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1. 发明授权

US06533245B2 Valve device 失效
公开(公告)号：US06533245B2
公开(公告)日：2003-03-18
申请号：US09968545
申请日：2001-10-02
申请人： Masao Takemoto , Masakazu Hirano , Kazuhiko Watanabe , Teruyuki Hotta , Shigeji Ohishi
发明人： Masao Takemoto , Masakazu Hirano , Kazuhiko Watanabe , Teruyuki Hotta , Shigeji Ohishi
IPC分类号： F16K3164
CPC分类号： F25B41/062 , F25B47/003 , F25B2341/0683
摘要： A valve device including a main body formed with a passage for allowing a refrigerant to flow therethrough; and a valve member provided in the passage. The main body includes an aluminum alloy containing 0.2 to 1.5 weight % of Si; 0.2 to 1.5 weight % of Mg; 0.001 to 0.2 weight % Ti; at least 0.1 weight % of Mn, Zr or the both; and Al and inevitable impurities, and having a fiber structure.

2. 发明授权

US6053417A Expansion valve integrated with electromagnetic valve 有权
标题翻译：膨胀阀与电磁阀集成
公开(公告)号：US6053417A
公开(公告)日：2000-04-25
申请号：US212179
申请日：1998-12-15
申请人： Teruyuki Hotta , Shigeji Ohishi , Yasuhiro Yamamoto , Kazuhiko Watanabe
发明人： Teruyuki Hotta , Shigeji Ohishi , Yasuhiro Yamamoto , Kazuhiko Watanabe
IPC分类号： F16K31/68 , F16K31/06 , F25B41/04 , F25B41/06
CPC分类号： F16K31/0658 , F25B41/04 , F25B41/062 , F25B2341/0683 , F25B2500/01 , F25B2500/07 , F25B2600/2519
摘要： In an expansion valve integrated with a electromagnetic valve, the expansion valve has an inlet refrigerant path for introducing refrigerant, a restriction path for decompressing and expanding the refrigerant, a valve element for adjusting an opening degree of the restriction path, a valve element operating unit, and an outlet refrigerant path for discharging the refrigerant. The outlet refrigerant path is opened or closed by the electromagnetic valve. When the electromagnetic valve is closed, the valve element operating unit closes the valve element in the restriction path, based on a refrigerant pressure in a space between a valve element of the electromagnetic valve and the restriction path. The space communicates with the inlet refrigerant path through a minute communication hole.
摘要翻译：在与电磁阀一体化的膨胀阀中，膨胀阀具有用于引入制冷剂的入口制冷剂路径，用于减压和膨胀制冷剂的限制通道，用于调节限制路径的开度的阀元件，阀元件操作单元，以及用于排出制冷剂的出口制冷剂路径。出口制冷剂路径由电磁阀打开或关闭。当电磁阀关闭时，阀元件操作单元基于在电磁阀的阀元件和限制通道之间的空间中的制冷剂压力来关闭限制通路中的阀元件。该空间通过分钟连通孔与入口制冷剂路径连通。

3. 发明授权

US06634567B2 Expansion valve unit having pressure detecting function 有权
标题翻译：具有压力检测功能的膨胀阀单元
公开(公告)号：US06634567B2
公开(公告)日：2003-10-21
申请号：US10173078
申请日：2002-06-18
申请人： Teruyuki Hotta , Shigeki Ito , Yasushi Yamanaka , Ryo Matsuda , Kazuhiko Watanabe , Keiji Sasaki
发明人： Teruyuki Hotta , Shigeki Ito , Yasushi Yamanaka , Ryo Matsuda , Kazuhiko Watanabe , Keiji Sasaki
IPC分类号： G05D2700
CPC分类号： F25B41/062 , F25B2341/063 , F25B2600/2513
摘要： An expansion valve unit having a pressure detecting function includes a supercooling control expansion valve disposed in a flow path of a refrigerant sent into an evaporator of a refrigeration system constituting a refrigerating cycle to control the flow rate of the refrigerant. A pressure detector is provided at one end of the supercooling control expansion valve to detect the pressure of the refrigerant sent thereto through a passage in the expansion valve. The supercooling control expansion valve and the pressure detector are integrated with each other by a joining means.
摘要翻译：具有压力检测功能的膨胀阀单元包括设置在构成制冷循环的制冷系统的蒸发器中的制冷剂的流路中的过冷却控制膨胀阀，以控制制冷剂的流量。在过冷却控制膨胀阀的一端设有压力检测器，以检测通过膨胀阀中的通道送到其上的制冷剂的压力。过冷控制膨胀阀和压力检测器通过接合装置相互集成。

