US07355126B2 Electronic parts packaging method and electronic parts package 失效
标题翻译：电子零件包装方法和电子零件包装
公开(公告)号：US07355126B2
公开(公告)日：2008-04-08
申请号：US10311476
申请日：2001-06-14
申请人： Hidenobu Nishikawa , Kazuto Nishida , Kazumichi Shimizu , Shuji Ono , Hiroyuki Otani
发明人： Hidenobu Nishikawa , Kazuto Nishida , Kazumichi Shimizu , Shuji Ono , Hiroyuki Otani
IPC分类号： H05K1/16
CPC分类号： H01L24/32 , H01L21/563 , H01L23/3142 , H01L24/06 , H01L24/14 , H01L24/29 , H01L24/81 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06136 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/26145 , H01L2224/26175 , H01L2224/27013 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/81136 , H01L2224/81191 , H01L2224/81801 , H01L2224/83051 , H01L2224/83192 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要： An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.
摘要翻译：电子部件和电路形成用物品通过含有树脂的接合材料接合在一起。在电子部件接合区域和电路形成用品的电极的凸点相互电接触的状态下，电子部件和电路形成用品在接合材料固化时彼此热压接合。电子部件接合区域的接合材料流动调节部件在电路形成物品与电子部件接合期间调节接合材料向电子部件接合区域的周边部分的流动。

3. 发明申请

US20060038274A1 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules 失效
标题翻译： 3D电路模块，由其形成的多层3D电路模块，使用电路模块的移动终端装置和用于制造电路模块的方法
公开(公告)号：US20060038274A1
公开(公告)日：2006-02-23
申请号：US11196269
申请日：2005-08-04
申请人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida
发明人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida
IPC分类号： H01L23/02
CPC分类号： H05K1/183 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1064 , H01L2924/1627 , H01L2924/3511 , H05K2201/0382 , H05K2201/10674 , H05K2201/2018 , H05K2203/0278
摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.
摘要翻译：通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。

4. 发明申请

US20050260867A1 Board connecting component and three-dimensional connecting structure using thereof 失效
标题翻译：板连接部件及其三维连接结构
公开(公告)号：US20050260867A1
公开(公告)日：2005-11-24
申请号：US11118403
申请日：2005-05-02
申请人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
发明人： Masahiro Ono , Shigeru Kondou , Kazuhiro Nishikawa , Kazuto Nishida , Hiroyuki Inoue , Osamu Miyazaki , Hiroshi Takeda , Tsuneyuki Ejima
IPC分类号： H01R12/00 , H01R13/24 , H01R33/76 , H05K1/14
CPC分类号： H05K1/144 , H01L2224/16225 , H01L2924/19105 , H01R12/52 , H05K3/3426 , H05K2201/042 , H05K2201/10189 , H05K2201/10424 , H05K2201/2018
摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.
摘要翻译：本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开。

5. 发明申请

US20050224974A1 Electronic component mounting method and apparatus 审中-公开
公开(公告)号：US20050224974A1
公开(公告)日：2005-10-13
申请号：US11150383
申请日：2005-06-13
申请人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
发明人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
IPC分类号： H01L21/60 , H05K3/32 , H01L23/52 , H01L21/44
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/2949 , H01L2224/29499 , H01L2224/32225 , H01L2224/45144 , H01L2224/48624 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81048 , H01L2224/81191 , H01L2224/81801 , H01L2224/81903 , H01L2224/83048 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83856 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , Y10T29/4913 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

