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1. 发明授权

US06337414B1 Process for producing partial glyceride 有权
标题翻译：制备偏甘油酯的方法
公开(公告)号：US06337414B1
公开(公告)日：2002-01-08
申请号：US09743218
申请日：2001-01-08
申请人： Masakatsu Sugiura , Masami Shimizu , Yasushi Yamada , Kouji Mine , Eizo Maruyama , Naoto Yamada
发明人： Masakatsu Sugiura , Masami Shimizu , Yasushi Yamada , Kouji Mine , Eizo Maruyama , Naoto Yamada
IPC分类号： C07C5143
CPC分类号： C12P7/6418 , C12P7/6445
摘要： The invention relates to a process for preparing a partial glyceride, which includes, in a glycerolysis reaction of oil or fat making use of a lipase, conducting the reaction in the presence of water under conditions that crystals are partially precipitated in the reaction system in the course of the reaction and the concentration of free fatty acids in an oil phase amounts to at least 5% by weight.
摘要翻译：本发明涉及一种制备偏甘油酯的方法，该方法在使用脂肪酶的油脂的甘油分解反应中包括在水的存在下，在晶体在反应体系中部分沉淀的条件下进行反应油相中游离脂肪酸的反应过程和游离脂肪酸的浓度至少为5重量％。

2. 发明授权

US06261812B1 Process for producing diglycerides 失效
标题翻译：生产甘油二酯的方法
公开(公告)号：US06261812B1
公开(公告)日：2001-07-17
申请号：US09070006
申请日：1998-04-30
申请人： Yasushi Yamada , Masami Shimizu , Masakatsu Sugiura , Naoto Yamada
发明人： Yasushi Yamada , Masami Shimizu , Masakatsu Sugiura , Naoto Yamada
IPC分类号： C12P764
CPC分类号： C12P7/6454 , C11C1/04 , C11C1/045 , C11C3/02 , C11C3/06
摘要： A process for producing diglycerides is provided by which high-purity diglycerides can be produced at a lower cost and more efficiently than conventional esterification and glycerolysis processes, and which inhibits the deterioration of oil quality, such as discoloration, and the loss of trace active ingredients derived from a feedstock of fats and oils, which involves partially hydrolyzing a fat or oil, followed by esterifying the resultant product with glycerol.
摘要翻译：提供了一种生产甘油二酯的方法，通过该方法可以以比常规酯化和甘油分解方法更低的成本和更有效地生产高纯度甘油二酯，并且其抑制油质量的劣化，例如变色和痕量活性成分的损失衍生自脂肪和油的原料，其涉及部分水解脂肪或油，然后用甘油酯化所得产物。

3. 发明授权

US08471386B2 Junction body, semiconductor module, and manufacturing method for junction body 失效
标题翻译：接合体，半导体模块及接合体的制造方法
公开(公告)号：US08471386B2
公开(公告)日：2013-06-25
申请号：US13148150
申请日：2010-02-02
申请人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
发明人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
IPC分类号： H01L23/48
CPC分类号： B23K35/007 , B22F7/006 , B22F7/08 , B23K35/262 , B23K35/28 , B23K35/30 , B32B15/01 , C22C9/02 , C22C13/00 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/83801 , H01L2224/83805 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1517 , H01L2924/15787 , H01L2924/1579 , H01L2924/351 , H01L2924/05432 , H01L2924/00 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014
摘要： A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.
摘要翻译：接合体具有第一构件和第二构件，每个构件具有主要成分为铜的接合表面。在锡基焊料中含有主要成分为铜的三维网状结构的焊料构件设置在第一构件和第二构件之间。平均厚度为2μm以上且20μm以下的铜锡合金设置在接合面和三维网状结构体之间。

4. 发明申请

US20130085270A1 MANUFACTURING METHOD FOR POLYPHENOL COMPOSITION 有权
公开(公告)号：US20130085270A1
公开(公告)日：2013-04-04
申请号：US13703220
申请日：2011-06-08
申请人： Yasushi Yamada , Keigo Hanaki , Toshiteru Komatsu
发明人： Yasushi Yamada , Keigo Hanaki , Toshiteru Komatsu
IPC分类号： C07H17/07
CPC分类号： C07H17/07 , A61K31/05 , A61K31/192 , A61K31/366 , A61K31/7048 , Y02P20/582
摘要： A method for producing a polyphenol composition including a step of subjecting (A) a hardly water-soluble polyphenol and (B) one or more selected from cathechins, chlorogenic acids and methylated compounds of hardly water-soluble polyphenols to a heat treatment at from 100 to 180° C. in the presence of an aqueous medium.

