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1. 发明申请

US20120186863A1 MULTILAYER WIRING BOARD 有权
标题翻译：多层接线板
公开(公告)号：US20120186863A1
公开(公告)日：2012-07-26
申请号：US13355916
申请日：2012-01-23
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Takuya HANDO , Hidetoshi WADA
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Takuya HANDO , Hidetoshi WADA
IPC分类号： H05K1/02
CPC分类号： H05K1/111 , H01L23/12 , H01L23/32 , H01L24/00 , H01L24/16 , H01L24/81 , H01L2224/16225 , H01L2224/81192 , H01L2224/81385 , H01L2224/81815 , H05K1/113 , H05K3/0097 , H05K3/244 , H05K3/3436 , H05K3/4007 , H05K3/4682 , H05K2201/09745 , Y02P70/611
摘要： A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface. Embodiments make it possible to feed and hold a sufficient amount of solder paste on the upper surface of conductive pads, thereby minimizing or eliminating the occurrence of defective connections to a semiconductor element and damage to the solder layer caused by an insufficient thickness of the solder layer.
摘要翻译：一种多层布线基板，包括：交替层叠导体层和树脂绝缘层的堆积层，形成在表面突出的树脂绝缘层的表面的导电性焊盘，以及形成在提供每个导电焊盘的上表面。导电焊盘的上表面可以具有凹部，并且焊料层的整个表面可以相对于上表面的外周部分位于升高位置。实施例使得可以在导电焊盘的上表面上馈送和保持足够量的焊膏，从而最小化或消除与半导体元件的不良连接的发生以及由焊料层的厚度不足引起的焊料层的损坏。

2. 发明申请

US20120111616A1 ELECTRONIC-COMPONENT-MOUNTED WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子元件安装接线基板及其制造方法
公开(公告)号：US20120111616A1
公开(公告)日：2012-05-10
申请号：US13290737
申请日：2011-11-07
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
IPC分类号： H05K1/09 , B23K31/02 , B23K1/00
CPC分类号： H05K3/4007 , B23K1/0016 , B23K26/384 , B23K26/40 , B23K2101/42 , B23K2103/172 , B23K2103/50 , H01L2224/16225 , H05K1/141 , H05K3/244 , H05K3/3442 , H05K3/3484 , Y02P70/613
摘要： An electronic-component-mounted wiring substrate provides enhanced joining reliability when an electronic component is joined to terminal pads of the wiring substrate, has sufficient strength, and can prevent generation of warpage and formation of a short circuit, which would otherwise occur as a result of re-melting of solder. Solder completely covers an entire surface of each of the terminal pads provided on a laminated substrate such that they project therefrom, and also joins to terminals of the electronic component. Therefore, each of the terminal pads and the solder are joined together reliably, and sufficient electrical continuity is secured therebetween. That is, the reliability of a joint between the solder and each terminal pad is extremely high, and the reliability of joint between the terminal pads and the electronic component is extremely high.
摘要翻译：电子元件安装的布线基板当将电子元件接合到布线基板的端子焊盘时提供增强的连接可靠性，具有足够的强度，并且可以防止产生翘曲和形成短路，否则会发生这种情况。的焊料再熔化。焊料完全覆盖设置在层叠基板上的每个端子焊盘的整个表面，使得它们从其突出，并且还连接到电子部件的端子。因此，端子焊盘和焊料中的每一个可靠地接合在一起，并且在它们之间确保了足够的电连续性。也就是说，焊料和每个端子焊盘之间的接头的可靠性非常高，并且端子焊盘和电子部件之间的接合的可靠性非常高。

3. 发明申请

US20120211271A1 MULTILAYER WIRING BOARD 有权
标题翻译：多层接线板
公开(公告)号：US20120211271A1
公开(公告)日：2012-08-23
申请号：US13399547
申请日：2012-02-17
申请人： Takuya HANDO , Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Hidetoshi WADA
发明人： Takuya HANDO , Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Hidetoshi WADA
IPC分类号： H05K1/02
CPC分类号： H05K3/4007 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/81192 , H01L2924/01084 , H05K3/0097 , H05K3/4682 , H05K2201/0367
摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.
摘要翻译：一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从提供表面。导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。可以在导电焊盘的上表面上形成焊料层。某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。

