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1. 发明授权

US07207868B2 Cutting apparatus 失效
标题翻译：切割设备
公开(公告)号：US07207868B2
公开(公告)日：2007-04-24
申请号：US11522447
申请日：2006-09-18
申请人： Masataka Takehara , Masaharu Yoshida , Yasuyuki Kitagawa , Kazuyuki Kishimoto , Kiyoharu Kato
发明人： Masataka Takehara , Masaharu Yoshida , Yasuyuki Kitagawa , Kazuyuki Kishimoto , Kiyoharu Kato
IPC分类号： B24B1/00
CPC分类号： B24C1/045 , B24C3/04
摘要： A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.
摘要翻译：切割装置在高压下喷射含有磨粒的水，以沿相交方向延伸的切割线切割工件。切割装置包括：固定工件的固定台; 在切割线下方的各个位置设置在固定台中的槽部; 设置在固定台的除了设置槽部的区域以外的区域的突出部分以工件与突出部分接触的方式; 支撑部分，用于将所述突出部分基本上平行于沿着所述凹槽部分延伸Y方向的切割线; 框架部分，其设置成在固定台的外周的至少一部分中将支撑部彼此连接; 以及可附接和可拆卸地设置以覆盖支撑部分的保护构件。因此，在沿着相交的切割线切割工件的情况下，不需要更换固定工件的固定台，并且防止了固定台的磨损。

2. 发明申请

US20070066190A1 CUTTING APPARATUS 失效
标题翻译：切割装置
公开(公告)号：US20070066190A1
公开(公告)日：2007-03-22
申请号：US11522447
申请日：2006-09-18
申请人： Masataka Takehara , Masaharu Yoshida , Yasuyuki Kitagawa , Kiyoharu Kato
发明人： Masataka Takehara , Masaharu Yoshida , Yasuyuki Kitagawa , Kiyoharu Kato
IPC分类号： B24C3/00
CPC分类号： B24C1/045 , B24C3/04
摘要： A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.
摘要翻译：切割装置在高压下喷射含有磨粒的水，以沿相交方向延伸的切割线切割工件。切割装置包括：固定工件的固定台; 在切割线下方的各个位置设置在固定台中的槽部; 设置在固定台的除了设置槽部的区域以外的区域的突出部分以工件与突出部分接触的方式; 支撑部分，用于将所述突出部分基本上平行于沿着所述凹槽部分延伸Y方向的切割线; 框架部分，其设置成在固定台的外周的至少一部分中将支撑部彼此连接; 以及可附接和可拆卸地设置以覆盖支撑部分的保护构件。因此，在沿着相交的切割线切割工件的情况下，不需要更换固定工件的固定台，并且防止了固定台的磨损。

3. 发明授权

US5305944A Bonding method and bonding apparatus 失效
标题翻译：接合方法和接合装置
公开(公告)号：US5305944A
公开(公告)日：1994-04-26
申请号：US40249
申请日：1993-03-30
申请人： Masaharu Yoshida , Yasufumi Nakasu , Masataka Takehara
发明人： Masaharu Yoshida , Yasufumi Nakasu , Masataka Takehara
IPC分类号： B23K1/005 , H01L21/00 , H01L21/60 , H05K3/34
CPC分类号： H01L24/81 , B23K1/0053 , H01L21/67144 , H01L24/75 , B23K2201/40 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/75753 , H01L2224/81191 , H01L2224/81224 , H01L2224/8123 , H01L2224/81801 , H01L2224/86214 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01024 , H01L2924/01033 , H01L2924/01051 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12042
摘要： A bonding apparatus according to the present invention bonds a semiconductor chip to a conductive member in the face-down style without heating the semiconductor chip. The semiconductor chip which consists essentially of silicon is placed on leads which are put on a TAB tape. A glass plate member is mounted on the semiconductor chip. An infrared light beam is irradiated onto the semiconductor chip from above the semiconductor chip. Transmitted by the semiconductor chip, the infrared light beam illuminates bumps. As a result, the bumps heat up and melt. Since the semiconductor chip does not absorb the infrared light beam, bonding of the semiconductor chip to the leads does not cause a rise in temperature of the semiconductor chip. The bonding apparatus according to the present invention makes the face-down style bonding possible.
摘要翻译：根据本发明的接合装置将半导体芯片以面朝下的形式粘合到导电构件而不加热半导体芯片。基本上由硅组成的半导体芯片放置在放在TAB带上的引线上。玻璃板构件安装在半导体芯片上。红外光束从半导体芯片上方照射到半导体芯片上。由半导体芯片传输，红外光束照亮凸起。结果，凸块加热并熔化。由于半导体芯片不吸收红外光束，所以半导体芯片与引线的接合不会导致半导体芯片的温度上升。根据本发明的接合装置使得面朝下的接合成为可能。

