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1. 发明申请

US20080070418A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20080070418A1
公开(公告)日：2008-03-20
申请号：US11853231
申请日：2007-09-11
申请人： Masahiro Miyagi , Masanobu Sato , Hiroyuki Araki
发明人： Masahiro Miyagi , Masanobu Sato , Hiroyuki Araki
IPC分类号： B08B3/04 , H01L21/461
CPC分类号： H01L21/67051
摘要： A substrate processing apparatus has a cup part for receiving processing liquid which is applied from a processing liquid applying part and is splashed from a substrate, and the cup part is formed of electrical insulation material. Hydrophilic treatment is performed on an outer annular surface of the cup part and water is held on the outer annular surface of the cup part while processing the substrate. With this structure, charged potential of the cup part generated in splashing of pure water can be suppressed by the water held on the outer annular surface, without greatly increasing the manufacturing cost of the substrate processing apparatus by forming the cup part with special conductive material. As a result, it is possible to prevent electric discharge from occurring on the substrate due to induction charging of the substrate, in application of the processing liquid onto the substrate.
摘要翻译：基板处理装置具有用于接收从处理液施加部施加并从基板溅出的处理液的杯部，杯部由电绝缘材料形成。在杯部的外环形表面上进行亲水处理，并且在处理基板的同时将水保持在杯部的外环形表面上。通过这种结构，通过保持在外环形表面上的水可以抑制在纯水溅出中产生的杯部分的带电电位，而不会通过用特殊导电材料形成杯部而大大增加基板处理装置的制造成本。结果，可以在将处理液施加到基板上时防止由于基板的感应充电而在基板上发生放电。

2. 发明申请

US20070272545A1 APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF PROCESSING SUBSTRATE 审中-公开
标题翻译：用于处理基板的装置和处理基板的方法
公开(公告)号：US20070272545A1
公开(公告)日：2007-11-29
申请号：US11745652
申请日：2007-05-08
申请人： Masahiro Miyagi
发明人： Masahiro Miyagi
IPC分类号： C25D17/00 , H01L21/44
CPC分类号： H01L21/02052 , H01L21/67051
摘要： A substrate processing apparatus comprises an applying part for applying droplets of cleaning solution onto a substrate, a ring-shaped induction electrode located close to an outlet of the applying part, and an applying part moving mechanism for moving the applying part. In the substrate processing apparatus, electric potential difference is generated between the induction electrode and a cleaning solution tube in the applying part, positive charge is induced on the cleaning solution, and the substrate is cleaned by the droplets of the cleaning solution, whereby the substrate can be suppressed to be negatively charged during cleaning. Concurrently with movement of the applying part and application of the cleaning solution, the electric potential difference is controlled on the basis of the characteristics of charging of the substrate and relative position of the applying part to the substrate. It is possible to improve uniformity of distribution of electric potentials on the substrate.
摘要翻译：一种基板处理装置，其特征在于，具备将清洗液滴施加到基板上的施加部，位于所述施加部的出口附近的环状的感应电极以及使所述施加部移动的施加部移动机构。在基板处理装置中，在施加部中的感应电极和清洗液管之间产生电位差，在清洗液上产生正电荷，基板被清洗液的液滴清洗，由此基板可以抑制在清洁过程中带负电。同时施加部件的移动和清洁溶液的施加，基于基板的充电特性和施加部件与基板的相对位置的特性来控制电位差。可以提高基板上的电位分布的均匀性。

