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1. 发明申请

US20100225136A1 SEAL MEMBER FOR DOOR 审中-公开
标题翻译：密封件门
公开(公告)号：US20100225136A1
公开(公告)日：2010-09-09
申请号：US12279944
申请日：2007-02-19
申请人： Masanori Ogawa , Katsumi Terada , Junichi Hasegawa , Makoto Fujii
发明人： Masanori Ogawa , Katsumi Terada , Junichi Hasegawa , Makoto Fujii
IPC分类号： B60R13/02
CPC分类号： B60J5/0418 , B29C51/10 , B29C2791/001 , B29C2791/006 , B29K2105/04 , B29L2031/3014 , B60R13/0206 , B60R13/0243 , B60R13/0892
摘要： The object of the present invention is to provide a door seal member which is easily fitted into the door of a car. A door seal member 13 is fitted between the door panel 11 and the door trim board 12, wherein the door seal member 13 is manufactured by the vacuum and/or pressure forming or cold working of a foamed sheet, the door seal member 13 being molded into a cubic shape corresponding to that of the door trim board 12.
摘要翻译：本发明的目的是提供一种容易装入轿厢门的门密封件。门密封构件13装配在门板11和门饰板12之间，其中门密封构件13通过发泡片材的真空和/或压力成形或冷加工制造，门密封构件13被模制成为对应于门饰板12的立方体。

2. 发明申请

US20110203521A1 MASKING MATERIAL FOR JIG FOR COATING 审中-公开
标题翻译：用于涂料的掩模材料
公开(公告)号：US20110203521A1
公开(公告)日：2011-08-25
申请号：US12596785
申请日：2007-04-25
申请人： Masanori Ogawa , Makoto Fujii , Katsumi Terada , Junichi Hasegawa
发明人： Masanori Ogawa , Makoto Fujii , Katsumi Terada , Junichi Hasegawa
IPC分类号： B05B15/04
CPC分类号： B05B13/0285 , B05B12/20
摘要： The object of the present invention is to prevent the adhesion of paint to the jig which supports an article to be coated, and to attain the object, the present invention provides a masking member made of a polymer alloy consisting of 20 to 80% by weight of polyphenylene ether and 80 to 20% by weight of polyamide, or a polymer alloy consisting of 100 parts by weight of a polymer mixture into which polyphenylene ether and polyamide are mixed in a weight ratio of between 20:80 and 80:20, and 0 to 50 parts by weight of a styrene group resin and 0 to 50 parts by weight of styrene group elastomer, the article 31 being supported by the jig, and spray coated.
摘要翻译：本发明的目的是为了防止涂料粘附在支撑被涂物品的夹具上，为了达到上述目的，本发明提供一种由20〜80重量％的聚苯醚和80〜20重量％的聚酰胺，或由100重量份以聚苯醚和聚酰胺以20:80至80:20的重量比混合的聚合物混合物组成的聚合物合金，以及 0至50重量份苯乙烯基树脂和0至50重量份苯乙烯基弹性体，制品31由夹具支撑并喷涂。

3. 发明申请

US20100112281A1 Protector 审中-公开
标题翻译：保护者
公开(公告)号：US20100112281A1
公开(公告)日：2010-05-06
申请号：US11988669
申请日：2006-06-06
申请人： Masanori Ogawa , Katsumi Terada , Junichi Hasegawa
发明人： Masanori Ogawa , Katsumi Terada , Junichi Hasegawa
IPC分类号： B32B3/10 , B32B3/00
CPC分类号： B60R19/48 , B60Q1/2619 , B60R2019/505 , Y10T428/24273 , Y10T428/24628
摘要： The object of the present invention is to protect a member from damage when a part is fit to the member.To attain the object, in the present invention, a protector 8 consisting of a hole inner side protective section 9, to protect the inside of the part fitting hole 2 of the member, and a surrounding protective section 10, to protect the surroundings of the part fitting hole, is provided, the two sections 9, 10 integrally making up the protector 8. The protector 8 is fit into the part fitting hole 2, following which a part 12 is fit thereinto.
摘要翻译：本发明的目的是在零件与构件配合时保护构件免受损坏。为了实现该目的，在本发明中，保护器8由孔内侧保护部分9组成，以保护构件的部件装配孔2的内部和周围的保护部分10，以保护设置有一体地构成保护器8的两个部分9,10。保护器8装配到部件装配孔2中，随后安装有部件12。

