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1. 发明授权

US08866025B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US08866025B2
公开(公告)日：2014-10-21
申请号：US13355916
申请日：2012-01-23
申请人： Masahiro Inoue , Hajime Saiki , Atsuhiko Sugimoto , Takuya Hando , Hidetoshi Wada
发明人： Masahiro Inoue , Hajime Saiki , Atsuhiko Sugimoto , Takuya Hando , Hidetoshi Wada
IPC分类号： H05K1/11 , H05K1/09 , H01L23/32 , H01L23/12 , H05K3/34 , H05K3/46 , H05K3/40 , H05K3/00 , H01L23/00 , H05K3/24
CPC分类号： H05K1/111 , H01L23/12 , H01L23/32 , H01L24/00 , H01L24/16 , H01L24/81 , H01L2224/16225 , H01L2224/81192 , H01L2224/81385 , H01L2224/81815 , H05K1/113 , H05K3/0097 , H05K3/244 , H05K3/3436 , H05K3/4007 , H05K3/4682 , H05K2201/09745 , Y02P70/611
摘要： A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface.
摘要翻译：一种多层布线基板，包括：交替层叠导体层和树脂绝缘层的堆积层，形成在表面突出的树脂绝缘层的表面的导电性焊盘，以及形成在提供每个导电焊盘的上表面。导电焊盘的上表面可以具有凹部，并且焊料层的整个表面可以相对于上表面的外周部分位于升高位置。

2. 发明授权

US09119333B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US09119333B2
公开(公告)日：2015-08-25
申请号：US13399547
申请日：2012-02-17
申请人： Takuya Hando , Masahiro Inoue , Hajime Saiki , Atsuhiko Sugimoto , Hidetoshi Wada
发明人： Takuya Hando , Masahiro Inoue , Hajime Saiki , Atsuhiko Sugimoto , Hidetoshi Wada
IPC分类号： H05K3/40 , H01L23/498 , H01L23/00 , H01L21/683 , H05K3/46 , H05K3/00
CPC分类号： H05K3/4007 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/81192 , H01L2924/01084 , H05K3/0097 , H05K3/4682 , H05K2201/0367
摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.
摘要翻译：一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从提供表面。导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。可以在导电焊盘的上表面上形成焊料层。某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。

3. 发明授权

US08534843B2 Image display apparatus, information processing apparatus, and methods of controlling the same 有权
标题翻译：图像显示装置，信息处理装置及其控制方法
公开(公告)号：US08534843B2
公开(公告)日：2013-09-17
申请号：US12967460
申请日：2010-12-14
申请人： Masaru Yamamura , Hidetoshi Wada
发明人： Masaru Yamamura , Hidetoshi Wada
IPC分类号： G03B21/14 , G09G5/02 , G02B7/28
CPC分类号： H04N9/31 , H04N5/58 , H04N9/3182 , H04N9/3194 , H04N21/4122 , H04N21/42202 , H04N21/4318
摘要： Based on image data input to a display unit and an image on a display surface acquired by an acquisition unit, control is performed to decrease the difference between the input image data and the image displayed on the display surface.
摘要翻译：基于输入到显示单元的图像数据和由获取单元获取的显示表面上的图像，执行控制以减少输入图像数据和显示在显示表面上的图像之间的差异。

4. 发明申请

US20110149152A1 IMAGE DISPLAY APPARATUS, INFORMATION PROCESSING APPARATUS, AND METHODS OF CONTROLLING THE SAME 有权
标题翻译：图像显示装置，信息处理装置及其控制方法
公开(公告)号：US20110149152A1
公开(公告)日：2011-06-23
申请号：US12967460
申请日：2010-12-14
申请人： Masaru Yamamura , Hidetoshi Wada
发明人： Masaru Yamamura , Hidetoshi Wada
IPC分类号： H04N9/31 , H04N11/20 , H04N5/21
CPC分类号： H04N9/31 , H04N5/58 , H04N9/3182 , H04N9/3194 , H04N21/4122 , H04N21/42202 , H04N21/4318
摘要： Based on image data input to a display unit and an image on a display surface acquired by an acquisition unit, control is performed to decrease the difference between the input image data and the image displayed on the display surface.
摘要翻译：基于输入到显示单元的图像数据和由获取单元获取的显示表面上的图像，执行控制以减少输入图像数据和显示在显示表面上的图像之间的差异。

