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1. 发明授权

US08276270B2 Method for manufacturing printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US08276270B2
公开(公告)日：2012-10-02
申请号：US12666634
申请日：2008-04-22
申请人： Teruyuki Hotta , Shushi Morimoto , Takahiro Ishizaki , Hisamitsu Yamamoto
发明人： Teruyuki Hotta , Shushi Morimoto , Takahiro Ishizaki , Hisamitsu Yamamoto
IPC分类号： H01K3/10
CPC分类号： H05K3/421 , H05K3/184 , H05K3/422 , H05K3/465 , H05K3/4661 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed.
摘要翻译：本发明涉及一种制造印刷电路板的方法，其中形成布线图案的多个导电层在它们被放置在绝缘层之间的状态下被层叠，并且由此形成印刷电路板。本发明的印刷电路板的制造方法包括形成通孔填充物（17）的步骤，以使化学镀液体与暴露于形成的通孔（14）的底部的布线图案的表面相接触在绝缘层上层叠从底部到通孔（14）的开口部的电镀金属膜，以形成通孔填充物（17），以及形成布线图案以形成化学镀金属膜（20）的步骤）作为布线图案，形成在通孔填充物（17）的基板上。

2. 发明授权

US08137447B2 Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board 有权
公开(公告)号：US08137447B2
公开(公告)日：2012-03-20
申请号：US12491920
申请日：2009-06-25
申请人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
发明人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
IPC分类号： C23C18/31 , C23C18/34 , C23C18/40 , B05D5/12
CPC分类号： C23C18/31 , C23C18/1607 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/405 , H05K3/422
摘要： Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

3. 发明申请

US20100181104A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US20100181104A1
公开(公告)日：2010-07-22
申请号：US12666634
申请日：2008-04-22
申请人： Teruyuki Hotta , Shushi Morimoto , Takahiro Ishizaki , Hisamitsu Yamamoto
发明人： Teruyuki Hotta , Shushi Morimoto , Takahiro Ishizaki , Hisamitsu Yamamoto
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H05K3/421 , H05K3/184 , H05K3/422 , H05K3/465 , H05K3/4661 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed.
摘要翻译：本发明涉及一种制造印刷电路板的方法，其中形成布线图案的多个导电层在它们被放置在绝缘层之间的状态下被层叠，并且由此形成印刷电路板。本发明的印刷电路板的制造方法包括形成通孔填充物（17）的步骤，以使化学镀液体与暴露于形成的通孔（14）的底部的布线图案的表面相接触在绝缘层上层叠从底部到通孔（14）的开口部的电镀金属膜，以形成通孔填充物（17），以及形成布线图案以形成化学镀金属膜（20）的步骤）作为布线图案，形成在通孔填充物（17）的基板上。

4. 发明授权

US08262831B2 Method for forming a circuit pattern 有权
标题翻译：形成电路图案的方法
公开(公告)号：US08262831B2
公开(公告)日：2012-09-11
申请号：US12738794
申请日：2008-10-03
申请人： Shigeo Hashimoto , Teruyuki Hotta , Takahiro Ishizaki
发明人： Shigeo Hashimoto , Teruyuki Hotta , Takahiro Ishizaki
IPC分类号： B29C65/00 , B32B37/00 , B32B38/10 , B32B38/14
CPC分类号： H05K3/246 , H05K1/0265 , H05K3/0023 , H05K3/184 , H05K3/28 , H05K2201/0347 , H05K2201/0376 , H05K2203/072 , Y10T156/1082
摘要： A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.
摘要翻译：公开了一种形成电路图案的方法。在形成第一绝缘层（1L）的绝缘树脂（11）上形成形成导电层（2L）的电路图案。在形成有电路图案的绝缘树脂（11）上层压形成第二绝缘层（3L）的绝缘树脂（13）。在叠层绝缘树脂（13）中形成沟槽（14）以露出电路图案。化学镀金属（15）通过化学镀被埋在形成的沟槽（14）中。