4. 发明申请

US20090223445A1 Method for Attaching a Reinforcing Beam to the Floor Panel of a Car 审中-公开
标题翻译：将加强梁固定在汽车地板上的方法
公开(公告)号：US20090223445A1
公开(公告)日：2009-09-10
申请号：US12092315
申请日：2006-10-12
申请人： Masanori Ogawa , Katsumi Terada , Junichi Hasegawa
发明人： Masanori Ogawa , Katsumi Terada , Junichi Hasegawa
IPC分类号： B05B15/04
CPC分类号： B05B12/20
摘要： The object of the present invention is to attach a part firmly to a component. A part attaching seat 7 of the component to which the part is to be attached, and a plural number of stud bolts 4,4 are covered with a masking member 9. The masking member 9 consists of a panel shaped seat covering part 10 and a bolt covering part 11, and the seat covering part 10 covers the part attaching seat 7 and the bolt covering part 11 covers the stud bolts 4,4 to protect the part attaching seat 7 and the stud bolts 4,4 from coating.
摘要翻译：本发明的目的是将部件牢固地附接到部件上。要安装部件的部件的安装部件7和多个双头螺栓4,4被掩蔽部件9覆盖。掩模部件9由面板形的座椅覆盖部分10和螺栓覆盖部11，并且座椅覆盖部10覆盖部件安装座7，并且螺栓覆盖部11覆盖双头螺栓4,4以保护部件安装座7和双头螺栓4,4免受涂覆。

5. 发明授权

US06462160B1 Masking material 失效
标题翻译：掩蔽材料
公开(公告)号：US06462160B1
公开(公告)日：2002-10-08
申请号：US09763849
申请日：2001-02-27
申请人： Masanori Ogawa , Katsumi Terada , Kuninori Ito
发明人： Masanori Ogawa , Katsumi Terada , Kuninori Ito
IPC分类号： C08F11208
CPC分类号： B05B12/20 , B05B12/26
摘要： A masking member is provided that can be used repeatedly even for surface treatments at a high temperature. The masking member includes a plastic produced by polymerization using a metallocene compound as a catalyst or a polymer alloy containing such a plastic.
摘要翻译：提供了能够在高温下进行表面处理而重复使用的掩模构件。掩模构件包括通过使用茂金属化合物作为催化剂进行聚合制备的塑料或含有这种塑料的聚合物合金。

6. 发明申请

US20120015458A1 MOUNTING APPARATUS AND MOUNTING METHOD 审中-公开
标题翻译：安装设备和安装方法
公开(公告)号：US20120015458A1
公开(公告)日：2012-01-19
申请号：US13260232
申请日：2010-03-18
申请人： Takayoshi Akamatsu , Katsumi Terada , Hajime Hirata
发明人： Takayoshi Akamatsu , Katsumi Terada , Hajime Hirata
IPC分类号： H01L21/58 , B23P19/00
CPC分类号： H05K13/021 , H01L2224/16225 , H01L2224/75 , H05K13/0452 , Y10T29/53178
摘要： Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.
摘要翻译：提供了一种将芯片部件安装在具有形成在其上的多个电路图案的电路板上的电路图案上的安装装置。安装装置设置有多个焊接工具，每个焊接工具将芯片部件安装在电路板上的每个电路图案上。每个接合工具在电路板上要安装芯片部件的区域内设置专用安装区域，其中只有每个焊接工具可以安装芯片部件，以及公共安装区域，其中焊接工具和相邻的焊接工具可以安装芯片组件。还提供了一种安装方法。即使在电路板上形成多个电路图案并且在形成的电路图案中包括故障电路图案的情况下，也可以缩短芯片组件的安装节拍时间。

7. 发明授权

US5493351A Liquid crystal projector 失效
标题翻译：液晶投影仪
公开(公告)号：US5493351A
公开(公告)日：1996-02-20
申请号：US160024
申请日：1993-11-30
申请人： Goro Hamagishi , Masahiro Sakata , Katsumi Terada , Haruhisa Kosaka , Shunichi Kishimoto , Keiichi Kanatani
发明人： Goro Hamagishi , Masahiro Sakata , Katsumi Terada , Haruhisa Kosaka , Shunichi Kishimoto , Keiichi Kanatani
IPC分类号： G02F1/13 , G02F1/133 , G02F1/1335 , H04N9/31 , G03B21/00
CPC分类号： H04N9/3144 , G02F1/133385 , G02F1/133514
摘要： A liquid crystal projector includes a light source, a color filter for adding color projection image, a liquid crystal panel for forming a projection image on it, a projection lens and an optical unit located between the color filter and the liquid crystal panel for optically coupling the color filter and the liquid crystal panel. The color filter is separately located from the liquid crystal, and therefore the increase in temperature on the color filter because of absorbing the light from the light source has less effect on the liquid crystal panel.
摘要翻译：液晶投影仪包括光源，用于添加彩色投影图像的滤色器，用于在其上形成投影图像的液晶面板，投影透镜和位于滤色器和用于光耦合的液晶面板之间的光学单元滤色器和液晶面板。滤色器与液晶分开设置，因此由于吸收来自光源的光而使滤色器上的温度升高对液晶面板的影响较小。