4. 发明授权

US5606182A Optical semiconductor device for optical communications with increased positional accuracy of an optical access and method of fabricating the same 失效
标题翻译：用于光通信的光学半导体器件，其具有增加的光学访问的位置精度及其制造方法
公开(公告)号：US5606182A
公开(公告)日：1997-02-25
申请号：US428369
申请日：1995-04-25
申请人： Masaharu Yoshida , Masataka Takehara
发明人： Masaharu Yoshida , Masataka Takehara
IPC分类号： H01S5/00 , G02B6/32 , G02B6/36 , G02B6/42 , H01L31/0203 , H01L31/167 , H01L33/00 , H01L27/14 , H01L31/0232
CPC分类号： H01L31/167 , G02B6/4204 , G02B6/4245 , G02B6/4257 , G02B6/4274 , G02B6/4292 , H01L31/0203 , G02B6/322 , G02B6/4238 , H01L2224/48247 , H01L2224/48465
摘要： In order to position an optical semiconductor element in high accuracy and to readily fabricate the same, step is formed on an upper surface of a forward end of an electrode (123) projecting from a lead frame. A submount (102) is previously soldered to a lower stage surface (125), while solder (172) is applied to its upper surface. A collet (61) which is softly supported by a spring (63) in the vertical direction suctionally holds a laser diode element (101) and approaches the electrode (123) from above, to be stopped when its leg portion (61b) comes into contact with an upper stage surface (126). Thus, the laser diode element (101) is precisely positioned. In this state, the solder (172) is heated and cooled, to solder the laser diode element (101) to the submount (102). The laser diode element (101) molded with transparent resin, to be easy to fabricate.
摘要翻译：为了高精度地定位光学半导体元件并且容易地制造光学半导体元件，在从引线框架突出的电极（123）的前端的上表面上形成台阶。预先将底座（102）焊接到下层表面（125），而将焊料（172）施加到其上表面。在垂直方向上由弹簧（63）轻柔地支撑的夹头（61）从其上方抽吸地保持激光二极管元件（101）并从上方接近电极（123），以在其脚部（61b）进入时停止与上级表面（126）接触。因此，激光二极管元件（101）被精确定位。在这种状态下，焊料（172）被加热和冷却，以将激光二极管元件（101）焊接到基座（102）。用透明树脂模制的激光二极管元件（101）易于制造。

5. 发明授权

US5500502A Bonding method and apparatus 失效
标题翻译：粘合方法和装置
公开(公告)号：US5500502A
公开(公告)日：1996-03-19
申请号：US082500
申请日：1993-06-28
申请人： Manabu Horita , Masaharu Yoshida , Masataka Takehara
发明人： Manabu Horita , Masaharu Yoshida , Masataka Takehara
IPC分类号： B23K26/00 , B23K26/03 , G01N21/88 , G01N21/956 , G05D23/27 , H01L21/60
CPC分类号： H01L24/81 , B23K26/032 , B23K26/0648 , B23K26/0665 , G05D23/1917 , G05D23/27 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81224 , H01L2224/81801 , H01L2224/86214 , H01L2924/01005 , H01L2924/01033 , H01L2924/01068 , H01L2924/01077 , H01L2924/01082 , H01L2924/12042
摘要： An apparatus for bonding lead terminals to bumps of a semiconductor chip by using a laser beam. On the basis of a temperature signal obtained from irradiation of a lead terminal and a bump to be bonded together under irradiation of the laser beam, state of contact and the bond between the bump and the lead terminal are decided. The bonding between the terminals and the bumps can be realized without fail by checking the state of contact therebetween in precedence to the bonding operation.
摘要翻译：一种用于通过使用激光束将引线端子接合到半导体芯片的凸块的装置。基于在激光束的照射下从引线端子和要接合的凸块获得的温度信号，确定接触状态和凸块与引线端子之间的接合。通过优先检查接合操作之间的接触状态，可以不失败地实现端子与凸点之间的接合。

