专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110108247A1 COOLING APPARATUS FOR SEMICONDUCTOR ELEMENT 有权
标题翻译：冷却装置用于半导体元件
公开(公告)号：US20110108247A1
公开(公告)日：2011-05-12
申请号：US12943417
申请日：2010-11-10
申请人： Masanori KAWAURA , Hirohito Matsui , Tadafumi Yoshida
发明人： Masanori KAWAURA , Hirohito Matsui , Tadafumi Yoshida
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor element cooling apparatus includes: a first member whose first surface on which a semiconductor element is mounted, and whose second surface has fins that define coolant flow paths, and that extend in a first direction, and that stand from the second surface to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member that defines the coolant flow paths that extend in the first direction. The fins have grooves which extend in a second direction that intersects the first direction, and which have a depth that extends from the distal end side of the fins toward the second surface. The depth of the grooves is smaller than the height of the fins. A protrusion-forming member is disposed in the grooves, and extends across adjacent fins, and forms protrusions in the coolant flow paths defined by the adjacent fins.
摘要翻译：一种半导体元件冷却装置，包括：第一构件，其第一表面上安装有半导体元件，并且其第二表面具有限定冷却剂流动路径的翅片，并且其在第一方向上延伸，并且从第二表面到第二表面预定高度，并且以预定间隔彼此间隔开; 以及限定沿第一方向延伸的冷却剂流动路径的第二构件。翅片具有沿与第一方向相交的第二方向延伸的凹槽，并且具有从翅片的远端侧朝向第二表面延伸的深度。槽的深度小于翅片的高度。突起形成构件设置在槽中并且延伸穿过相邻的翅片，并且在由相邻翅片限定的冷却剂流动路径中形成突起。

2. 发明授权

US08331092B2 Cooling apparatus for semiconductor element 有权
标题翻译：半导体元件冷却装置
公开(公告)号：US08331092B2
公开(公告)日：2012-12-11
申请号：US12943417
申请日：2010-11-10
申请人： Masanori Kawaura , Hirohito Matsui , Tadafumi Yoshida
发明人： Masanori Kawaura , Hirohito Matsui , Tadafumi Yoshida
IPC分类号： H05K7/20 , F28D7/00 , H01L23/34
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor element cooling apparatus includes: a first member whose first surface on which a semiconductor element is mounted, and whose second surface has fins that define coolant flow paths, and that extend in a first direction, and that stand from the second surface to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member that defines the coolant flow paths that extend in the first direction. The fins have grooves which extend in a second direction that intersects the first direction, and which have a depth that extends from the distal end side of the fins toward the second surface. The depth of the grooves is smaller than the height of the fins. A protrusion-forming member is disposed in the grooves, and extends across adjacent fins, and forms protrusions in the coolant flow paths defined by the adjacent fins.
摘要翻译：一种半导体元件冷却装置，包括：第一构件，其第一表面上安装有半导体元件，并且其第二表面具有限定冷却剂流动路径的翅片，并且其在第一方向上延伸，并且从第二表面到第二表面预定高度，并且以预定间隔彼此间隔开; 以及限定沿第一方向延伸的冷却剂流动路径的第二构件。翅片具有沿与第一方向相交的第二方向延伸的凹槽，并且具有从翅片的远端侧朝向第二表面延伸的深度。槽的深度小于翅片的高度。突起形成构件设置在槽中并且延伸穿过相邻的翅片，并且在由相邻翅片限定的冷却剂流动路径中形成突起。

