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    • 2. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT
    • 半导体集成电路
    • US20080174359A1
    • 2008-07-24
    • US11942939
    • 2007-11-20
    • Kenichi OSADAMasanao YamaokaShigenobu Komatsu
    • Kenichi OSADAMasanao YamaokaShigenobu Komatsu
    • H03K3/01
    • H03K19/0008H03K2217/0018
    • A substrate bias technique is used in an active mode enabling a high yield, and an operating consumption power and the fluctuation of a signal delay in signal processing are reduced in the active mode. The additional PMOS and NMOS of the additional capacitance circuit are produced in the same production process as the PMOSs and the NMOSs of the CMOS circuits. The gate capacitance of the additional PMOS is coupled between the power supply wiring and the N well and the gate capacitance of the additional NMOS is coupled between the ground wiring and the P well. The noise on the power supply wiring is transmitted to the N well through the gate capacitance and the noise on the ground wiring is transmitted to the P well through the gate capacitance. The fluctuation of noise on the substrate bias voltage between the source and the well of PMOS and NMOS of the CMOS circuits is reduced.
    • 在有源模式中使用基板偏压技术,能够实现高产量,并且在活动模式中降低了操作消耗功率和信号处理中的信号延迟的波动。 附加电容电路的附加PMOS和NMOS在与CMOS电路的PMOS和NMOS的生产过程相同的情况下生产。 附加PMOS的栅极电容耦合在电源布线和N阱之间,附加NMOS的栅极电容耦合在接地布线和P阱之间。 电源线上的噪声通过栅极电容传输到N阱,接地线上的噪声通过栅极电容传输到P阱。 CMOS电路的PMOS和NMOS的源极和阱之间的衬底偏置电压上的噪声波动减小。
    • 3. 发明授权
    • Semiconductor integrated circuit and manufacturing method thereof
    • 半导体集成电路及其制造方法
    • US08531872B2
    • 2013-09-10
    • US13350340
    • 2012-01-13
    • Masanao YamaokaKenichi OsadaShigenobu Komatsu
    • Masanao YamaokaKenichi OsadaShigenobu Komatsu
    • G11C11/00
    • G11C11/417
    • High manufacturing yield is realized and variation in threshold voltage of each MOS transistor in a CMOS·SRAM is compensated. Body bias voltages are applied to wells for MOS transistors of each SRAM memory cell in any active mode of an information holding operation, a write operation and a read operation of an SRAM. Threshold voltages of PMOS and NMOS transistors of the SRAM are first measured. Control information is programmed into control memories according to results of determination. Levels of the body bias voltages are adjusted based on the programs so that variations in the threshold voltages of the MOS transistors of the CMOS·SRAM are controlled to a predetermined error span. Body bias voltage corresponding to a reverse body bias or an extremely shallow forward body bias is applied to a substrate for the MOS transistors with an operating voltage applied to the source of each MOS transistor.
    • 实现了高制造成品率,补偿了CMOS·SRAM中的每个MOS晶体管的阈值电压的变化。 在SRAM的信息保持操作,写入操作和读取操作的任何活动模式中,将体偏置电压施加到每个SRAM存储器单元的MOS晶体管的阱。 首先测量SRAM的PMOS和NMOS晶体管的阈值电压。 控制信息根据确定结果被编程到控制存储器中。 基于程序调整体偏置电压的电平,使得CMOS·SRAM的MOS晶体管的阈值电压的变化被控制到预定的误差范围。 将对应于反体偏置或非常浅的正向体偏置的体偏置电压施加到施加到每个MOS晶体管的源极的工作电压的MOS晶体管的衬底。
    • 4. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR
    • 半导体集成电路及其制造方法
    • US20100027322A1
    • 2010-02-04
    • US12563231
    • 2009-09-21
    • Masanao YamaokaKenichi OsadaShigenobu Komatsu
    • Masanao YamaokaKenichi OsadaShigenobu Komatsu
    • G11C11/00G11C7/00
    • G11C11/417
    • In this invention, high manufacturing yield is realized and variations in threshold voltage of each MOS transistor in a CMOS•SRAM is compensated. Body bias voltages are applied to wells for MOS transistors of each SRAM memory cell in any active mode of an information holding operation, a write operation and a read operation of an SRAM. The threshold voltages of PMOS and NMOS transistors of the SRAM are first measured. Control information is respectively programmed into control memories according to the results of determination. The levels of the body bias voltages are adjusted based on the programs so that variations in the threshold voltages of the MOS transistors of the CMOS•SRAM are controlled to a predetermined error span. A body bias voltage corresponding to a reverse body bias or an extremely shallow forward body bias is applied to a substrate for the MOS transistors with an operating voltage applied to the source of each MOS transistor.
