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1. 发明授权

US09358936B2 Electrical conduction path structure and wiring harness incorporating the same 有权
标题翻译：导电路径结构和包括其的线束
公开(公告)号：US09358936B2
公开(公告)日：2016-06-07
申请号：US13980275
申请日：2012-01-18
申请人： Hideomi Adachi , Hidehiko Kuboshima , Akio Kitami
发明人： Hideomi Adachi , Hidehiko Kuboshima , Akio Kitami
IPC分类号： B60R16/02 , B60L3/00
CPC分类号： B60R16/0207 , B60L3/0069
摘要： A wiring harness can include a plurality of high-voltage electrical conduction paths, a motor connector provided at one ends of the high-voltage electrical conduction paths, and an inverter connector provided at the other ends of the high-voltage electrical conduction paths. An extra-length portion can be provided at an intermediate portion of the conductor. The extra-length portion can be configured to absorb displacement caused by a force acting upon the wiring harness and forcing it to be extended. The extra-length portion can take a folded shape obtained by folding the conductor.
摘要翻译：线束可以包括多个高压导电路径，设置在高压导电路径的一端的马达连接器，以及设置在高压导电路径的另一端的反相器连接器。可以在导体的中间部分设置超长部分。超长部分可以被配置为吸收由作用在线束上的力引起的位移并迫使其延伸。超长部分可以采取通过折叠导体获得的折叠形状。

2. 发明申请

US20130003301A1 STACKED COOLER 审中-公开
标题翻译：堆垛机
公开(公告)号：US20130003301A1
公开(公告)日：2013-01-03
申请号：US13581296
申请日：2010-11-24
申请人： Shingo Miyamoto , Akio Kitami
发明人： Shingo Miyamoto , Akio Kitami
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H02M7/003 , H05K7/20927 , H01L2924/00
摘要： A stacked cooler includes a plurality of refrigerant flow passages and a plurality of semiconductor modules. The refrigerant flow passages and the semiconductor modules are stacked alternately, and each of opposite surfaces in a stacking direction of each of the semiconductor modules is in contact with a corresponding one of the refrigerant flow passages, thereby cooling the semiconductor modules. The semiconductor modules generate different amounts of heat. One or a plurality of the semiconductor modules and one or a plurality of the semiconductor modules are arranged in each of arrangement spaces adjacent to the refrigerant flow passages so that a difference in amount of heat generated between the respective arrangement spaces becomes small. Consequently, cooling capability is equalized throughout the respective arrangement spaces, enabling reduction in waste due to excessive cooling.
摘要翻译：堆叠冷却器包括多个制冷剂流动通道和多个半导体模块。制冷剂流动通道和半导体模块交替堆叠，并且每个半导体模块的层叠方向上的每个相对表面与相应的一个制冷剂流动通道接触，从而冷却半导体模块。半导体模块产生不同的热量。一个或多个半导体模块和一个或多个半导体模块布置在与制冷剂流动通道相邻的每个布置空间中，使得在各个排列空间之间产生的热量差异变小。因此，冷却能力在整个相应的布置空间中是相等的，从而能够减少由于过度冷却造成的浪费。

3. 发明申请

US20170271075A1 REACTOR AND MANUFACTURING METHOD OF THE SAME 审中-公开
公开(公告)号：US20170271075A1
公开(公告)日：2017-09-21
申请号：US15594092
申请日：2017-05-12
申请人： Akio KITAMI , Takashi ATSUMI , Nobuki SHINOHARA , Takeshi OKADA
发明人： Akio KITAMI , Takashi ATSUMI , Nobuki SHINOHARA , Takeshi OKADA
IPC分类号： H01F27/32 , H01F27/24 , H01F41/02 , H01F27/28
CPC分类号： H01F27/325 , H01F27/022 , H01F27/22 , H01F27/24 , H01F27/266 , H01F27/2823 , H01F27/2876 , H01F27/30 , H01F27/323 , H01F41/005 , H01F41/02 , H01F2027/406 , Y10T29/4902
摘要： A manufacturing method of a reactor includes: assembling an assembly constituted by a coil and a bobbin by inserting the bobbin, which includes a tube portion and a flange portion, through the coil so that a tip of the tube portion protrudes from the coil; forming a cavity by installing the assembly in a first die so that a portion of a coil lateral face comes into contact with a cavity face of the first die, and closing a second die so that the second die is opposed to the first die; and extending first press rods from a cavity face of the second die toward the bobbin in the cavity, and injecting a resin into the cavity while pressing both ends of the bobbin in an axial direction of the coil from an opposite side to the portion of the coil lateral face.