3. 发明申请

US20070080057A1 PLATING APPARATUS, PLATING CUP AND CATHODE RING 审中-公开
标题翻译：电镀设备，镀银和阴极环
公开(公告)号：US20070080057A1
公开(公告)日：2007-04-12
申请号：US11609026
申请日：2006-12-11
申请人： Yasuhiro MIZOHATA , Hideaki MATSUBARA , Masahiro MIYAGI , Ryuichi HAYAMA
发明人： Yasuhiro MIZOHATA , Hideaki MATSUBARA , Masahiro MIYAGI , Ryuichi HAYAMA
IPC分类号： C25D17/00
CPC分类号： H01L21/2885 , C25D5/003 , C25D5/04 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/005 , C25D17/06 , C25D17/12 , C25D21/08
摘要： A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode (83) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism (45) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantially flush with the upper edge of the plating vessel without interference between the upper edge portion of the plating vessel and the cathode ring.
摘要翻译：一种电镀装置（10），具备：电镀槽（61a〜61d），具有容纳镀液的圆筒状的侧壁（361）用于大致水平地保持待处理的大致圆形的基板（W）的基板保持机构（74a〜74d）阴极环（80），设置在所述基板保持机构中并且具有与用于密封所述基板的下表面的周缘部的电镀容器大致相同的内径，所述阴极环具有将被引入的阴极（83）与由基板保持机构保持的基板接触; 以及用于使由所述基板保持机构保持的所述基板与所述阴极环一起旋转的旋转驱动机构（45）其特征在于，所述电镀槽具有与所述阴极环的与所述电镀槽相对的部分的形状互补的上边缘部，使得被所述基板保持机构保持的所述基板的下表面能够接近所述电镀槽，电镀槽的上边缘与电镀槽的上边缘部分和阴极环之间没有干涉。

4. 发明授权

US5763892A Ultraviolet irradiator for substrate, substrate treatment system, and method of irradiating substrate with ultraviolet light 失效
标题翻译：用于基板的紫外线照射器，基板处理系统以及用紫外线照射基板的方法
公开(公告)号：US5763892A
公开(公告)日：1998-06-09
申请号：US665474
申请日：1996-06-18
申请人： Koji Kizaki , Masahiro Miyagi , Katsunaga Narita
发明人： Koji Kizaki , Masahiro Miyagi , Katsunaga Narita
IPC分类号： G03F7/16 , G03F7/20 , G03F7/42 , G03B27/52
CPC分类号： G03F7/42 , G03F7/16 , G03F7/168 , G03F7/2024
摘要： A dielectric barrier discharge excimer lamp is employed as a lamp for emitting ultraviolet light, and this dielectric barrier discharge excimer lamp is turned on during a time period, which is shorter than a working period, for supplying a prescribed amount of ultraviolet energy to a substrate. Even if the working period changes, therefore, the dielectric barrier discharge excimer lamp is turned off when the ultraviolet energy to the substrate reaches the prescribed amount, so that the ultraviolet energy is maintained at a constant level and no excessive temperature rise takes place in the interior of an irradiator. Due to the employment of the dielectric barrier discharge excimer lamp, it is possible to stabilize lamp output within a short time after the lamp is turned on even if the lamp is repeatedly turned on and off, whereby the ovearll time for overall treatment steps is reduced.
摘要翻译：采用电介质阻挡放电准分子灯作为发出紫外线的灯，该电介质势垒放电准分子灯在比工作时间短的期间内导通，用于向基板供给规定量的紫外线能量。因此，即使工作时间变化，当对基板的紫外线能量达到规定量时，电介质势垒放电准分子灯被切断，使得紫外线能量维持在恒定水平，并且在辐射器的内部。由于使用介质阻挡放电准分子灯，即使灯反复打开和关闭，也可以在灯打开之后的短时间内稳定灯的输出，从而整个处理步骤的超大时间减少。

5. 发明授权

US4698904A Apparatus for assembling fins and tubes for heat exchangers 失效
标题翻译：用于组装热交换器翅片和管的装置
公开(公告)号：US4698904A
公开(公告)日：1987-10-13
申请号：US898213
申请日：1986-08-20
申请人： Yoshio Nozawa , Izumi Ochiai , Yukio Kitayama , Masahiro Miyagi , Katsuharu Uehara , Takahiko Deguchi , Keikichi Morita , Katsuo Arai , Tamotsu Nakayama
发明人： Yoshio Nozawa , Izumi Ochiai , Yukio Kitayama , Masahiro Miyagi , Katsuharu Uehara , Takahiko Deguchi , Keikichi Morita , Katsuo Arai , Tamotsu Nakayama
IPC分类号： B21D53/08 , B23P15/26
CPC分类号： B21D53/085 , B23P15/26 , Y10T29/5188 , Y10T29/5191 , Y10T29/53113 , Y10T29/53539
摘要： An apparatus for producing various heat exchangers is disclosed in which a plurality of heat exchangers disposed side by side are formed at once. A series of manufacturing stations for working heat exchanger components such as fins and tubes and for opening the tubes are arranged in an endless manner to thereby automatically carry out the production steps with a high productivity while meeting various requirements of the specifications of the heat exchangers with a high flexibility.
摘要翻译：公开了一种用于生产各种热交换器的装置，其中并排设置并排设置的多个热交换器。一系列用于工作的热交换器部件如翅片和管和用于打开管的制造站以环形方式布置，从而以高生产率自动执行生产步骤，同时满足热交换器的各种规格要求灵活性高。