3. 发明授权

US09523541B2 Cooling fin structure 有权
标题翻译：散热片结构
公开(公告)号：US09523541B2
公开(公告)日：2016-12-20
申请号：US14112328
申请日：2012-04-12
申请人： Masanori Kawaura , Hirohito Matsui , Tadafumi Yoshida
发明人： Masanori Kawaura , Hirohito Matsui , Tadafumi Yoshida
IPC分类号： F28F13/06 , F28F1/40 , F28F3/02 , H01L23/473 , H05K7/20
CPC分类号： F28F1/40 , F28F3/022 , F28F13/06 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/2039 , H05K7/20927 , H01L2924/00
摘要： A cooling fin structure used in a cooler for an electric device includes a plurality of pin fins (71) arranged in a zigzag form in a coolant passage (80). Each of the pin fins (71) has a circular portion (72) having a circular cross-section, and irregularly shaped portions (73) provided contiguously on the upstream and downstream sides of the circular portion (72) as viewed in a direction of flow of the coolant. The irregularly shaped portions (73) have an outer peripheral surface (75) that is formed along a circumference (130) having a center at a center point (101) of the circular portion (72) of a pin fin (71, 71B) that is located adjacent to the pin fin (71, 71A) having the irregularly shaped portions (73), in an oblique direction relative to the direction of flow of the coolant.
摘要翻译：在电气设备的冷却器中使用的冷却翅片结构包括在冷却剂通道（80）中以锯齿形布置的多个销翅片（71）。每个销翅片（71）具有圆形横截面的圆形部分（72），并且在圆形部分（72）的上游和下游侧连续设置的不规则形状的部分（73）冷却液流动。不规则形状的部分（73）具有沿着销翅（71,71B）的圆形部分（72）的中心点（101）的中心的圆周（130）形成的外周面（75）其相对于冷却剂的流动方向在倾斜方向上位于具有不规则形状部分（73）的销翅片（71,71A）附近。

4. 发明申请

US20140138063A1 COOLING FIN STRUCTURE 有权
标题翻译：冷却结构
公开(公告)号：US20140138063A1
公开(公告)日：2014-05-22
申请号：US14112328
申请日：2012-04-12
申请人： Masanori Kawaura , Hirohito Matsui , Tadafumi Yoshida
发明人： Masanori Kawaura , Hirohito Matsui , Tadafumi Yoshida
IPC分类号： F28F1/40 , H05K7/20
CPC分类号： F28F1/40 , F28F3/022 , F28F13/06 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/2039 , H05K7/20927 , H01L2924/00
摘要： A cooling fin structure used in a cooler for an electric device includes a plurality of pin fins (71) arranged in a zigzag form in a coolant passage (80). Each of the pin fins (71) has a circular portion (72) having a circular cross-section, and irregularly shaped portions (73) provided contiguously on the upstream and downstream sides of the circular portion (72) as viewed in a direction of flow of the coolant. The irregularly shaped portions (73) have an outer peripheral surface (75) that is formed along a circumference (130) having a center at a center point (101) of the circular portion (72) of a pin fin (71, 71B) that is located adjacent to the pin fin (71, 71A) having the irregularly shaped portions (73), in an oblique direction relative to the direction of flow of the coolant.
摘要翻译：在电气设备的冷却器中使用的冷却翅片结构包括在冷却剂通道（80）中以锯齿形布置的多个销翅片（71）。每个销翅片（71）具有圆形横截面的圆形部分（72），并且在圆形部分（72）的上游和下游侧连续设置的不规则形状的部分（73）冷却液流动。不规则形状的部分（73）具有沿着销翅（71,71B）的圆形部分（72）的中心点（101）的中心的圆周（130）形成的外周面（75）其相对于冷却剂的流动方向在倾斜方向上位于具有不规则形状部分（73）的销翅片（71,71A）附近。