5. 发明授权

US5962357A Taphole mix for molten metal taphole 失效
标题翻译：用于熔融金属出铁口的混合孔
公开(公告)号：US5962357A
公开(公告)日：1999-10-05
申请号：US83997
申请日：1998-05-26
申请人： Yukitoshi Kubota , Hidetoshi Wada , Yoshiyuki Nobuoka
发明人： Yukitoshi Kubota , Hidetoshi Wada , Yoshiyuki Nobuoka
IPC分类号： C04B35/66 , C04B35/52
CPC分类号： C04B35/013 , C04B35/66 , C04B2235/3206 , C04B2235/3217 , C04B2235/3826 , C04B2235/3873 , C04B2235/422
摘要： The object of the present invention is to provide a taphole mix for use in a molten metal taphole which has improved resistance to both wear and corrosion and enables prolonged tapping of iron and reduces difficult drilling. The taphole mix of the present invention is characterized in that it comprises a refractory base material in an amount of 65 to 92 wt % and a binder in an amount of 8 to 35 wt %, the binder consisting of an anhydrous coal tar having a fixed carbon content of 32.5 wt % or above.
摘要翻译：本发明的目的是提供一种用于熔融金属出料口的出钢混合物，其具有改善的耐磨性和耐腐蚀性，并且能够延长铁的剥离并且减少难以钻孔。本发明的出钢混合物的特征在于，其含有65至92重量％的耐火材料和8至35重量％的粘合剂，该粘合剂由具有固定的无水煤焦油碳含量为32.5重量％以上。

6. 发明授权

US5313438A Delay apparatus 失效
标题翻译：延迟装置
公开(公告)号：US5313438A
公开(公告)日：1994-05-17
申请号：US78781
申请日：1993-06-16
申请人： Teruo Hieda , Hidetoshi Wada
发明人： Teruo Hieda , Hidetoshi Wada
IPC分类号： H04N9/64 , G11C27/04 , H03H11/26 , H03H15/02 , H04N5/14 , G11C13/00
CPC分类号： G11C27/04 , H04N5/14
摘要： A delay apparatus comprises one or a plurality of shift registers, a plurality of signal accumulating capacitors which are mutually coupled by transfer transistors, a plurality of write switches each of which is arranged between an input terminal and either one of the capacitors and which are controlled by outputs of the shift registers, and a plurality of read switches which are arranged between the plurality of capacitors and an output terminal and are controlled by the outputs of the shift registers, wherein the signal charges accumulated in the one capacitor are capacitively divided into other capacitors through the transfer transistors for transferring the signal charges.
摘要翻译：延迟装置包括一个或多个移位寄存器，由传输晶体管相互耦合的多个信号累积电容器，多个写开关，每个写开关布置在输入端子和电容器中的任一个之间并被控制通过移位寄存器的输出，以及多个读取开关，其布置在多个电容器和输出端子之间，并且由移位寄存器的输出控制，其中累积在一个电容器中的信号电荷被电容性地划分为另一个电容通过传输晶体管传送信号电荷。