4. 发明申请

US20140331713A1 ACCUMULATOR 有权
标题翻译：累加器
公开(公告)号：US20140331713A1
公开(公告)日：2014-11-13
申请号：US14360827
申请日：2012-09-05
申请人： Yukihiko Takeda , Kenichi Fujiwara , Teruyuki Hotta
发明人： Yukihiko Takeda , Kenichi Fujiwara , Teruyuki Hotta
IPC分类号： F25B43/00
CPC分类号： F25B43/006
摘要： An accumulator is disposed in a refrigerant circuit at a position on the suction side of a compressor, separates the gas and liquid phases of the refrigerant, and contains the liquid refrigerant. The accumulator comprises: a pressure container (2) having an inner space (S) formed therein; a refrigerant inlet opening (5) provided in the pressure container; a refrigerant outlet opening (6); a conduction pipe (8) for conducting a refrigerant within the pressure container to the outlet opening; and a gas-liquid separation means (15) provided with a separation plate (16) provided within the pressure container so as to face the inlet opening and so as to expand substantially perpendicularly to the direction of the line of flow at the inlet opening. The gas-liquid separation means has, in the region of the separation plate which faces the inlet opening, a mountain-shaped protrusion (18) having a crest (18a) and a sloped surface (18b), the crest (18a) protruding toward the inlet opening.
摘要翻译：蓄压器设置在制冷剂回路中的压缩机的吸入侧的位置处，分离制冷剂的气相和液相，并且容纳液体制冷剂。储液器包括：具有形成在其中的内部空间（S）的压力容器（2）设置在所述压力容器内的制冷剂入口（5）制冷剂出口（6）; 导电管（8），用于将压力容器内的制冷剂导入出口; 以及设置有设置在所述压力容器内的隔离板（16）的气液分离装置（15），以便面对所述入口并且大致垂直于所述入口开口处的所述流动线的方向膨胀。气液分离装置在分离板的面向入口开口的区域中具有一个具有峰顶（18a）和倾斜表面（18b）的山形突起（18），该顶部（18a）朝向入口开口。

5. 发明授权

US08262831B2 Method for forming a circuit pattern 有权
标题翻译：形成电路图案的方法
公开(公告)号：US08262831B2
公开(公告)日：2012-09-11
申请号：US12738794
申请日：2008-10-03
申请人： Shigeo Hashimoto , Teruyuki Hotta , Takahiro Ishizaki
发明人： Shigeo Hashimoto , Teruyuki Hotta , Takahiro Ishizaki
IPC分类号： B29C65/00 , B32B37/00 , B32B38/10 , B32B38/14
CPC分类号： H05K3/246 , H05K1/0265 , H05K3/0023 , H05K3/184 , H05K3/28 , H05K2201/0347 , H05K2201/0376 , H05K2203/072 , Y10T156/1082
摘要： A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.
摘要翻译：公开了一种形成电路图案的方法。在形成第一绝缘层（1L）的绝缘树脂（11）上形成形成导电层（2L）的电路图案。在形成有电路图案的绝缘树脂（11）上层压形成第二绝缘层（3L）的绝缘树脂（13）。在叠层绝缘树脂（13）中形成沟槽（14）以露出电路图案。化学镀金属（15）通过化学镀被埋在形成的沟槽（14）中。