5. 发明申请

US20110259373A1 METHOD AND AGENT FOR SURFACE PROCESSING OF PRINTED CIRCUIT BOARD SUBSTRATE 审中-公开
标题翻译：印刷电路板基板的表面处理方法和代理
公开(公告)号：US20110259373A1
公开(公告)日：2011-10-27
申请号：US13090003
申请日：2011-04-19
申请人： Teruyuki Hotta , Takahiro Ishizaki
发明人： Teruyuki Hotta , Takahiro Ishizaki
IPC分类号： B08B3/00
CPC分类号： H05K3/0055 , H05K3/0032
摘要： A surface processing method and a surface processing agent for effectively removing smear produced in a via or the like are disclosed. The smear is to be removed without etching an inner metalized layer without using expensive permanganates that might impose a greater load on an environment and operators. By removing the smear, the tightness in adhesion between an inner metalized circuit layer and plating metal as well as reliability in electrical connection may be improved. To this end, a surface processing method for a resin-containing substrate of a printed circuit board is provided in which the smear left in an opening, such as a blind via, a through-hole or a trench, formed in the substrate, may be removed without etching a metalized inner layer. The surface processing method immerses the interconnect substrate in a weakly acidic to weakly alkaline first processing solution at least containing hydrogen peroxide and subsequently in a second processing solution at least containing an alkali compound and an organic solvent.
摘要翻译：公开了一种表面处理方法和表面处理剂，用于有效地去除在通孔等中产生的污迹。在不使用可能对环境和操作者施加更大负荷的昂贵的高锰酸盐的情况下，不需要蚀刻内部金属化层即可将涂片除去。通过去除涂抹物，可以提高内部金属化电路层和电镀金属之间的粘附性以及电连接的可靠性。为此，提供了一种用于印刷电路板的含树脂基材的表面处理方法，其中留在基板中形成的诸如盲孔，通孔或沟槽的开口中的涂片可以在不蚀刻金属化内层的情况下被去除。表面处理方法将互连基板浸渍在至少含有过氧化氢的弱酸性至弱碱性的第一处理溶液中，并且随后在至少含有碱性化合物和有机溶剂的第二处理溶液中浸渍。

6. 发明授权

US08197583B2 Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board 有权
标题翻译：化学镀溶液，使用其的无电镀方法和制造电路板的方法
公开(公告)号：US08197583B2
公开(公告)日：2012-06-12
申请号：US13296173
申请日：2011-11-14
申请人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
发明人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
IPC分类号： C23C18/40
CPC分类号： C23C18/31 , C23C18/1607 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/405 , H05K3/422
摘要： Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
摘要翻译：公开了一种化学镀溶液，即使对于较大的沟槽或几十微米的通孔也具有良好的电镀金属填充性能，没有空隙或接缝，并且能够延长稳定的性能。化学镀溶液至少含有水溶性金属盐，还原剂，用于还原由水溶性金属盐衍生的金属离子和螯合剂。此外，化学镀溶液含有作为具有至少一个脂肪族环状基团或芳香族环状基团的平整剂的硫系有机化合物，可以连接至少一个任选的取代基。脂肪族环状基团或芳香族环状基团含有任意数量的碳原子，氧原子，磷原子，硫原子和氮原子。

7. 发明申请

US20120058254A1 ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD 有权
标题翻译：电沉积溶液，使用其的电镀法的方法和制造电路板的方法
公开(公告)号：US20120058254A1
公开(公告)日：2012-03-08
申请号：US13296173
申请日：2011-11-14
申请人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
发明人： Teruyuki Hotta , Takahiro Ishizaki , Tomohiro Kawase , Masaharu Takeuchi
IPC分类号： C23C18/40 , H05K3/10
CPC分类号： C23C18/31 , C23C18/1607 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/405 , H05K3/422
摘要： Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time.The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
摘要翻译：公开了一种化学镀溶液，即使对于较大的沟槽或几十微米的通孔也具有良好的电镀金属填充性能，没有空隙或接缝，并且能够延长稳定的性能。化学镀溶液至少含有水溶性金属盐，还原剂，用于还原由水溶性金属盐衍生的金属离子和螯合剂。此外，化学镀溶液含有作为具有至少一个脂肪族环状基团或芳香族环状基团的平整剂的硫系有机化合物，可以连接至少一个任选的取代基。脂肪族环状基团或芳香族环状基团含有任意数量的碳原子，氧原子，磷原子，硫原子和氮原子。