5. 发明申请

US20130206375A1 COOLER 有权
标题翻译：冷却器
公开(公告)号：US20130206375A1
公开(公告)日：2013-08-15
申请号：US13879075
申请日：2010-12-24
申请人： Tadafumi Yoshida
发明人： Tadafumi Yoshida
IPC分类号： F28F3/02
CPC分类号： F28F3/02 , F28F3/022 , F28F3/048 , F28F3/12 , H01L23/473 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： A cooler is provided which comprises a heat discharging unit in which a plurality of heat discharge fins are placed in a line and a coolant flows in a passage between the heat discharge fins, an inflow-side coolant reservoir provided extending in a lined direction of the heat discharge fins and connected to a side of one end of the passage between the heat discharge fins through a first diaphragm portion, and an outflow-side coolant reservoir provided extending in the lined direction of the heat discharge fins and connected to a side of the other end of the passage between the heat discharge fins through a second diaphragm portion. An inflow-side fin is formed on a surface of the inflow-side coolant reservoir opposing the first diaphragm portion, and a circulation cross-sectional area of the inflow-side coolant reservoir is set smaller than a circulation cross-sectional area of the outflow-side coolant reservoir.
摘要翻译：提供了一种冷却器，其包括放热单元，其中多个散热片布置在一条线中，并且冷却剂在散热片之间的通道中流动，设置在沿着排出翅片的排列方向延伸的流入侧冷却剂储存器散热翅片，并且通过第一隔膜部分连接到散热片之间的通道一端的一侧，以及流出侧冷却剂储存器，其设置在散热片的排列方向上延伸并连接到散热片的一侧通过第二隔膜部分在散热片之间的通道的另一端。在流入侧冷却剂储存器的与第一隔膜部分相对的表面上形成流入侧散热片，并且将流入侧冷却剂储存器的循环横截面积设定为小于流出侧冷却剂流出口的循环截面面积侧冷却液箱。

6. 发明授权

US08294272B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US08294272B2
公开(公告)日：2012-10-23
申请号：US12728442
申请日：2010-03-22
申请人： Yasushi Yamada , Hiroshi Osada , Gentaro Yamanaka , Norifumi Furuta , Akio Kitami , Tadafumi Yoshida , Hiromichi Kuno
发明人： Yasushi Yamada , Hiroshi Osada , Gentaro Yamanaka , Norifumi Furuta , Akio Kitami , Tadafumi Yoshida , Hiromichi Kuno
IPC分类号： H01L23/36 , H01L23/38 , H01L23/34 , H01L25/07 , H01L23/48 , H01L25/16 , H01L35/28
CPC分类号： H01L23/38 , H01L23/427 , H01L23/62 , H01L23/642 , H01L24/29 , H01L24/32 , H01L25/074 , H01L25/16 , H01L2224/73253 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/30107
摘要： A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.
摘要翻译：功率模块包括堆叠有布置在其间的板状输出电极的一对功率器件，以及配置在其间的一对功率器件堆叠的N电极和P电极。输出电极是各向异性的，使得与层叠方向正交的方向的导热率大于层叠方向的导热率。此外，输出电极从堆叠的一对功率器件的堆叠区域沿正交方向延伸。 N电极和P电极在正交方向上延伸，同时保持相对的位置关系。

7. 发明授权

US08201650B2 Drive device for hybrid vehicle 有权
标题翻译：混合动力车用驱动装置
公开(公告)号：US08201650B2
公开(公告)日：2012-06-19
申请号：US12091935
申请日：2006-10-26
申请人： Tadafumi Yoshida
发明人： Tadafumi Yoshida
IPC分类号： H02P1/54
CPC分类号： B60K6/26 , B60K1/02 , B60K6/365 , B60K6/405 , B60K6/445 , B60K6/547 , B60L2200/26 , B60L2240/421 , B60L2240/423 , B60W10/08 , B60W20/00 , B60W2510/081 , B60W2710/083 , H02K11/01 , H02K11/048 , H02K51/00 , Y02T10/6239 , Y02T10/641 , Y02T10/642 , Y10S903/952
摘要： A casing for integrally accommodating a motor generator and an inverter includes an accommodating portion forming an inverter accommodating space, and an accommodating portion forming a motor accommodating space. The casing has a structure wherein the accommodating portions are integrally formed. Thereby, a drive device for a hybrid vehicle having the inverter and the motor generator accommodated in an integrated fashion prevents external leakage of electromagnetic noises of the inverter from the drive device.
摘要翻译：用于整体地容纳电动发电机和逆变器的壳体包括形成逆变器容纳空间的容纳部分和形成电动机容纳空间的容纳部分。壳体具有其中容纳部分整体形成的结构。由此，具有逆变器和电动发电机一体化的混合动力车辆的驱动装置防止逆变器的电磁噪声从驱动装置的外部泄漏。

