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    • 2. 发明申请
    • Semiconductor Device
    • 半导体器件
    • US20110275184A1
    • 2011-11-10
    • US13184116
    • 2011-07-15
    • Reika ICHIHARAYoshinori TSUCHIYAMasato KOYAMAAkira NISHIYAMA
    • Reika ICHIHARAYoshinori TSUCHIYAMasato KOYAMAAkira NISHIYAMA
    • H01L21/8238
    • H01L21/823857H01L21/823462
    • A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode formed on the first dielectric and formed of one metal element selected from Ti, Zr, Hf, Ta, Sc, Y, a lanthanoide and actinide series and of one selected from boride, silicide and germanide compounds of the one metal element, and a pMISFET formed on the substrate, the pMISFET including a second dielectric formed on the substrate and a second metal gate electrode formed on the second dielectric and made of the same material as that of the first metal gate electrode, at least a portion of the second dielectric facing the second metal gate electrode being made of an insulating material different from that of at least a portion of the first dielectric facing the first metal gate electrode.
    • 半导体器件包括半导体衬底,形成在衬底上的nMISFET,nMISFET包括形成在衬底上的第一电介质和形成在第一电介质上的第一金属栅极,并由选自Ti,Zr,Hf, Ta,Sc,Y,镧系元素和锕系和选自所述一种金属元素的硼化物,硅化物和锗化合物的一种,以及形成在所述衬底上的pMISFET,所述pMISFET包括形成在所述衬底上的第二电介质和第二金属 栅电极形成在第二电介质上并由与第一金属栅电极相同的材料制成,第二电介质面向第二金属栅电极的至少一部分由绝缘材料制成,绝缘材料与至少一部分 的第一电介质面向第一金属栅电极。
    • 8. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20070190704A1
    • 2007-08-16
    • US11736261
    • 2007-04-17
    • Masato KOYAMAAkira NishiyamaYuuichi Kamimuta
    • Masato KOYAMAAkira NishiyamaYuuichi Kamimuta
    • H01L21/84H01L21/00
    • H01L21/823814H01L21/823864
    • A semiconductor device includes a silicon substrate, a channel region formed in a surface of the silicon substrate, a gate insulating film formed on the channel region, a gate electrode formed on the gate insulating film, first gate side walls formed on the gate insulating film to sandwich the gate electrode in a gate length direction, second gate side walls which sandwich the gate electrode and the first gate side wall, first diffused layers formed on the surface of the silicon substrate to sandwich the channel region, second diffused layers which sandwich the channel region and the first diffused layer and have a larger depth than that of the first diffused layer, and low resistance layers which are formed between the first diffused layer and the second gate side wall and contain nitride, boride or carbide of Ti, Zr, Hf or Ta.
    • 半导体器件包括硅衬底,形成在硅衬底的表面中的沟道区,形成在沟道区上的栅极绝缘膜,形成在栅极绝缘膜上的栅极,形成在栅极绝缘膜上的第一栅极侧壁 夹着栅极电极和第一栅极侧壁的第二栅极侧壁,形成在硅衬底的表面上以夹持沟道区域的第一扩散层,夹着所述栅极电极和第二栅极侧壁的第二扩散层, 沟道区域和第一扩散层,并且具有比第一扩散层的深度更大的深度,以及形成在第一扩散层和第二栅极侧壁之间的低电阻层,并且包含Ti,Zr的氮化物,硼化物或碳化物, Hf或Ta。