    • 在本发明中,实现了高制造成品率,并补偿了CMOS.SRAM中的每个MOS晶体管的阈值电压的变化。 在SRAM的信息保持操作,写入操作和读取操作的任何活动模式中,将体偏置电压施加到每个SRAM存储器单元的MOS晶体管的阱。 首先测量SRAM的PMOS和NMOS晶体管的阈值电压。 控制信息根据测定结果分别被编程到控制存储器中。 基于程序调整体偏置电压的电平,使得CMOS.SRAM的MOS晶体管的阈值电压的变化被控制到预定的误差范围。 将对应于反体偏置或非常浅的正向体偏置的体偏置施加到施加到每个MOS晶体管的源极的工作电压的MOS晶体管的衬底。
    • 5. 发明授权
    • Semiconductor integrated circuit and manufacturing method therefor
    • 半导体集成电路及其制造方法
    • US08107279B2
    • 2012-01-31
    • US12563231
    • 2009-09-21
    • Masanao YamaokaKenichi OsadaShigenobu Komatsu
    • Masanao YamaokaKenichi OsadaShigenobu Komatsu
    • G11C11/00
    • G11C11/417
    • High manufacturing yield is realized and variations in threshold voltage of each MOS transistor in a CMOS.SRAM is compensated. Body bias voltages are applied to wells for MOS transistors of each SRAM memory cell in any active mode of an information holding operation, a write operation and a read operation of an SRAM. The threshold voltages of PMOS and NMOS transistors of the SRAM are first measured. Control information is respectively programmed into control memories according to the results of determination. The levels of the body bias voltages are adjusted based on the programs so that variations in the threshold voltages of the MOS transistors of the CMOS.SRAM are controlled to a predetermined error span. A body bias voltage corresponding to a reverse body bias or an extremely shallow forward body bias is applied to a substrate for the MOS transistors with an operating voltage applied to the source of each MOS transistor.
    • 实现了高制造产量,并补偿了CMOS.SRAM中每个MOS晶体管的阈值电压的变化。 在SRAM的信息保持操作,写入操作和读取操作的任何活动模式中,将体偏置电压施加到每个SRAM存储器单元的MOS晶体管的阱。 首先测量SRAM的PMOS和NMOS晶体管的阈值电压。 控制信息根据测定结果分别被编程到控制存储器中。 基于程序调整体偏置电压的电平,使得CMOS.SRAM的MOS晶体管的阈值电压的变化被控制到预定的误差范围。 将对应于反体偏置或非常浅的正向体偏置的体偏置施加到施加到每个MOS晶体管的源极的工作电压的MOS晶体管的衬底。
    • 6. 发明授权
    • Semiconductor integrated circuit and manufacturing method therefor
    • 半导体集成电路及其制造方法
    • US07596013B2
    • 2009-09-29
    • US11943495
    • 2007-11-20
    • Masanao YamaokaKenichi OsadaShigenobu Komatsu
    • Masanao YamaokaKenichi OsadaShigenobu Komatsu
    • G11C11/00
    • G11C11/417
    • High manufacturing yield is realized and variations in threshold voltage of each MOS transistor in a CMOS•SRAM is compensated. Body bias voltages are applied to wells for MOS transistors of each SRAM memory cell in any active mode of an information holding operation, a write operation and a read operation of an SRAM. The threshold voltages of PMOS and NMOS transistors of the SRAM are first measured. Control information is respectively programmed into control memories according to the results of determination. The levels of the body bias voltages are adjusted based on the programs so that variations in the threshold voltages of the MOS transistors of the CMOS•SRAM are controlled to a predetermined error span. A body bias voltage corresponding to a reverse body bias or an extremely shallow forward body bias is applied to a substrate for the MOS transistors with an operating voltage applied to the source of each MOS transistor.
    • 实现了高制造产量,并补偿了CMOS.SRAM中每个MOS晶体管的阈值电压的变化。 在SRAM的信息保持操作,写入操作和读取操作的任何活动模式中,将体偏置电压施加到每个SRAM存储器单元的MOS晶体管的阱。 首先测量SRAM的PMOS和NMOS晶体管的阈值电压。 控制信息根据测定结果分别被编程到控制存储器中。 基于程序调整体偏置电压的电平,使得CMOS.SRAM的MOS晶体管的阈值电压的变化被控制到预定的误差范围。 将对应于反体偏置或非常浅的正向体偏置的体偏置施加到施加到每个MOS晶体管的源极的工作电压的MOS晶体管的衬底。
    • 10. 发明申请
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US20070297270A1
    • 2007-12-27
    • US11812193
    • 2007-06-15
    • Shigenobu KomatsuMasanao Yamaoka
    • Shigenobu KomatsuMasanao Yamaoka
    • G11C8/00G11C11/00
    • G11C8/08G11C8/18G11C11/412
    • The present invention provides a technique capable of achieving area reduction on a semiconductor integrated circuit device mounted with a time sharing virtual multi port memory or the like. By providing a configuration including a single port memory, data latch circuit for plural ports, a selector for selecting a port to be connected to the single port memory, a time sharing control signal generating circuit and the like, in which an operation termination signal inside the single port memory (a word line rising signal, a sense amplifier driving signal for data read or the like) is inputted to the time sharing control signal generating circuit to produce a port switching control signal and an operation control signal for the single port memory, a time sharing virtual multi port memory with a reduced area can be realized which requires no clock generating circuit for time sharing control newly.
    • 本发明提供一种能够在安装有时间分配虚拟多端口存储器等的半导体集成电路装置上实现面积缩小的技术。 通过提供包括单端口存储器,用于多个端口的数据锁存电路,用于选择要连接到单端口存储器的端口的选择器,时间共享控制信号生成电路等,其中内部的操作终止信号 将单端口存储器(字线上升信号,用于数据读取的读出放大器驱动信号等)输入到时间共享控制信号发生电路,以产生用于单端口存储器的端口切换控制信号和操作控制信号 可以实现具有减小面积的虚拟多端口存储器的时间分配,这不需要新的时间分配控制的时钟发生电路。