6. 发明申请

US20050093172A1 Electronic circuit device, and method and apparatus for manufacturing the same 审中-公开
标题翻译：电子电路装置及其制造方法和装置
公开(公告)号：US20050093172A1
公开(公告)日：2005-05-05
申请号：US10959324
申请日：2004-10-07
申请人： Norihito Tsukahara , Kazuhiro Nishikawa , Kazuto Nishida
发明人： Norihito Tsukahara , Kazuhiro Nishikawa , Kazuto Nishida
IPC分类号： B42D15/10 , G06K19/077 , H01L21/56 , H01L21/60 , H01L23/29 , H01L23/31 , H01L23/498 , H05K3/28 , H01L21/48 , H01L23/52
CPC分类号： G06K19/07718 , G06K19/07728 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/81 , H01L2224/1134 , H01L2224/16225 , H01L2224/16238 , H01L2224/73204 , H01L2224/81191 , H01L2224/81395 , H01L2224/83192 , H01L2224/8388 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H05K3/281 , H05K3/284 , H01L2924/00
摘要： An electronic circuit device has a substrate having a wiring pattern, an electronic component electrically connected to a terminal section of the wiring pattern by contacting a projection electrode with it, a cover that is disposed at a position facing the substrate and grapples the electronic component between it and the substrate, and a resin layer made of thermoplastic resin filled in a gap between the substrate and the cover. The gap includes a space in a connection region except an electric connection part between the projection electrode and the terminal section. The electronic component is adhered to the substrate and the substrate is adhered to the cover through the resin layer. Thus, the electronic circuit device having high connection reliability and high mass productivity, and a method and apparatus for manufacturing the electronic circuit device can be provided.
摘要翻译：电子电路器件具有布线图案的基板，通过与突起电极接触而与布线图案的端子部分电连接的电子部件，设置在面向基板的位置并且将电子部件与第二电路部件之间抓握的盖以及填充在基板和盖之间的间隙中的由热塑性树脂制成的树脂层。间隙包括除了突起电极和端子部之间的电连接部分以外的连接区域中的空间。电子部件粘附到基板上，并且基板通过树脂层粘附到盖上。因此，可以提供具有高连接可靠性和高质量生产率的电子电路装置，以及用于制造电子电路装置的方法和装置。

7. 发明授权

US5917156A Circuit board having electrodes and pre-deposit solder receiver 失效
标题翻译：具有电极和预沉积焊料接收器的电路板
公开(公告)号：US5917156A
公开(公告)日：1999-06-29
申请号：US521047
申请日：1995-08-29
申请人： Kazuhiro Nobori , Kazuto Nishida , Norihito Tsukahara
发明人： Kazuhiro Nobori , Kazuto Nishida , Norihito Tsukahara
IPC分类号： H01R43/02 , H05K1/11 , H05K3/24 , H05K3/34 , H05K3/36 , H01R9/09
CPC分类号： H05K3/3421 , H05K3/363 , H01R12/7076 , H01R43/0256 , H05K1/11 , H05K2201/0394 , H05K2201/10681 , H05K2203/0126 , H05K2203/0195 , H05K3/3489 , Y02P70/613
摘要： Copper electrodes are formed on a circuit board to be bonded with leads of a TAB driving liquid crystal. A pre-deposit solder receiver having solder printed thereon is also provided on the circuit board in alignment with and prior to an electrode to be first bonded with a lead, to form a sufficient solder pool between plural electrodes and a bottom wall of a soldering iron. Solder/bonding is accordingly realized efficiently even from a starting electrode E1. Also, an excessive solder receiver may be provided in alignment with and after an electrode to be last bonded with a lead.
摘要翻译：铜电极形成在与TAB驱动液晶的引线接合的电路板上。在其上印刷有焊料的预沉积焊料接收器也在电路板上设置，以与首先与引线接合的电极对齐并在其之前，以在多个电极和烙铁底壁之间形成足够的焊料池。因此，即使从起动电极E1而有效地实现焊接/接合。此外，可以提供与最后与铅接合的电极对准和之后的过量焊料接收器。

8. 发明授权

US07960828B2 Carrier frame for electronic components and production method for electronic components 有权
标题翻译：电子元件载体框架及电子零件的生产方法
公开(公告)号：US07960828B2
公开(公告)日：2011-06-14
申请号：US12246021
申请日：2008-10-06
申请人： Toshihiko Satou , Kazuhiko Takahashi , Kazuto Nishida , Satoru Waga
发明人： Toshihiko Satou , Kazuhiko Takahashi , Kazuto Nishida , Satoru Waga
IPC分类号： H01L23/34 , H01L23/02
CPC分类号： H01L21/67333 , G01R31/2893 , H01L2924/0002 , H01L2924/00
摘要： The carrier frame relating to the present invention comprises a base layer member, a frame layer member, and a positioning layer member having multiple openings for storing electronic components. A spring layer member is mounted in a hollow part surrounded by the frame layer member between the positioning layer member and the base layer member. At each opening of the spring layer member, a small spring providing an elastic force for fastening the electronic components between an edge of the corresponding opening of the positioning layer member and the small spring is formed integrally with the spring layer member. At one end in the longitudinal direction of the spring layer member, a large spring providing an elastic force along the longitudinal direction by being in contact with an inner surface of the frame layer member in the mounted state is formed integrally with the spring layer member.
摘要翻译：本发明的载体框架包括基层构件，框架层构件和具有用于存储电子部件的多个开口的定位层构件。弹性层构件安装在由定位层构件和基层构件之间的框架层构件包围的中空部中。在弹簧层构件的每个开口处，提供用于将电子部件紧固在定位层构件的相应开口的边缘与小弹簧之间的弹性力的小弹簧与弹簧层构件一体地形成。在弹簧层部件的长度方向的一端，通过与安装状态的框架部件的内表面接触而沿着长度方向提供弹性力的大弹簧与弹簧层部件一体形成。