8. 发明申请

US20100319876A1 SEMICONDUCTOR ELEMENT COOLING STRUCTURE 有权
标题翻译：半导体元件冷却结构
公开(公告)号：US20100319876A1
公开(公告)日：2010-12-23
申请号：US12526361
申请日：2008-02-04
申请人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yutaka Yokoi
IPC分类号： F28F13/00
CPC分类号： H01L23/345 , H01L23/34 , H01L23/473 , H01L24/37 , H01L24/40 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2224/40139 , H01L2924/00014
摘要： A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.
摘要翻译：半导体元件冷却结构包括半导体元件，其上安装有半导体元件的散热器和以与半导体元件相对的散热器相对的方式附接到半导体元件的蓄热构件，并且具有壳体和潜热蓄热材料。

9. 发明申请

US20100013331A1 COOLING STRUCTURE FOR INVERTER AND CAPACITOR ACCOMMODATED INTEGRALLY WITH MOTOR IN HOUSING OF MOTOR, MOTOR UNIT WITH COOLING STRUCTURE, AND HOUSING 有权
标题翻译：逆变器和电容器的冷却结构与电动机电机一体化，具有冷却结构的电机单元和壳体
公开(公告)号：US20100013331A1
公开(公告)日：2010-01-21
申请号：US12446671
申请日：2007-10-30
申请人： Tadafumi Yoshida , Masaki Yoshino , Yutaka Hotta
发明人： Tadafumi Yoshida , Masaki Yoshino , Yutaka Hotta
IPC分类号： H02K5/20 , B60H1/00 , F28D15/00 , H02K5/22
CPC分类号： H02K9/19 , H02K5/20 , H02K11/0094 , H02K11/048
摘要： Inside a housing, there are provided a motor generator (MG), an IPM, and a smoothing capacitor. Between the MG and the IPM, there is provided a cooler through which a coolant liquid flows, provided in an inclined manner to form contact with the top face of the IPM. Between the MG and the smoothing capacitor, there are provided a first communication channel through which an LLC flows from a region outside the housing into the cooler, brought into contact with a lateral face of the smoothing capacitor, and a second communication channel through which the LLC flows from the interior of the cooler to the region outside the housing.
摘要翻译：在壳体内设有电动发电机（MG），IPM和平滑电容器。在MG和IPM之间，设置有冷却剂，冷却剂液体以倾斜的方式流动，以与IPM的顶面形成接触。在MG和平滑电容器之间设置有第一通信通道，LLC通过该第一通信通道从壳体外部流入冷却器，与平滑电容器的侧面接触，以及第二通信通道，第二通信通道 LLC从冷却器的内部流动到壳体外部的区域。

10. 发明申请

US20090279276A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20090279276A1
公开(公告)日：2009-11-12
申请号：US12436976
申请日：2009-05-07
申请人： Tadafumi Yoshida , Hiroshi Osada , Yuji Yagi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yuji Yagi
IPC分类号： H05K7/06
CPC分类号： H01L23/367 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K2201/09054 , H05K2201/09745 , H01L2924/00
摘要： There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.
摘要翻译：提供了一种电子部件，其包括安装电子元件的绝缘部件和安装有绝缘部件的热扩散部件，其中绝缘部件的热膨胀系数低于绝缘部件的热膨胀系数热扩散构件和绝缘构件以嵌入的方式安装在形成在热扩散构件的表面上的凹部中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式