4. 发明申请

US20100237507A1 POWER MODULE 有权
标题翻译：电源模块
公开(公告)号：US20100237507A1
公开(公告)日：2010-09-23
申请号：US12728442
申请日：2010-03-22
申请人： Yasushi YAMADA , Hiroshi OSADA , Gentaro YAMANAKA , Norifumi FURUTA , Akio KITAMI , Tadafumi YOSHIDA , Hiromichi KUNO
发明人： Yasushi YAMADA , Hiroshi OSADA , Gentaro YAMANAKA , Norifumi FURUTA , Akio KITAMI , Tadafumi YOSHIDA , Hiromichi KUNO
IPC分类号： H01L23/34
CPC分类号： H01L23/38 , H01L23/427 , H01L23/62 , H01L23/642 , H01L24/29 , H01L24/32 , H01L25/074 , H01L25/16 , H01L2224/73253 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/30107
摘要： A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.
摘要翻译：功率模块包括堆叠有布置在其间的板状输出电极的一对功率器件，以及配置在其间的一对功率器件堆叠的N电极和P电极。输出电极是各向异性的，使得与层叠方向正交的方向的导热率大于层叠方向的导热率。此外，输出电极从堆叠的一对功率器件的堆叠区域沿正交方向延伸。 N电极和P电极在正交方向上延伸，同时保持相对的位置关系。

5. 发明授权

US09565792B2 Connection structure and inverter 有权
标题翻译：连接结构和变频器
公开(公告)号：US09565792B2
公开(公告)日：2017-02-07
申请号：US14082580
申请日：2013-11-18
申请人： Keitaro Ishikawa , Akio Kitami , Takashi Hamatani , Kunihiro Iwata , Satoshi Iguchi
发明人： Keitaro Ishikawa , Akio Kitami , Takashi Hamatani , Kunihiro Iwata , Satoshi Iguchi
IPC分类号： H05K7/20 , F16L5/12 , F16L21/02
CPC分类号： H05K7/20927 , F16L5/12 , F16L21/022 , F28F9/26
摘要： Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.
摘要翻译：制冷剂运行的两个开口通过第一连接管和第二连接管连接。第一连接管的一端通过平面密封件连接到第一开口。第一连接管的另一端通过轴封连接到第二连接管的一端。第二连接管的另一端通过平面密封件连接到第二开口。轴封的轴向垂直于包括第一开口的平面。

6. 发明申请

US20130299235A1 Electrical Conduction Path Structure and Wiring harness Incorporating the Same 有权
标题翻译：导电路径结构和配线线束结合在一起
公开(公告)号：US20130299235A1
公开(公告)日：2013-11-14
申请号：US13980275
申请日：2012-01-18
申请人： Hideomi Adachi , Hidehiko Kuboshima , Akio Kitami
发明人： Hideomi Adachi , Hidehiko Kuboshima , Akio Kitami
IPC分类号： B60R16/02
CPC分类号： B60R16/0207 , B60L3/0069
摘要： A wiring harness can include a plurality of high-voltage electrical conduction paths, a motor connector provided at one ends of the high-voltage electrical conduction paths, and an inverter connector provided at the other ends of the high-voltage electrical conduction paths. An extra-length portion can be provided at an intermediate portion of the conductor. The extra-length portion can be configured to absorb displacement caused by a force acting upon the wiring harness and forcing it to be extended. The extra-length portion can take a folded shape obtained by folding the conductor.
摘要翻译：线束可以包括多个高压导电路径，设置在高压导电路径的一端的马达连接器，以及设置在高压导电路径的另一端的反相器连接器。可以在导体的中间部分设置超长部分。超长部分可以被配置为吸收由作用在线束上的力引起的位移并迫使其延伸。超长部分可以采取通过折叠导体获得的折叠形状。

7. 发明授权

US08294272B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US08294272B2
公开(公告)日：2012-10-23
申请号：US12728442
申请日：2010-03-22
申请人： Yasushi Yamada , Hiroshi Osada , Gentaro Yamanaka , Norifumi Furuta , Akio Kitami , Tadafumi Yoshida , Hiromichi Kuno
发明人： Yasushi Yamada , Hiroshi Osada , Gentaro Yamanaka , Norifumi Furuta , Akio Kitami , Tadafumi Yoshida , Hiromichi Kuno
IPC分类号： H01L23/36 , H01L23/38 , H01L23/34 , H01L25/07 , H01L23/48 , H01L25/16 , H01L35/28
CPC分类号： H01L23/38 , H01L23/427 , H01L23/62 , H01L23/642 , H01L24/29 , H01L24/32 , H01L25/074 , H01L25/16 , H01L2224/73253 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/30107
摘要： A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.
摘要翻译：功率模块包括堆叠有布置在其间的板状输出电极的一对功率器件，以及配置在其间的一对功率器件堆叠的N电极和P电极。输出电极是各向异性的，使得与层叠方向正交的方向的导热率大于层叠方向的导热率。此外，输出电极从堆叠的一对功率器件的堆叠区域沿正交方向延伸。 N电极和P电极在正交方向上延伸，同时保持相对的位置关系。