6. 发明申请

US20150090694A1 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20150090694A1
公开(公告)日：2015-04-02
申请号：US14383817
申请日：2012-09-07
申请人： Koji Hashimoto , Masahiro Miyagi , Mitsukazu Takahashi
发明人： Koji Hashimoto , Masahiro Miyagi , Mitsukazu Takahashi
IPC分类号： H01L21/67
CPC分类号： H01L21/6704 , H01L21/67051 , H01L21/67057 , H01L21/67751
摘要： A substrate processing apparatus and method includes, a plate that has a size equal to or larger than a principal face of the substrate, and has a horizontal and flat liquid holding face opposing the principal face of the substrate from below. A processing liquid supply unit supplies a processing liquid to the liquid holding face. A control unit controls the processing liquid supply unit and a movement unit to supply the processing liquid to the liquid holding face to form a processing liquid film, a contact step of bringing the principal face of the substrate and the liquid holding face close to each other to bring the principal face of the substrate into contact with the processing liquid film, and a liquid contact maintenance step of maintaining the processing liquid in contact with the principal face of the substrate.
摘要翻译：基板处理装置和方法包括：具有等于或大于基板的主面的尺寸的板，并且具有从下方与基板的主面相对的水平和平坦的液体保持面。处理液供给单元向液体保持面供给处理液。控制单元控制处理液体供应单元和移动单元，以将处理液体供应到液体保持面以形成处理液膜;使基板的主面和液体保持面彼此靠近的接触步骤以使基板的主面与处理液膜接触，以及液体接触维护步骤，其保持处理液体与基板的主面接触。

7. 发明授权

US09601357B2 Substrate processing device and substrate processing method 有权
公开(公告)号：US09601357B2
公开(公告)日：2017-03-21
申请号：US14383817
申请日：2012-09-07
申请人： Koji Hashimoto , Masahiro Miyagi , Mitsukazu Takahashi
发明人： Koji Hashimoto , Masahiro Miyagi , Mitsukazu Takahashi
IPC分类号： C03C15/00 , H01L21/67 , H01L21/677
CPC分类号： H01L21/6704 , H01L21/67051 , H01L21/67057 , H01L21/67751
摘要： A substrate processing apparatus and method includes, a plate that has a size equal to or larger than a principal face of the substrate, and has a horizontal and flat liquid holding face opposing the principal face of the substrate from below. A processing liquid supply unit supplies a processing liquid to the liquid holding face. A control unit controls the processing liquid supply unit and a movement unit to supply the processing liquid to the liquid holding face to form a processing liquid film, a contact step of bringing the principal face of the substrate and the liquid holding face close to each other to bring the principal face of the substrate into contact with the processing liquid film, and a liquid contact maintenance step of maintaining the processing liquid in contact with the principal face of the substrate.

8. 发明授权

US09165798B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US09165798B2
公开(公告)日：2015-10-20
申请号：US13628772
申请日：2012-09-27
申请人： Masahiro Miyagi
发明人： Masahiro Miyagi
IPC分类号： H01L21/306 , H01L21/302 , H01L21/67 , H01L21/311
CPC分类号： H01L21/67023 , H01L21/31133
摘要： A substrate processing apparatus comprises a single-substrate processing apparatus for processing substrates one by one, and an anti-static liquid storage part for storing an anti-static liquid having electrical resistivity maintained at target electrical resistivity higher than the electrical resistivity of an SPM liquid. A plurality of substrates held in a cartridge are immersed in the anti-static liquid inside the anti-static liquid storage part and both main surfaces of the substrate entirely come into contact with the anti-static liquid. From the substrates, static electricity is relatively gently removed. Then, after the static elimination process are finished, a processing liquid supply part supplies the SPM liquid onto an upper surface of the substrate and an SPM process is thereby performed. It is thereby possible to prevent a large amount of electric charges from rapidly moving from the substrate to the SPM liquid and also possible to prevent any damage to the substrate.
摘要翻译：基板处理装置包括一个一个地处理基板的单基板处理装置和用于存储电阻率保持在目标电阻率高于SPM液体的电阻率的电阻率的防静电液体的防静电液体存储部分。保持在盒中的多个基板被浸渍在防静电液体存储部分内的防静电液体中，并且基板的两个主表面完全与防静电液体接触。从基板，静电相对轻轻地去除。然后，在静电消除处理结束后，处理液供给部将SPM液供给到基板的上表面，从而进行SPM处理。从而可以防止大量电荷从基板迅速移动到SPM液体，并且还可以防止对基板的任何损坏。