6. 发明申请

US20110259373A1 METHOD AND AGENT FOR SURFACE PROCESSING OF PRINTED CIRCUIT BOARD SUBSTRATE 审中-公开
标题翻译：印刷电路板基板的表面处理方法和代理
公开(公告)号：US20110259373A1
公开(公告)日：2011-10-27
申请号：US13090003
申请日：2011-04-19
申请人： Teruyuki Hotta , Takahiro Ishizaki
发明人： Teruyuki Hotta , Takahiro Ishizaki
IPC分类号： B08B3/00
CPC分类号： H05K3/0055 , H05K3/0032
摘要： A surface processing method and a surface processing agent for effectively removing smear produced in a via or the like are disclosed. The smear is to be removed without etching an inner metalized layer without using expensive permanganates that might impose a greater load on an environment and operators. By removing the smear, the tightness in adhesion between an inner metalized circuit layer and plating metal as well as reliability in electrical connection may be improved. To this end, a surface processing method for a resin-containing substrate of a printed circuit board is provided in which the smear left in an opening, such as a blind via, a through-hole or a trench, formed in the substrate, may be removed without etching a metalized inner layer. The surface processing method immerses the interconnect substrate in a weakly acidic to weakly alkaline first processing solution at least containing hydrogen peroxide and subsequently in a second processing solution at least containing an alkali compound and an organic solvent.
摘要翻译：公开了一种表面处理方法和表面处理剂，用于有效地去除在通孔等中产生的污迹。在不使用可能对环境和操作者施加更大负荷的昂贵的高锰酸盐的情况下，不需要蚀刻内部金属化层即可将涂片除去。通过去除涂抹物，可以提高内部金属化电路层和电镀金属之间的粘附性以及电连接的可靠性。为此，提供了一种用于印刷电路板的含树脂基材的表面处理方法，其中留在基板中形成的诸如盲孔，通孔或沟槽的开口中的涂片可以在不蚀刻金属化内层的情况下被去除。表面处理方法将互连基板浸渍在至少含有过氧化氢的弱酸性至弱碱性的第一处理溶液中，并且随后在至少含有碱性化合物和有机溶剂的第二处理溶液中浸渍。

7. 发明授权

US06981390B2 Refrigerant cycle system 失效
标题翻译：制冷循环系统
公开(公告)号：US06981390B2
公开(公告)日：2006-01-03
申请号：US10697488
申请日：2003-10-30
申请人： Etsuhisa Yamada , Shigeki Ito , Teruyuki Hotta , Yasushi Yamanaka
发明人： Etsuhisa Yamada , Shigeki Ito , Teruyuki Hotta , Yasushi Yamanaka
IPC分类号： F25B39/04 , F25B5/00 , F25B43/00 , F25B31/00 , F25B41/00
CPC分类号： F25B39/04 , F25B40/02 , F25B41/06 , F25B2339/0441 , F25B2339/0442 , F25B2339/0444 , F25B2339/0445 , F25B2339/0446 , F25B2400/02 , F25B2400/23 , F25B2600/2501
摘要： A refrigerant cycle system includes a first heat-exchanging portion for condensing gas refrigerant discharged from a compressor, a gas-liquid separator into which all of refrigerant after passing through the first heat-exchanging portion and a part of gas refrigerant discharged from the compressor are introduced, and a second heat-exchanging portion for cooling and condensing refrigerant flowing from the gas-liquid separator. Because all of the condensed refrigerant from the first heat-exchanging portion is introduced into the gas-liquid separator, a passage area of a gas refrigerant introduction passage for introducing gas refrigerant from the compressor into the gas-liquid separator can be set relatively large. Therefore, a dimension difference of the gas refrigerant introducing passage in manufacturing is not greatly affected to an adjustment of a liquid refrigerant amount in the gas-liquid separator.
摘要翻译：制冷剂循环系统包括用于冷凝从压缩机排出的气体制冷剂的第一热交换部分，通过第一热交换部分的所有制冷剂和从压缩机排出的一部分气体制冷剂的气液分离器以及用于冷却和冷凝从气液分离器流出的制冷剂的第二热交换部。由于来自第一热交换部的所有冷凝的制冷剂被引入气液分离器，因此可以将用于将气体制冷剂从压缩机引入气液分离器的气体制冷剂导入路径的通路面积设定得较大。因此，制造中的气体制冷剂导入通路的尺寸差对气液分离器中的液体制冷剂量的调整没有大的影响。

