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    • 3. 发明授权
    • Method of high-speed and accurate alignment using a chip mounting device
    • 使用芯片安装装置高速准确对准的方法
    • US06961994B2
    • 2005-11-08
    • US10221142
    • 2001-03-08
    • Katsumi TeradaAkira Yamauchi
    • Katsumi TeradaAkira Yamauchi
    • H01L21/52H05K13/04H05K13/08H05K3/30
    • H05K13/08H05K13/0413H05K13/089Y10T29/4913Y10T29/49131Y10T29/53087Y10T29/53174Y10T29/53178
    • A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads with calibration marks, first recognition mechanism fixed in a chip mounting position, and second recognition mechanism fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads. In mounting operation, the first recognition mechanism recognizes the positions of a substrate and the calibration marks of the heads, whereas the second recognition mechanism recognizes the positions of chips attracted on the heads. The heads are moved vertically to adjust plane to be recognized. The chip and the substrate are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.
    • 使用包括设置在圆周上的多个头部的安装装置来实现准确和高速的安装。 安装装置包括具有校准标记的多个头部,固定在芯片安装位置的第一识别机构和固定在另一位置的第二识别机构。 在安装操作之前,第一识别机构和第二识别机构识别和存储头部的校准标记的位置。 在安装操作中,第一识别机构识别基板的位置和头的校准标记,而第二识别机构识别吸头头部的位置。 头垂直移动以调整平面以被识别。 芯片和基板根据识别机构获得的位置信息进行对准,并安装芯片。
    • 5. 发明申请
    • MOUNTING APPARATUS AND MOUNTING METHOD
    • 安装设备和安装方法
    • US20120015458A1
    • 2012-01-19
    • US13260232
    • 2010-03-18
    • Takayoshi AkamatsuKatsumi TeradaHajime Hirata
    • Takayoshi AkamatsuKatsumi TeradaHajime Hirata
    • H01L21/58B23P19/00
    • H05K13/021H01L2224/16225H01L2224/75H05K13/0452Y10T29/53178
    • Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.
    • 提供了一种将芯片部件安装在具有形成在其上的多个电路图案的电路板上的电路图案上的安装装置。 安装装置设置有多个焊接工具,每个焊接工具将芯片部件安装在电路板上的每个电路图案上。 每个接合工具在电路板上要安装芯片部件的区域内设置专用安装区域,其中只有每个焊接工具可以安装芯片部件,以及公共安装区域,其中焊接工具和 相邻的焊接工具可以安装芯片组件。 还提供了一种安装方法。 即使在电路板上形成多个电路图案并且在形成的电路图案中包括故障电路图案的情况下,也可以缩短芯片组件的安装节拍时间。