9. 发明申请

US20070164079A1 Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method 审中-公开
标题翻译：电子元件安装方法，电路基板和电路基板单元
公开(公告)号：US20070164079A1
公开(公告)日：2007-07-19
申请号：US10597949
申请日：2005-02-24
申请人： Masato Mori , Hiroaki Onishi , Masato Hirano , Kazuto Nishida
发明人： Masato Mori , Hiroaki Onishi , Masato Hirano , Kazuto Nishida
IPC分类号： A47J36/02
CPC分类号： H05K3/3442 , H05K3/284 , H05K3/305 , H05K3/341 , H05K3/3436 , H05K3/3484 , H05K2201/10636 , H05K2201/10689 , H05K2201/10977 , H05K2203/0568 , H05K2203/1105 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting method comprising: supplying an unhardened reinforcing resin on a circuit substrate; supplying a solder paste on bond areas of the circuit substrate on which electrodes of the electronic components are to be bonded; placing the electronic components on the circuit substrate; and heating and then cooling the circuit substrate with the reinforcing resin, the solder paste, and the electronic components carried thereon. The mounting method enables mounting of components with high joint reliability, while incorporating the conventional surface mount process steps. The method may also be applied to the mounting of smaller electronic components with narrower pitch without deteriorating productivity or mounting quality.
摘要翻译：一种电子部件安装方法，包括：在电路基板上提供未硬化的增强树脂; 在所述电路基板的要与所述电子部件的电极接合的接合区域上供给焊膏; 将电子部件放置在电路基板上; 然后用加强树脂，焊膏和载体上的电子部件加热然后冷却电路基板。安装方法能够在结合常规的表面贴装工艺步骤的同时以高接头可靠性安装部件。该方法还可以用于安装较窄间距的较小电子部件，而不会降低生产率或安装质量。

10. 发明申请

US20070062558A1 Apparatus and method for surface treatment to substrate 失效
标题翻译：用于表面处理至衬底的装置和方法
公开(公告)号：US20070062558A1
公开(公告)日：2007-03-22
申请号：US11598067
申请日：2006-11-13
申请人： Naoki Suzuki , Kazuto Nishida , Kazuyuki Tomita
发明人： Naoki Suzuki , Kazuto Nishida , Kazuyuki Tomita
IPC分类号： B08B6/00 , H01B13/00
CPC分类号： H05K3/26 , H01J37/32009 , H01J37/32935 , H01J37/3299 , H05K3/323 , H05K2203/095
摘要： An apparatus and a method for surface treatment of substrates whereby the quality of substrates can be maintained by preventing excessive plasma treatment of substrates. In carrying out the plasma treatment on a surface of the substrate in a reaction chamber, there are provided an emission spectroscopic analysis device or a mass analyzer, and a controller, so that the energy of ions in plasma is controlled to decrease when, e.g., bromine included in the substrate is detected, and the surface treatment to the substrate is controlled to stop when the removal of impurities of the substrate is detected to end. The bromine once separated from the substrate is prevented from adhering again to the substrate and corroding the substrate. Moreover, ions are prevented from being excessively irradiated to the substrate when the removal of impurities ends, thereby reducing damage to the substrate.
摘要翻译：用于表面处理基板的装置和方法，由此通过防止基板的过度等离子体处理可以保持基板的质量。在反应室中对基板的表面进行等离子体处理时，设置有发光光谱分析装置或质量分析装置以及控制器，使得等离子体中的离子的能量被控制为减少，例如，检测包含在基板中的溴，并且当检测到去除基板的杂质结束时，控制对基板的表面处理以停止。与基板分离的溴被防止再次粘附到基板上并腐蚀基板。此外，当去除杂质结束时，防止离子过度照射到基板，从而减少对基板的损坏。

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