8. 发明授权

US06427480B1 Refrigerant cycle system 有权
标题翻译：制冷循环系统
公开(公告)号：US06427480B1
公开(公告)日：2002-08-06
申请号：US09838835
申请日：2001-04-20
申请人： Shigeki Ito , Kurato Yamasaki , Teruyuki Hotta , Yasushi Yamanaka , Atsushi Inaba
发明人： Shigeki Ito , Kurato Yamasaki , Teruyuki Hotta , Yasushi Yamanaka , Atsushi Inaba
IPC分类号： F25B3904
CPC分类号： F28D1/05375 , B60H1/3227 , F25B6/04 , F25B39/04 , F25B41/04 , F25B41/06 , F25B43/003 , F25B43/006 , F25B45/00 , F25B2339/044 , F25B2339/0441 , F25B2339/0444 , F25B2339/0446 , F25B2341/063 , F25B2400/02 , F25B2400/03 , F25B2400/0403 , F25B2400/0415 , F25B2400/16 , F25B2400/162 , F25B2500/12 , F28D2021/0084
摘要： A condenser of a refrigerant cycle system includes a first heat exchange unit into which refrigerant discharged from a compressor flows, a second heat exchange unit disposed at a downstream of the first heat exchange unit in a refrigerant flow direction, and a gas-liquid separator disposed between the first and second heat exchange units in the refrigerant flow direction. In the refrigerant cycle system, at least gas refrigerant separated in the gas-liquid separator flows into the second heat exchange unit so that an amount of liquid refrigerant stored in the gas-liquid separator is changed in accordance with a super-heating degree of refrigerant discharged from the compressor.
摘要翻译：制冷剂循环系统的冷凝器包括从压缩机排出的制冷剂流入的第一热交换单元，设置在制冷剂流动方向的第一热交换单元的下游的第二热交换单元和设置在气体分离器在制冷剂流动方向上的第一和第二热交换单元之间。在制冷剂循环系统中，至少在气液分离器中分离的气体制冷剂流入第二热交换单元，使得储存在气液分离器中的液体制冷剂的量根据制冷剂的过热度而变化从压缩机排出。

9. 发明授权

US08197583B2 Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board 有权
标题翻译：化学镀溶液，使用其的无电镀方法和制造电路板的方法
公开(公告)号：US08197583B2
公开(公告)日：2012-06-12
申请号：US13296173
申请日：2011-11-14
申请人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
发明人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
IPC分类号： C23C18/40
CPC分类号： C23C18/31 , C23C18/1607 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/405 , H05K3/422
摘要： Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
摘要翻译：公开了一种化学镀溶液，即使对于较大的沟槽或几十微米的通孔也具有良好的电镀金属填充性能，没有空隙或接缝，并且能够延长稳定的性能。化学镀溶液至少含有水溶性金属盐，还原剂，用于还原由水溶性金属盐衍生的金属离子和螯合剂。此外，化学镀溶液含有作为具有至少一个脂肪族环状基团或芳香族环状基团的平整剂的硫系有机化合物，可以连接至少一个任选的取代基。脂肪族环状基团或芳香族环状基团含有任意数量的碳原子，氧原子，磷原子，硫原子和氮原子。

10. 发明申请

US20120058254A1 ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD 有权
标题翻译：电沉积溶液，使用其的电镀法的方法和制造电路板的方法
公开(公告)号：US20120058254A1
公开(公告)日：2012-03-08
申请号：US13296173
申请日：2011-11-14
申请人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
发明人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
IPC分类号： C23C18/40 , H05K3/10
CPC分类号： C23C18/31 , C23C18/1607 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/405 , H05K3/422
摘要： Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time.The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
摘要翻译：公开了一种化学镀溶液，即使对于较大的沟槽或几十微米的通孔也具有良好的电镀金属填充性能，没有空隙或接缝，并且能够延长稳定的性能。化学镀溶液至少含有水溶性金属盐，还原剂，用于还原由水溶性金属盐衍生的金属离子和螯合剂。此外，化学镀溶液含有作为具有至少一个脂肪族环状基团或芳香族环状基团的平整剂的硫系有机化合物，可以连接至少一个任选的取代基。脂肪族环状基团或芳香族环状基团含有任意数量的碳原子，氧原子，磷原子，硫原子和氮原子。

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