6. 发明授权

US5564188A Rolling guide unit production process 失效
标题翻译：滚动导向单元生产工艺
公开(公告)号：US5564188A
公开(公告)日：1996-10-15
申请号：US600480
申请日：1996-02-13
申请人： Tsuneo Akasako , Masaharu Yoshida
发明人： Tsuneo Akasako , Masaharu Yoshida
IPC分类号： F16C29/00 , F16C29/06 , F16C33/20 , F16C33/64 , F16C33/00
CPC分类号： F16C29/064 , F16C29/005 , F16C29/0602 , F16C29/0633 , F16C33/20 , F16C33/64 , Y10T29/49641 , Y10T29/49705 , Y10T29/4971 , Y10T29/4984
摘要： The present invention relates to a rolling guide unit wherein spatter scattered as a result of arc welding, gas welding and so forth does not adhere to the track rail.The effect is obtained by forming a fluororesin coating layer on the surface of the track rail.
摘要翻译：本发明涉及一种滚动导向单元，其中由于电弧焊，气体焊接等而散射的飞溅物不粘附到轨道轨道上。该效果通过在轨道轨道的表面上形成氟树脂涂层而获得。

7. 发明授权

US5116670A Allyl ester resin composition and laminated sheet using the same 失效
标题翻译： ALLYLESTER树脂组合物和使用它的层压板
公开(公告)号：US5116670A
公开(公告)日：1992-05-26
申请号：US589578
申请日：1990-09-28
申请人： Noboru Suzuki , Masaharu Yoshida , Satoshi Noda , Minoru Takaishi , Kenichiro Takiguchi , Hiroshi Uchida , Takeshi Onoda
发明人： Noboru Suzuki , Masaharu Yoshida , Satoshi Noda , Minoru Takaishi , Kenichiro Takiguchi , Hiroshi Uchida , Takeshi Onoda
IPC分类号： C08F299/04 , C08J5/06 , C08J5/24 , H05K1/03 , H05K3/38
CPC分类号： C08J5/24 , C08F299/0485 , C08J5/06 , H05K1/0366 , C08J2367/07 , H05K2201/0145 , H05K2201/0166 , H05K2201/0284 , H05K2201/0293 , H05K3/386 , Y10S428/901 , Y10T428/31522 , Y10T428/3162 , Y10T428/31652 , Y10T428/31681 , Y10T428/31688 , Y10T428/31703 , Y10T428/3179 , Y10T428/31794 , Y10T442/3415
摘要： Resin compositions for laminated sheets and laminated sheets produced therefrom are disclosed, the compositions comprising at least one allyl ester resin composed of a polybasic acid and a polyhydric alcohol, wherein an allyl ester group of said resin is bonded to at least one of terminals thereof.

