专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080178917A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20080178917A1
公开(公告)日：2008-07-31
申请号：US12015880
申请日：2008-01-17
申请人： Masahiro Miyagi , Masanobu SATO
发明人： Masahiro Miyagi , Masanobu SATO
IPC分类号： B08B3/04
CPC分类号： B08B3/10 , H01L21/67051 , H01L21/6708
摘要： A substrate processing apparatus has an ejection part for ejecting conductive processing liquid toward a substrate in a state where the processing liquid flows continuously and constantly. A conductive liquid contact part is provided in the vicinity of an outlet in the ejection part, and is connected to a potential applying part. The substrate to be processed is charged by induction because of charging of a cup part surrounding the substrate. When the substrate is processed by applying the processing liquid onto the substrate, an electric potential is applied to the processing liquid through the liquid contact part at the start time of ejection of the processing liquid, to decrease an electric potential difference generated between the substrate and the processing liquid ejected onto the substrate. With this operation, it is possible to suppress damage to the substrate caused by electric discharge occurring between the processing liquid and the substrate.
摘要翻译：基板处理装置具有用于在处理液体连续不断地流动的状态下朝向基板喷射导电处理液的喷射部。导电液体接触部分设置在喷射部分的出口附近，并连接到电位施加部分。由于对围绕基板的杯部进行充电，被处理基板通过感应进行充电。当通过将处理液体施加到基板上来处理基板时，在喷射处理液体的开始时间通过液体接触部分向处理液体施加电位，以减小基板与基板之间产生的电位差处理液体喷射到基板上。通过该操作，可以抑制在处理液和基板之间发生的放电对基板的损坏。

2. 发明申请

US20130327365A1 SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS 审中-公开
标题翻译：基板清洗方法和基板清洗装置
公开(公告)号：US20130327365A1
公开(公告)日：2013-12-12
申请号：US13965285
申请日：2013-08-13
申请人： Masanobu SATO
发明人： Masanobu SATO
IPC分类号： H01L21/02
摘要： A valve is closed while a cleaning liquid is fed into a tubular body of a cleaning nozzle, and a piezoelectric element applies vibrations to the cleaning liquid. This causes droplets of the cleaning liquid to be produced and discharged from a plurality of discharge holes. The droplet diameter of the discharged droplets is in the range from 15 to 200 μm, and the distribution of the droplet diameter is such that the value of where a value of 3σ does not exceed 10% of the average droplet diameter. The droplet speed is in the range from 20 to 100 meters per second, and the distribution of the droplet speed is such that the value of where a value of 3ν does not exceed 10% of the average droplet speed. The droplet flow rate is not less than 10 milliliters per minute. Discharging the droplets of the cleaning liquid from the cleaning nozzle toward a substrate while satisfying these discharge conditions improves cleaning efficiency without damages to the substrate.
摘要翻译：当清洁液体被供给到清洁喷嘴的管状体中时，关闭阀门，并且压电元件对清洗液体施加振动。这使得清洗液体的液滴从多个排出孔产生并排出。排出的液滴的液滴直径在15至200μm的范围内，并且液滴直径的分布使得其中3sigma的值不超过平均液滴直径的10％的值。液滴速度在20至100米/秒的范围内，并且液滴速度的分布使得其中3nu的值不超过平均液滴速度的10％的值。液滴流速不小于10毫升每分钟。在满足这些排放条件的同时，将清洁液体的液滴从清洗喷嘴向基板排出，从而提高清洁效率而不会损坏基板。

3. 发明申请

US20120222707A1 NOZZLE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：喷嘴，基板加工装置和基板处理方法
公开(公告)号：US20120222707A1
公开(公告)日：2012-09-06
申请号：US13408563
申请日：2012-02-29
申请人： Masanobu SATO , Hiroyuki YASHIKI , Mai YAMAKAWA , Takayoshi TANAKA , Ayumi HIGUCHI , Rei TAKEAKI
发明人： Masanobu SATO , Hiroyuki YASHIKI , Mai YAMAKAWA , Takayoshi TANAKA , Ayumi HIGUCHI , Rei TAKEAKI
IPC分类号： B08B7/00 , B05B1/08
CPC分类号： B08B3/024 , B05B17/0676 , B08B3/02 , H01L21/67051
摘要： A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.
摘要翻译：用于排出用于处理衬底的处理液的液滴的喷嘴具有主体，其包括供给口，排出口，连接供给口和排出口的处理液流路，以及多个排出口，液体排出。处理液体流动通道包括多个分支流动通道，其在供给口和排出口之间分支并在供给口和排出口之间聚集在一起。多个排出口形成分别对应于多个分支流动通道的多个列; 并且对准并连接到相应的分支流动通道。压电元件对流过多个分支流动通道的处理液施加振动。

