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    • 2. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US5655954A
    • 1997-08-12
    • US564520
    • 1995-11-29
    • Toshio OishiShoichi ShinMasafumi TsunadaMasahiro IshidaYasukazu Mase
    • Toshio OishiShoichi ShinMasafumi TsunadaMasahiro IshidaYasukazu Mase
    • B08B1/04B24B37/10B24B37/34B24B53/007B24B53/017B24B55/06H01L21/00B24B7/00B24B9/00
    • B24B37/107B08B1/04B24B37/345B24B53/017B24B55/06H01L21/67028
    • Provided is a polishing apparatus which comprises a polishing mechanism for polishing a wafer taken out from a cassette, an attaching-detaching device for attaching to and detaching the wafer from the polishing mechanism, a device for cleaning the polished wafer, and a transportation device for transporting the wafer between the cassette, polishing mechanism, attaching-detaching device, and cleaning device. These devices are arranged individually in compartments. A working chamber is divided into a plurality of compartments by means of partitioning devices. A device for polishing a workpiece is set in one of the compartments. The apparatus is also provided with communication devices for internally connecting the adjacent compartments which are divided by the partitioning devices. The apparatus may further comprise devices for individually controlling the respective internal pressures of the compartments or a device for generating an air flow in the form of a laminar flow in each of the compartments.
    • 本发明提供一种研磨装置,其特征在于,包括:研磨从盒取出的晶片的研磨机构,将所述晶片与所述研磨机构连接并从所述研磨机构拆下的安装拆卸装置, 在盒,抛光机构,安装拆卸装置和清洁装置之间传送晶片。 这些设备分别安装在隔间中。 工作室通过分隔装置分成多个隔间。 用于抛光工件的装置设置在隔室中的一个中。 该装置还设置有用于内部连接由分隔装置划分的相邻隔室的通信装置。 该装置还可以包括用于单独控制隔室的相应内部压力的装置或用于在每个隔间中产生层流形式的空气流的装置。