8. 发明授权

US3934056A Resin compositions of high adhesivity comprising E/VA copolymer, chlorinated or chlorosulfonated polyethylene, an unsaturated acid and a peroxy compound 失效
标题翻译：包含E / VA共聚物，氯化或氯磺化聚乙烯，不饱和酸和过氧化合物的高粘合性树脂组合物
公开(公告)号：US3934056A
公开(公告)日：1976-01-20
申请号：US527428
申请日：1974-11-26
申请人： Masaharu Yoshida , Shigenobu Ishihara , Tsuyoshi Takahashi , Hiroki Imakura
发明人： Masaharu Yoshida , Shigenobu Ishihara , Tsuyoshi Takahashi , Hiroki Imakura
IPC分类号： C08F255/02 , C09J123/08 , C09J123/28 , C09J123/34 , C08L23/08 , C08L23/28
CPC分类号： C09J123/286 , C08F255/02 , C09J123/08 , C09J123/34
摘要： Resin compositions of high adhesivity which comprise (A) ethylene-vinylacetate copolymer or mixture of said copolymer with polyethylene, (B) chlorinated or chlorosulfonated polyethylene, (C) unsaturated carboxylic acids maintaining solid at room temperature and (D) organic peroxides or these components blended with phenolic compounds and/or acid-acceptors.
摘要翻译：高粘合性的树脂组合物，其包含（A）乙烯 - 乙酸乙烯酯共聚物或所述共聚物与聚乙烯的混合物，（B）氯化或氯磺化聚乙烯，（C）在室温下保持固体的不饱和羧酸和（D）有机过氧化物或这些组分与酚类化合物和/或酸受体共混。

9. 发明授权

US08603552B2 Method for producing foods from culture of Bacillus natto 有权
标题翻译：从纳豆芽孢杆菌培养物生产食物的方法
公开(公告)号：US08603552B2
公开(公告)日：2013-12-10
申请号：US11296942
申请日：2005-12-08
申请人： Shinsaku Takaoka , Masaharu Yoshida
发明人： Shinsaku Takaoka , Masaharu Yoshida
IPC分类号： A23L1/10
CPC分类号： A23L33/15
摘要： A method for producing a food product containing nattokinase but containing little or none vitamin K2, comprising treating a Bacillus natto culture or culture supernatant with at least one coagulant selected from the group consisting of an inorganic coagulant and a cationic polymer coagulant (excluding chitosan). As the inorganic coagulant, calcium chloride or poly aluminum chloride is preferable, and their mixtures with a phosphorus coagulant are also preferably used. As the cationic polymer coagulant, cationic polysaccharides, hexamethylenediamine/ephichlorohydrin polycondensates or dimethylamine/epichlorohydrin polycondensates are preferably used, and their mixtures with a polyacrylate are also preferably used.
摘要翻译：一种含有纳豆激酶但含有很少或不含有维生素K2的食品的方法，包括用至少一种选自无机凝结剂和阳离子聚合物凝结剂（不包括壳聚糖）的凝结剂处理纳豆芽孢杆菌培养物或培养上清液。作为无机凝结剂，优选使用氯化钙或聚氯化铝，也优选使用与磷混凝剂的混合物。作为阳离子聚合物凝结剂，优选使用阳离子多糖，六亚甲基二胺/对氯醇缩聚物或二甲胺/表氯醇缩聚物，并且优选使用它们与聚丙烯酸酯的混合物。

10. 发明授权

US08468221B2 Network configuration method 有权
标题翻译：网络配置方法
公开(公告)号：US08468221B2
公开(公告)日：2013-06-18
申请号：US12784166
申请日：2010-05-20
申请人： Takashi Saegusa , Terunobu Funatsu , Manabu Okamoto , Ikuo Takemura , Masaharu Yoshida , Hideyuki Kamasuka
发明人： Takashi Saegusa , Terunobu Funatsu , Manabu Okamoto , Ikuo Takemura , Masaharu Yoshida , Hideyuki Kamasuka
IPC分类号： G06F15/177
CPC分类号： H04L41/0803 , H04L61/2038
摘要： A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.
摘要翻译：网络I / O系统包括具有通信端口的中央通信单元和具有上游通信端口和多个下游端口的多个终端通信单元，其中中央通信单元向终端通信单元发送路由数据中央通信单元到终端通信单元，用于设置终端通信单元中的识别号码和终端通信单元的识别号码的数据，终端通信单元参考要发送到下游通信端口的数据并设置识别号码在目标终端通信单元中，并且下行通信端口的通信端口号被附加到在通过终端通信单元时从终端通信单元发送到中央通信单元的路由识别数据，从而识别网络c 配置

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