5. 发明申请

US20110091689A1 POLYURETHANE FOAM FOR FLAME-LAMINATING 有权
标题翻译：聚氨酯泡沫用于火焰层压
公开(公告)号：US20110091689A1
公开(公告)日：2011-04-21
申请号：US12997878
申请日：2009-06-23
申请人： Fuminori Horio , Yasushi Yamada
发明人： Fuminori Horio , Yasushi Yamada
IPC分类号： B32B3/12
CPC分类号： C08G18/4837 , C08G18/165 , C08G18/18 , C08G18/2027 , C08G18/246 , C08G18/4018 , C08G18/4072 , C08G18/4261 , C08G18/48 , C08G18/632 , C08G2101/00 , C08G2101/0083 , Y10T428/24512 , Y10T428/249953
摘要： The object of the present invention is to provide a polyurethane foam for flame lamination which has an excellent balance between adhesiveness to a fabric comprising synthetic fibers or natural fibers, a leather or the like and residual compression strain and has an excellent wet-heat resistance, and a laminated body including a foamed material layer consisting of the polyurethane foam. The polyurethane foam for flame lamination is characterized by being produced using a foam raw material containing a polyol such as a polyether polyol, a polyisocyanate, a foaming agent, a foam control agent, an amine-based catalyst and a urea compound such as urea and azodicarbonamide.
摘要翻译：本发明的目的是提供一种用于火焰层压的聚氨酯泡沫，其在与包含合成纤维或天然纤维的织物的粘合性，皮革等之间和残余压缩应变之间具有优异的平衡，并且具有优异的耐湿热性，以及包含由聚氨酯泡沫构成的发泡材料层的层叠体。用于火焰层压的聚氨酯泡沫的特征在于使用含有多元醇的泡沫原料，例如聚醚多元醇，多异氰酸酯，发泡剂，泡沫控制剂，胺类催化剂和尿素化合物如尿素和偶氮二甲酰胺。

6. 发明申请

US20100109016A1 POWER SEMICONDUCTOR MODULE 审中-公开
标题翻译：功率半导体模块
公开(公告)号：US20100109016A1
公开(公告)日：2010-05-06
申请号：US12596382
申请日：2008-04-17
申请人： Yuji Yagi , Yasushi Yamada , Ikuo Nakagawa , Takashi Atsumi , Mikio Shirai , Ikuo Ohnuma , Kiyohito Ishida , Yoshikazu Takaku
发明人： Yuji Yagi , Yasushi Yamada , Ikuo Nakagawa , Takashi Atsumi , Mikio Shirai , Ikuo Ohnuma , Kiyohito Ishida , Yoshikazu Takaku
IPC分类号： H01L23/488 , H01L29/12
CPC分类号： H01L23/3735 , H01L23/473 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83447 , H01L2224/838 , H01L2224/83805 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/1579 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2224/83205
摘要： Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.
摘要翻译：提供了一种功率半导体模块，其中两个部件通过Bi基焊料材料接合。在其表面上设置有Cu层，以通过Bi基焊料材料粘接在双组分上。两个部件，即待接合的部件，是半导体元件和绝缘部件的组合，或绝缘部件和散热器板的组合。绝缘部由Cu / SiNx / Cu层叠体构成。

7. 发明申请

US20090138728A1 Program update method and server 有权
公开(公告)号：US20090138728A1
公开(公告)日：2009-05-28
申请号：US12081889
申请日：2008-04-23
申请人： Makoto Fujiwara , Yusuke Nemoto , Junichi Yasui , Takuji Maeda , Takayuki Ito , Yasushi Yamada , Shinji Inoue
发明人： Makoto Fujiwara , Yusuke Nemoto , Junichi Yasui , Takuji Maeda , Takayuki Ito , Yasushi Yamada , Shinji Inoue
IPC分类号： G06F12/14
CPC分类号： G06F21/123 , G06F21/572 , G06F21/72
摘要： A system including a secure LSI 1 establishes a communication path to/from a server 3 (UD1), and receives a common key-encrypted program generated by encryption with a common key and transmitted from the server 3 (UD6 and UD7). The received common key-encrypted program is decrypted to generate a raw program, and the raw program is re-encrypted with an inherent key to newly generate an inherent key-encrypted program, which is stored in an external memory.