8. 发明申请

US20140151138A1 AUTOMOBILE HAVING ELECTRIC VEHICLE DRIVE MOTOR 有权
标题翻译：具有电动车驱动电机的汽车
公开(公告)号：US20140151138A1
公开(公告)日：2014-06-05
申请号：US14237392
申请日：2012-08-06
申请人： Akio Kitami , Tatsuyuki Uechi
发明人： Akio Kitami , Tatsuyuki Uechi
IPC分类号： H02H5/00 , B60K6/20 , B60K1/04
CPC分类号： H02H5/00 , B60K1/04 , B60K6/20 , B60K2028/006 , B60L1/00 , B60L1/003 , B60L3/0061 , B60L3/04 , B60L11/08 , B60L11/12 , B60L11/14 , B60L11/1868 , B60L2210/10 , B60L2210/40 , B60R16/0215 , B60R16/04 , B60Y2400/61 , H02G3/14 , H02K5/225 , Y02T10/7005 , Y02T10/7066 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y10S903/903 , Y10S903/951
摘要： An automobile includes: a controller for controlling a motor; a main battery for supplying electric power to the motor via the controller; a normally open relay interposed in an electric power supply path extending from the main battery to the controller; and a sub-battery for supplying the electric power to the relay. The controller is mounted with a terminal cover that covers an output terminal for connection with a power supply cable to the motor. The sub-battery is disposed adjacent to the controller so as to interfere with the removal of the terminal cover by a worker.
摘要翻译：汽车包括：用于控制电动机的控制器; 用于经由所述控制器向所述电动机供电的主电池; 插入在从主电池延伸到控制器的电力供给路径中的常开继电器; 以及用于向继电器供电的副电池。控制器安装有端子盖，覆盖用于与电动机的电源电缆连接的输出端子。子电池与控制器相邻设置，以便干扰工作人员移除端子盖。

9. 发明申请

US20140140118A1 CONNECTION STRUCTURE AND INVERTER 有权
标题翻译：连接结构与逆变器
公开(公告)号：US20140140118A1
公开(公告)日：2014-05-22
申请号：US14082580
申请日：2013-11-18
申请人： Keitaro ISHIKAWA , Akio Kitami , Takashi Hamatani , Kunihiro Iwata , Satoshi Iguchi
发明人： Keitaro ISHIKAWA , Akio Kitami , Takashi Hamatani , Kunihiro Iwata , Satoshi Iguchi
IPC分类号： F16L23/16 , H05K7/20
CPC分类号： H05K7/20927 , F16L5/12 , F16L21/022 , F28F9/26
摘要： Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.
摘要翻译：制冷剂运行的两个开口通过第一连接管和第二连接管连接。第一连接管的一端通过平面密封件连接到第一开口。第一连接管的另一端通过轴封连接到第二连接管的一端。第二连接管的另一端通过平面密封件连接到第二开口。轴封的轴向垂直于包括第一开口的平面。

10. 发明申请

US20120228757A1 COOLING STRUCTURE OF SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件的冷却结构
公开(公告)号：US20120228757A1
公开(公告)日：2012-09-13
申请号：US13511305
申请日：2009-11-25
申请人： Akio Kitami , Takashi Ueno
发明人： Akio Kitami , Takashi Ueno
IPC分类号： H01L23/36
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/36 , H01L25/074 , H01L2224/32245 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： A cooling structure of a semiconductor device includes an output electrode, a semiconductor element and a semiconductor element disposed to face each other with the output electrode interposed therebetween, a radiator disposed for the semiconductor element on a side opposite to the output electrode, and a radiator disposed for the semiconductor element on the side opposite to the output electrode. The output electrode includes an element mounting portion and a heat transport portion. The element mounting portion is electrically connected to the semiconductor element and the semiconductor element, and is formed of a conductive material. The heat transport portion is disposed to extend from the element mounting portion toward the radiator and the radiator. With this structure, a cooling structure of a semiconductor device with which excellent cooling efficiency is realized can be provided.
摘要翻译：半导体器件的冷却结构包括输出电极，半导体元件和半导体元件，半导体元件和半导体元件设置成彼此相对，输出电极介于其间;散热器，设置在半导体元件的与输出电极相对的一侧，散热器设置在与输出电极相对的一侧上的半导体元件。输出电极包括元件安装部分和热传输部分。元件安装部分电连接到半导体元件和半导体元件，并且由导电材料形成。热传输部分从元件安装部分朝向散热器和散热器设置。利用这种结构，可以提供实现优异的冷却效率的半导体器件的冷却结构。

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