4. 发明申请

US20120186864A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20120186864A1
公开(公告)日：2012-07-26
申请号：US13354043
申请日：2012-01-19
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： B23K1/00 , B23K35/22 , B23K35/26 , C22C11/06 , C22C13/00 , H01L21/4853 , H01L21/6835 , H01L23/49811 , H01L23/49822 , H01L24/00 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68318 , H01L2221/68331 , H01L2221/68345 , H01L2221/68386 , H01L2224/131 , H01L2224/16237 , H01L2224/81192 , H01L2224/814 , H01L2924/15174 , H01L2924/15312 , H05K3/4682 , H05K2201/10318 , H01L2924/014
摘要： A wiring board and a method for manufacturing the wiring board reinforced by means of a resin is provided. Embodiments of the wiring board allow for reliable attachment of a connection member, like a socket, to a terminal member. For example, a base of terminal pins is put on pin grid array (PGA) terminal pads, and a bonding material paste including solder and an electric insulation material made of a resin is placed on each of the PGA terminal pads. The bonding material paste is then heated to fuse the solder and soften the electric insulation material. Subsequently, the bonding material paste is cooled to solidify the solder and bond each of the bases to a corresponding PGA terminal pad and form an electric insulation surface layer on an exposed surface of each of solder junctions to which the respective bases are bonded.
摘要翻译：提供了一种通过树脂加强的布线板和制造布线板的方法。布线板的实施例允许将连接构件（如插座）可靠地附接到端子构件。例如，将端子引脚的基座放置在引脚格栅阵列（PGA）端子焊盘上，并且将包含焊料的接合材料浆料和由树脂制成的电绝缘材料放置在每个PGA端子焊盘上。然后将接合材料浆料加热以熔化焊料并软化电绝缘材料。随后，将接合材料浆料冷却以固化焊料，并将每个基底结合到相应的PGA端子焊盘上，并在各个基底所接合的每个焊接点的暴露表面上形成电绝缘表面层。

5. 发明申请

US20120186857A1 METHOD FOR MANUFACTURING WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING AN ELECTRONIC COMPONENT 有权
标题翻译：用于安装电子部件的布线板的安装方法，用于安装电子部件的布线板以及用于制造具有电子部件的布线板的方法
公开(公告)号：US20120186857A1
公开(公告)日：2012-07-26
申请号：US13353965
申请日：2012-01-19
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO
IPC分类号： H05K1/02 , H05K13/04
CPC分类号： H05K3/3478 , H01L24/81 , H01L2224/10126 , H01L2224/16225 , H01L2924/14 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H01L2924/00
摘要： A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.
摘要翻译：本发明提供一种电子部件安装用布线基板的制造方法，电子部件的安装用布线基板以及电子元件搭载布线基板的制造方法。可以将包括焊料和由树脂制成的电绝缘材料的接合材料糊料放置在芯片安装端子焊盘上并加热以熔化焊料并软化电绝缘材料。随后，焊料固化形成焊料凸块。此外，电绝缘材料在每个焊料凸块的表面和每个焊料凸块周围的多层板的表面上固化，以形成电绝缘表面层。因此，当芯片安装到这种布线板时，电绝缘表面层在焊料的再熔合期间使相邻焊料凸块之间的连接最小化或消除。