8. 发明授权

US4480636A Endoscope with image correction means 失效
标题翻译：具有图像校正手段的内窥镜
公开(公告)号：US4480636A
公开(公告)日：1984-11-06
申请号：US395629
申请日：1982-07-06
申请人： Kouichi Karaki , Kenichi Oinoue , Takashi Tsukaya , Katsumi Terada , Masafumi Yamasaki , Atsushi Yusa , Kazuo Nakamura
发明人： Kouichi Karaki , Kenichi Oinoue , Takashi Tsukaya , Katsumi Terada , Masafumi Yamasaki , Atsushi Yusa , Kazuo Nakamura
IPC分类号： A61B1/04 , G02B23/24 , G02B23/26 , H04N5/225 , A61B1/06
CPC分类号： H04N5/217 , A61B1/042 , G02B23/2484 , H04N2005/2255
摘要： In an endoscope for displaying an image of an object on a monitor screen, a static induction transistor (SIT) image sensor having a number of light receiving elements is arranged at a light emitting side of an image guide bundle. In order to eliminate dead spots appearing in the displayed image due to broken fibers in the image guide bundle, pixel signals of light receiving elements corresponding to the dead spots are formed by interpolation with the aid of pixel signals derived from light receiving elements adjacent to the relevant light receiving elements to be interpolated. As an interpolation function, for example, an average of the pixel signals derived from the adjacent light receiving elements is used. The addresses of the light receiving elements corresponding to the dead spots are stored previously in a PROM during a manufacturing stage. In this manner, the interpolated image of the object having an excellent image quality can be displayed on the monitor.
摘要翻译：在用于在监视器屏幕上显示物体的图像的内窥镜中，具有多个光接收元件的静电感应晶体管（SIT）图像传感器被布置在图像引导束的发光侧。为了消除由于图像引导束中的断裂的纤维而在显示的图像中出现的死点，与死点相对应的光接收元件的像素信号借助于从邻近的光接收元件导出的像素信号进行内插而形成要插补的相关光接收元件。作为内插函数，例如，使用从相邻的光接收元件导出的像素信号的平均值。对应于死点的光接收元件的地址在制造阶段预先存储在PROM中。以这种方式，可以在监视器上显示具有优异图像质量的对象的内插图像。

9. 发明申请

US20090289098A1 Chip Mounting Apparatus and Chip Mounting Method 审中-公开
标题翻译：芯片安装装置和芯片安装方法
公开(公告)号：US20090289098A1
公开(公告)日：2009-11-26
申请号：US12085964
申请日：2006-11-30
申请人： Katsumi Terada , Mikio Kawakami
发明人： Katsumi Terada , Mikio Kawakami
IPC分类号： B23K20/02 , B23Q15/14
CPC分类号： H01L24/81 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/81121 , H01L2224/81203 , H01L2224/81208 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01055 , H01L2924/01067 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： A chip mounting apparatus is provided with a drive control means. The drive control means is provided with a tool holder whereupon a tool for applying pressure to a chip is mounted, a holder supporting means for supporting the tool holder to be vertically moved, a drive means for vertically moving the holder supporting means, and a position detecting means for detecting a relative position of the tool holder to the holder supporting means. The drive control means controls the height and the pressurizing force of the tool, based on the position of the tool holder when the tool and the chip are one over another and brought into contact with a substrate. A chip mounting method is also provided. Short-circuit failures between adjacent solder bumps can be prevented and chips can be mounted with high yield and reliability.
摘要翻译：芯片安装装置具有驱动控制装置。驱动控制装置设置有工具架，安装用于向芯片施加压力的工具，用于支撑待垂直移动的工具架的保持器支撑装置，用于垂直移动保持器支撑装置的驱动装置和位置检测装置，用于检测工具架到保持器支撑装置的相对位置。驱动控制装置基于工具和芯片彼此重叠并与基板接触的位置来控制工具的高度和加压力。还提供了芯片安装方法。可以防止相邻焊料凸点之间的短路故障，并且可以以高产率和可靠性安装芯片。

10. 发明授权

US07621969B2 Mounting system 失效
标题翻译：安装系统
公开(公告)号：US07621969B2
公开(公告)日：2009-11-24
申请号：US11887212
申请日：2006-03-13
申请人： Mutsumi Masumoto , Katsumi Terada
发明人： Mutsumi Masumoto , Katsumi Terada
IPC分类号： H01L21/00
CPC分类号： H01L21/67109 , H01L21/563 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/75 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/15788 , Y10T29/41 , H01L2924/00
摘要： A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted. The substrate can be sustained at a desirable temperature over the substantially entire mounting process having a series of steps, and in particular, occurrence of problems ascribed to moisture absorption can be suppressed or prevented.
摘要翻译：安装系统设置有基板装载部分，芯片安装部分和基板卸载部分，用于顺序取出安装芯片的基板。安装系统的特征在于，基板装载部分设置有能够将基板与能够容纳多个基板的基板隔套一起隔热的烘箱，分别设置用于加热/隔热基板的台加热器，在从芯片安装部的基板等待台到芯片安装部，芯片安装部以及从芯片安装部到基板卸载部的基板输送部的基板输送部，基板卸载部是提供了能够将基板与能够容纳多个基板并因此安装芯片的基板隔套一起烘烤的炉。可以在具有一系列步骤的基本上整个安装过程中将基材维持在期望的温度，并且特别地，可以抑制或防止归因于吸湿的问题的发生。

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