8. 发明授权

US07325975B2 Optical module with lever that abuts case to release latch from locking state with cage which accommodates optical module 失效
标题翻译：具有杆的光学模块，其与壳体抵接以将锁定器从锁定状态释放，其具有容纳光学模块的保持架
公开(公告)号：US07325975B2
公开(公告)日：2008-02-05
申请号：US10844500
申请日：2004-05-13
申请人： Yasushi Yamada , Masayuki Nakano
发明人： Yasushi Yamada , Masayuki Nakano
IPC分类号： G02B6/40
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4246 , G02B6/4261
摘要： An optical module has a lever for bending a spring plate possessed by a cage for accommodating a case of the optical module in a direction in which a retaining hole formed through the spring plate comes off a latch formed on the case. The lever has a shaft pivotably supported on the case, a tongue disposed on one side of the shaft, and an actuator disposed on the opposite side of the shaft with respect to the tongue. The lever pivotally moves about the shaft in response to a movement of the tongue toward the case, causing the actuator to press the spring plate to bend in the foregoing direction. A user can readily release the latch by moving the tongue toward the case, and withdraw the optical module from the cage through a simple manipulation of pulling the case out while holding the case and tongue together.
摘要翻译：光学模块具有用于弯曲由用于容纳光学组件的壳体的保持架所具有的弹簧板的杆，该弹簧板沿着通过弹簧板形成的保持孔脱离形成在壳体上的闩锁的方向。所述杠杆具有可枢转地支撑在所述壳体上的轴，设置在所述轴的一侧上的舌片以及相对于所述舌片设置在所述轴的相对侧上的致动器。响应于舌头朝向壳体的移动，杠杆绕轴转动，致使致动器按压弹簧板沿前述方向弯曲。用户可以通过将舌头朝向壳体移动而容易地释放闩锁，并且通过简单的操纵将外壳和舌头保持在一起来拉出外壳，从而将光学模块从笼子中取出。

9. 发明申请

US20060057768A1 Semiconductor element heat dissipating member, semiconductor device using same and manufacturing same 失效
标题翻译：半导体元件散热构件，使用其的半导体器件及其制造
公开(公告)号：US20060057768A1
公开(公告)日：2006-03-16
申请号：US10538222
申请日：2003-12-09
申请人： Kazuyuki Nakanishi , Tadashi Oshima , Hideo Hasegawa , Hiroyuki Mori , Hideo Tachikawa , Yukio Miyachi , Yasushi Yamada , Hiroyuki Ueda , Masayasu Ishiko
发明人： Kazuyuki Nakanishi , Tadashi Oshima , Hideo Hasegawa , Hiroyuki Mori , Hideo Tachikawa , Yukio Miyachi , Yasushi Yamada , Hiroyuki Ueda , Masayasu Ishiko
IPC分类号： H01L21/44
CPC分类号： H01L23/3732 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.
摘要翻译：提供了具有优异的散热特性和粘合特性的半导体元件散热构件，并且能够以低成本制造半导体器件。还提供了使用该半导体器件的半导体器件及其制造方法。半导体元件散热构件具有导电基板和含有氢的电绝缘非晶碳膜，并且至少在导电基板的要安装半导体元件的区域的区域上形成电绝缘非晶碳膜。

10. 发明授权

US06899793B2 Method of manufacturing pulp mold formed body 有权
标题翻译：制造纸浆成型体的方法
公开(公告)号：US06899793B2
公开(公告)日：2005-05-31
申请号：US10182743
申请日：2001-02-16
申请人： Akira Nonomura , Yasushi Yamada , Tokuo Tsuura , Hiroaki Kobayashi , Kenichi Otani
发明人： Akira Nonomura , Yasushi Yamada , Tokuo Tsuura , Hiroaki Kobayashi , Kenichi Otani
IPC分类号： D21J3/10 , D21J7/00
CPC分类号： D21J7/00 , D21J3/10
摘要： A method of producing a pulp molded article. The method feeds a pulp slurry to a cavity of a papermaking mold having a prescribed cavity shape to form a pulp preform including a main part having an opening and a separable part having a flange and connected to an edge of the opening. A pressing member is inserted into the preform, the pressing member is expanded to press the preform toward the papermaking surface, the preform is removed from the papermaking mold, and then the preform is cut at a joint between the separable part and the main part.
摘要翻译：制造纸浆模制品的方法。该方法将纸浆浆料送入具有规定腔体形状的造纸模具的空腔，以形成纸浆预制件，该纸浆预制件包括具有开口的主要部分和具有凸缘的可分离部分并与开口的边缘连接。将压紧构件插入预制件中，将加压构件膨胀以将预制件推向造纸表面，将预成型件从造纸模具中取出，然后在可分离部分和主要部分之间的接头处切割预成型件。

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