8. 发明申请

US20100243149A1 METHOD FOR FORMING A CIRCUIT PATTERN 有权
标题翻译：形成电路图案的方法
公开(公告)号：US20100243149A1
公开(公告)日：2010-09-30
申请号：US12738794
申请日：2008-10-03
申请人： Shigeo Hashimoto , Teruyuki Hotta , Takahiro Ishizaki
发明人： Shigeo Hashimoto , Teruyuki Hotta , Takahiro Ishizaki
IPC分类号： B32B37/00 , B29C65/00
CPC分类号： H05K3/246 , H05K1/0265 , H05K3/0023 , H05K3/184 , H05K3/28 , H05K2201/0347 , H05K2201/0376 , H05K2203/072 , Y10T156/1082
摘要： A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.
摘要翻译：公开了一种形成电路图案的方法。在形成第一绝缘层（1L）的绝缘树脂（11）上形成形成导电层（2L）的电路图案。在形成有电路图案的绝缘树脂（11）上层压形成第二绝缘层（3L）的绝缘树脂（13）。在叠层绝缘树脂（13）中形成沟槽（14）以露出电路图案。化学镀金属（15）通过化学镀被埋在形成的沟槽（14）中。

9. 发明申请

US20090002799A1 ELECTROCHROMIC MIRROR 有权
标题翻译：电致发光镜
公开(公告)号：US20090002799A1
公开(公告)日：2009-01-01
申请号：US12144128
申请日：2008-06-23
申请人： Junichi NAKAHO , Masaharu Hattori , Atsushi Yamaguchi , Nagahiro Saito , Takahiro Ishizaki , Osamu Takai
发明人： Junichi NAKAHO , Masaharu Hattori , Atsushi Yamaguchi , Nagahiro Saito , Takahiro Ishizaki , Osamu Takai
IPC分类号： G02F1/153
CPC分类号： G02F1/1523 , G02F1/153 , G02F2001/1552
摘要： An electrochromic mirror includes an electrically conductive reflective film capable of reflecting light that is incident thereto and having electrical conductivity in which plural fine penetration holes are formed, an electrochromic film that is provided at a side of the electrically conductive reflective film at which the light is incident and reflected, an electrically conductive film that is provided at a side of the electrically conductive reflective film that is opposite from the electrochromic film, and an electrolytic solution that contains lithium ions and is enclosed between the electrically conductive film and the electrically conductive reflective film. The plural penetration holes formed in the electrically conductive reflective film penetrate in a thickness direction thereof, and a ratio between a distance between respective centers of the penetration holes and an inner peripheral diameter dimension of the penetration holes is 7 or more.
摘要翻译：电致变色镜包括能够反射入射到其上并具有导电性的导电性的导电性反射膜，其中形成有多个细小的贯通孔，电致变色膜设置在导光性反射膜的光的一侧入射反射，设置在与电致变色膜相反的导电性反射膜的一侧的导电性膜和含有锂离子的电解液，被封入导电膜与导电性反射膜之间。形成在导电性反射膜中的多个贯通孔贯穿其厚度方向，并且贯通孔的各个中心的距离与贯通孔的内周径尺寸之比为7以上。

10. 发明授权

US09045836B2 Electrolytic regeneration device 有权
标题翻译：电解再生装置
公开(公告)号：US09045836B2
公开(公告)日：2015-06-02
申请号：US13218855
申请日：2011-08-26
申请人： Yoshikazu Saijo , Hisamitsu Yamamoto , Takahiro Ishizaki
发明人： Yoshikazu Saijo , Hisamitsu Yamamoto , Takahiro Ishizaki
IPC分类号： C25B1/28 , C25B15/08 , H05K3/00
CPC分类号： C25B1/28 , C25B15/08 , H05K3/0055
摘要： The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
摘要翻译：再生单元包括具有用作阳极的内周面的管状部分和设置在管状部分内部并且在与内周表面分离的状态下沿管状部分的延伸方向延伸的阴极。用于除污处理的处理液通过管状部分的内周表面和阴极之间的间隙进料。进料侧导管通过其下游端部与管状部连接，将从脱盐处理槽排出的处理液引导到再生部。返回侧导管由其上游端部与管状部连接，将从再生部排出的处理液引导到除污处理槽内。

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