6. 发明申请

US20110155438A1 Multilayer Wiring Substrate 审中-公开
标题翻译：多层接线基板
公开(公告)号：US20110155438A1
公开(公告)日：2011-06-30
申请号：US12978750
申请日：2010-12-27
申请人： Tatsuya ITO , Tetsuo SUZUKI , Takuya HANDO , Shinnosuke MAEDA , Atsuhiko SUGIMOTO , Satoshi HIRANO
发明人： Tatsuya ITO , Tetsuo SUZUKI , Takuya HANDO , Shinnosuke MAEDA , Atsuhiko SUGIMOTO , Satoshi HIRANO
IPC分类号： H05K1/11
CPC分类号： H05K3/4682 , H05K1/113 , H05K3/4007 , H05K2201/094 , H05K2201/09427 , H05K2201/09472
摘要： A multilayer wiring substrate has a multilayer wiring laminate portion in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately. A plurality of first-main-surface-side connection terminals are disposed on one side of the laminate structure where a first main surface thereof is present, and a plurality of second-main-surface-side connection terminals being disposed on an other side of the laminate structure where a second main surface thereof is present. The plurality of conductive layers are formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface or the second main surface. The plurality of first-main-surface-side connection terminals comprising at least two types of terminals for connection of different articles-to-be-connected. Top surfaces of the plurality of first-main-surface-side connection terminals differ in height according to types of the articles-to-be-connected.
摘要翻译：多层布线基板具有多层布线层叠部，其中主要由相同树脂绝缘材料制成的多个树脂绝缘层和多个导电层交替层叠。多个第一主表面侧连接端子设置在层叠结构的存在第一主表面的一侧上，并且多个第二主表面侧连接端子设置在其中存在第二主表面的层压结构。多个导电层形成在多个树脂绝缘层中，并且通过直径朝向第一主表面或第二主表面增大的通孔导体互连。多个第一主表面侧连接端子包括用于连接不同待连接物品的至少两种类型的端子。多个第一主表面侧连接端子的顶表面根据要连接的物品的类型而不同。

7. 发明申请

US20110155443A1 Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate 有权
标题翻译：制造多层接线基板和多层接线基板的方法
公开(公告)号：US20110155443A1
公开(公告)日：2011-06-30
申请号：US12979474
申请日：2010-12-28
申请人： Shinnosuke MAEDA , Tetsuo SUZUKI , Takuya HANDO , Tatsuya ITO , Satoshi HIRANO , Atsuhiko SUGIMOTO
发明人： Shinnosuke MAEDA , Tetsuo SUZUKI , Takuya HANDO , Tatsuya ITO , Satoshi HIRANO , Atsuhiko SUGIMOTO
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K1/0298 , H01L21/4846 , H01L23/49822 , H01L2224/16225 , H05K1/09 , H05K1/111 , H05K1/113 , H05K3/0055 , H05K3/3452 , H05K3/4682 , H05K2201/068 , H05K2201/094 , H05K2201/0989 , H05K2201/099
摘要： In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.
摘要翻译：在堆积步骤中，将多个树脂绝缘层和多个导电层以多层布置交替层叠在可分离地层叠在基材侧上的金属箔上，从而形成布线层压体部分。在钻井工序中，通过激光钻孔在最外层的树脂绝缘层上形成多个开口，露出连接端子。随后，在去污步骤中，去除开口内部的污迹。在堆积步骤之后执行的基材除去步骤中，除去基材并暴露金属箔。

8. 发明申请

US20110156272A1 Multilayered Wiring Substrate 失效
标题翻译：多层接线基板
公开(公告)号：US20110156272A1
公开(公告)日：2011-06-30
申请号：US12976427
申请日：2010-12-22
申请人： Shinnosuke MAEDA , Tetsuo SUZUKI , Atsuhiko SUGIMOTO , Tatsuya ITO , Takuya HANDO , Satoshi HIRANO
发明人： Shinnosuke MAEDA , Tetsuo SUZUKI , Atsuhiko SUGIMOTO , Tatsuya ITO , Takuya HANDO , Satoshi HIRANO
IPC分类号： H01L23/48
CPC分类号： H05K3/3452 , H01L23/49811 , H01L23/49822 , H01L2924/0002 , H05K1/113 , H05K3/205 , H05K3/383 , H05K3/4682 , H05K2201/068 , H05K2201/094 , H05K2201/09527 , H05K2201/099 , H05K2203/0346 , H05K2203/0369 , H01L2924/00
摘要： A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.
摘要翻译：一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧，并且端子内表面的边缘是圆形的。

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