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    • 2. 发明申请
    • Surface Inspection Method and Surface Inspection Apparatus
    • 表面检查方法和表面检查装置
    • US20080013084A1
    • 2008-01-17
    • US11776912
    • 2007-07-12
    • Shigeru MATSUIMasayuki HACHIYA
    • Shigeru MATSUIMasayuki HACHIYA
    • G01N21/88
    • G01N21/9501H01L22/12H01L2924/0002H01L2924/00
    • In order to realize a surface inspection apparatus capable of inspecting a contaminant particle and a defect with a uniform sensitivity without depending on a rotation angle in a primary scan direction even in the case where intensity of scattered light, which is generated derived from the contaminant particle and the defect existing on the surface of a semiconductor wafer or adjacent to the surface, has anisotropy which depends on an illumination direction; light from a light source 11 becomes two illumination beams 21 and 22 by a beam splitter 12, the beams being irradiated onto a semiconductor wafer 100 from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots 3 and 4. When the sum of scattered, diffracted, and reflected lights due to the illumination beams 21 and 22 is detected; influence of the anisotropy which a contaminant particle and a defect existing in the wafer 100 itself or thereon have with respect to an illumination direction, can be eliminated. This makes it possible to inspect a contaminant particle, defect, and the like with a uniform sensitivity without depending on a rotation angle in a primary scan direction even in the case where intensity of the scattered light generated derived from the contaminant particle, defect, and the like depends on the illumination direction.
    • 为了实现能够在不影响初级扫描方向的旋转角度的情况下检测污染物质和缺陷的表面检查装置,即使在从污染物粒子产生的散射光强度的情况下, 并且存在于半导体晶片的表面上或与表面相邻的缺陷具有取决于照明方向的各向异性; 来自光源11的光通过分束器12变成两个照明光束21和22,这些光束从具有基本相等的仰角的两个相互基本上正交的方位角照射到半导体晶片100上,以形成照明点3和4.当 检测由于照明光束21和22引起的散射,衍射和反射光的总和; 可以消除晶片100本身或其上存在的污染颗粒和缺陷相对于照明方向的各向异性的影响。 这使得可以在不依赖于主扫描方向上的旋转角度的情况下以均匀的灵敏度检查污染物颗粒,缺陷等,即使在由污染物颗粒产生的散射光的强度,缺陷和 这取决于照明方向。