9. 发明申请

US20130084709A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20130084709A1
公开(公告)日：2013-04-04
申请号：US13628650
申请日：2012-09-27
申请人： Masahiro MIYAGI , Kazunori FUJIKAWA
发明人： Masahiro MIYAGI , Kazunori FUJIKAWA
IPC分类号： B08B3/08 , H01L21/465 , H01L21/306
CPC分类号： H01L21/67028
摘要： In a substrate processing apparatus, an anti-static liquid supply part supplies the anti-static liquid having electrical resistivity higher than that of an SPM liquid onto a substrate to puddle an entire upper surface of the substrate with the anti-static liquid, to thereby gradually remove static electricity from the substrate. Then, the processing liquid supply part supplies the SPM liquid onto the substrate to thereby perform an SPM process. In the SPM process, it is thereby possible to prevent a large amount of electric charges from rapidly moving from the substrate to the SPM liquid and prevent any damage to the substrate. Further, by maintaining the electrical resistivity of the anti-static liquid at the target electrical resistivity, it is possible to increase the static elimination efficiency of the substrate and shorten the time required for the static elimination process within the limits of causing no damage to the substrate.
摘要翻译：在基板处理装置中，防静电液体供给部件将具有比SPM液体的电阻率高的抗静电液供给到基板上，从而将基板的整个上表面与防静电液体混合，由此逐渐从基材中除去静电。然后，处理液供给部将SPM液供给到基板上，由此进行SPM处理。在SPM工艺中，可以防止大量电荷从基板迅速移动到SPM液体，并且防止对基板的任何损坏。此外，通过将防静电液体的电阻率保持在目标电阻率，可以提高基板的静电消除效率，并且可以在不损害静电消除的限度内缩短静电消除处理所需的时间基质。

10. 发明授权

US07958899B2 Substrate cleaning apparatus and substrate cleaning method 有权
标题翻译：基板清洗装置和基板清洗方法
公开(公告)号：US07958899B2
公开(公告)日：2011-06-14
申请号：US12195521
申请日：2008-08-21
申请人： Takayoshi Tanaka , Masahiro Miyagi
发明人： Takayoshi Tanaka , Masahiro Miyagi
IPC分类号： B08B3/02
CPC分类号： B08B3/12 , H01L21/67051 , Y10S134/902
摘要： At a vibration applying position, ultrasonic vibration is applied upon a liquid film which is on a surface of a substrate. Concurrently with this, at a drop arrival position which is different from the vibration applying position, drops of a cleaning liquid are supplied to the liquid film, whereby wave-generating vibration which is different from the ultrasonic vibration is applied upon the liquid film. This dramatically improves removal of particles adhering to the surface of the substrate as compared with mere application of ultrasonic vibration. Hence, even when the output, the frequency and the like of the ultrasonic vibration are set to such an extent not damaging the substrate, it is possible to effectively remove particles with the wave-generating vibration and favorably clean the surface of the substrate.
摘要翻译：在振动施加位置，对基板表面上的液膜施加超声波振动。与此同时，在与振动施加位置不同的下落到达位置时，向液膜供给清洗液滴，由此在液膜上施加与超声波振动不同的波浪产生振动。与仅施加超声波振动相比，这显着地改善了附着在基板表面上的颗粒的去除。因此，即使将超声波振动的输出，频率等设定为不损害基板的程度，也可以有效地去除产生振动的微粒，有利地清洗基板的表面。

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