4. 发明申请

US20130247943A1 SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS 审中-公开
标题翻译：基板清洗方法和基板清洗装置
公开(公告)号：US20130247943A1
公开(公告)日：2013-09-26
申请号：US13848941
申请日：2013-03-22
申请人： Masanobu SATO
发明人： Masanobu SATO
IPC分类号： H01L21/02
CPC分类号： H01L21/02057 , H01L21/67051
摘要： A valve is closed while a cleaning liquid is fed into a tubular body of a cleaning nozzle, and a piezoelectric element applies vibrations to the cleaning liquid. This causes droplets of the cleaning liquid to be produced and discharged from a plurality of discharge holes. The droplet diameter of the discharged droplets is in the range from 15 to 200 μm, and the distribution of the droplet diameter is such that the value of where a value of 3σ does not exceed 10% of the average droplet diameter. The droplet speed is in the range from 20 to 100 meters per second, and the distribution of the droplet speed is such that the value of where a value of 3σ does not exceed 10% of the average droplet speed. The droplet flow rate is not less than 10 milliliters per minute. Discharging the droplets of the cleaning liquid from the cleaning nozzle toward a substrate while satisfying these discharge conditions improves cleaning efficiency without damages to the substrate.
摘要翻译：当清洁液体被供给到清洁喷嘴的管状体中时，关闭阀门，并且压电元件对清洗液体施加振动。这使得清洗液体的液滴从多个排出孔产生并排出。排出的液滴的液滴直径在15至200μm的范围内，并且液滴直径的分布使得其中3sigma的值不超过平均液滴直径的10％的值。液滴速度在20至100米/秒的范围内，并且液滴速度的分布使得其中3sigma的值不超过平均液滴速度的10％的值。液滴流速不小于10毫升每分钟。在满足这些排放条件的同时，将清洁液体的液滴从清洗喷嘴向基板排出，从而提高清洁效率而不会损坏基板。

5. 发明申请

US20090291587A1 CONNECTION STRUCTURE 有权
标题翻译：连接结构
公开(公告)号：US20090291587A1
公开(公告)日：2009-11-26
申请号：US12435088
申请日：2009-05-04
申请人： Masanobu SATO , Kenichi Shibata , Yoshisada Sano , Noritsugu Enomoto , Takenobu Yabu , Naobumi Kuboki , Shigeki Motomura , Takehide Ikeda
发明人： Masanobu SATO , Kenichi Shibata , Yoshisada Sano , Noritsugu Enomoto , Takenobu Yabu , Naobumi Kuboki , Shigeki Motomura , Takehide Ikeda
IPC分类号： H01R4/24
CPC分类号： H01R12/675 , F21V21/002 , F21Y2115/10 , H01R33/94
摘要： The present invention has an object of providing a connection structure capable of easily connecting an LED component to a flat cable. An LED unit 1 includes an upper case 7, a pierce terminal 6, a lower case 9 and an intermediate terminal 5. An LED chip 3 is pressed to the pierce terminal 6 by a convexed spring 51 to electrically connect the LED chip 3 to the flat cable 100. Conductors 101 included in the flat cable 100 are formed of phosphor bronze formed of tin (Sn), phosphorus (P), copper (Cu) and unavoidable impurities and having a tensile strength of 480 to 550 MPa, whereas a pierce plate 63 of the pierce terminal 6 piercing through the conductor 101 is formed of a copper alloy, which is a high strength conductive member having a higher strength than that of the conductor 101 and having conductivity.
摘要翻译：本发明的目的是提供一种能够容易地将LED组件连接到扁平电缆的连接结构。 LED单元1包括上壳体7，穿孔端子6，下壳体9和中间端子5. LED芯片3通过凸形弹簧51被按压到穿刺端子6，以将LED芯片3电连接到包括在扁平电缆100中的导体101由锡（Sn），磷（P），铜（Cu）和不可避免的杂质形成的磷青铜形成，拉伸强度为480至550MPa，而刺穿贯穿导体101的穿孔端子6的板63由铜合金形成，该铜合金是具有比导体101的强度高的导电性的高强度导电部件。

6. 发明申请

US20120161621A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20120161621A1
公开(公告)日：2012-06-28
申请号：US13337154
申请日：2011-12-26
申请人： Masanobu SATO
发明人： Masanobu SATO
IPC分类号： H01J1/70
CPC分类号： H01L33/56 , H01L25/0753 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/3025 , H01L2933/0091 , H01L2924/00 , H01L2924/00014
摘要： A light emitting device includes a base substrate, a light emitting element, and a sealing member. The light emitting element is provided on the base substrate. The sealing member seals the light emitting element. The sealing member contains a parent material and filler particles unevenly distributed in a surface side of the sealing member and has a surface which has an irregular geometry formed associated with the filler particles.
摘要翻译：发光器件包括基底，发光元件和密封元件。发光元件设置在基底基板上。密封件密封发光元件。密封构件包含不均匀分布在密封构件的表面侧的母材料和填料颗粒，并且具有与填料颗粒相关联的具有不规则几何形状的表面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式