7. 发明申请

US20120186863A1 MULTILAYER WIRING BOARD 有权
标题翻译：多层接线板
公开(公告)号：US20120186863A1
公开(公告)日：2012-07-26
申请号：US13355916
申请日：2012-01-23
申请人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Takuya HANDO , Hidetoshi WADA
发明人： Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Takuya HANDO , Hidetoshi WADA
IPC分类号： H05K1/02
CPC分类号： H05K1/111 , H01L23/12 , H01L23/32 , H01L24/00 , H01L24/16 , H01L24/81 , H01L2224/16225 , H01L2224/81192 , H01L2224/81385 , H01L2224/81815 , H05K1/113 , H05K3/0097 , H05K3/244 , H05K3/3436 , H05K3/4007 , H05K3/4682 , H05K2201/09745 , Y02P70/611
摘要： A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface. Embodiments make it possible to feed and hold a sufficient amount of solder paste on the upper surface of conductive pads, thereby minimizing or eliminating the occurrence of defective connections to a semiconductor element and damage to the solder layer caused by an insufficient thickness of the solder layer.
摘要翻译：一种多层布线基板，包括：交替层叠导体层和树脂绝缘层的堆积层，形成在表面突出的树脂绝缘层的表面的导电性焊盘，以及形成在提供每个导电焊盘的上表面。导电焊盘的上表面可以具有凹部，并且焊料层的整个表面可以相对于上表面的外周部分位于升高位置。实施例使得可以在导电焊盘的上表面上馈送和保持足够量的焊膏，从而最小化或消除与半导体元件的不良连接的发生以及由焊料层的厚度不足引起的焊料层的损坏。

8. 发明授权

US06803953B2 Image sensing apparatus and method having noise reduction function 失效
标题翻译：具有降噪功能的图像感测装置和方法
公开(公告)号：US06803953B2
公开(公告)日：2004-10-12
申请号：US09794472
申请日：2001-02-27
申请人： Hidetoshi Wada
发明人： Hidetoshi Wada
IPC分类号： H04N5217
CPC分类号： H04N5/23258 , H04N5/217 , H04N5/23248 , H04N5/23267 , H04N9/045
摘要： In an image sensing apparatus which performs noise reduction processing using pixel signals obtained by consecutively scanning a CCD image sensor at different timings, for performing image expansion in the vertical direction by controlling scanning of the CCD image sensor, an area to be read in the CCD image sensor is set on the basis of an expansion ratio. Pixel signal which have undergone the noise reduction processing and stored in advance in a memory are read so that colors of corresponding pixel signals do not shift. The noise reduction processing is performed on the current pixel signals read from the set area using the pixel signals read from the memory. The noise-reduced pixel signals are stored in the memory, and used in the next noise reduction processing for pixel signals read from the CCD image sensor of the next period.
摘要翻译：在利用通过在不同时刻连续地扫描CCD图像传感器而获得的像素信号进行降噪处理的图像感测装置中，通过控制CCD图像传感器的扫描来进行垂直方向的图像扩展，在CCD中读取的区域图像传感器基于膨胀比设定。已经经历了降噪处理并预先存储在存储器中的像素信号被读取，使得对应的像素信号的颜色不发生偏移。使用从存储器读取的像素信号对从设定区域读取的当前像素信号执行噪声降低处理。噪声降低的像素信号被存储在存储器中，并且用于下一个从下一个周期的CCD图像传感器读取的像素信号的降噪处理。

9. 发明授权

US5684919A Recording apparatus for a video signal and a control information indicative of a control state of a video camera 失效
标题翻译：用于视频信号的记录装置和指示摄像机的控制状态的控制信息
公开(公告)号：US5684919A
公开(公告)日：1997-11-04
申请号：US168924
申请日：1993-12-17
申请人： Masahiko Kikuzawa , Hidetoshi Wada , Hisataka Hirose , Hideo Kawahara
发明人： Masahiko Kikuzawa , Hidetoshi Wada , Hisataka Hirose , Hideo Kawahara
IPC分类号： H04N5/78 , H04N5/232 , H04N5/765 , H04N5/77 , H04N5/781 , H04N5/7826 , H04N5/92 , H04N5/928 , H04N5/225 , H04N5/76
CPC分类号： H04N5/232 , H04N5/772 , H04N5/9201 , H04N5/928 , Y10S358/906
摘要： An apparatus for recording a video signal while forming a multiplicity of recording tracks in parallel on a tape-shaped recording medium, wherein camera information representing the operating state of a camera when shooting each picture is recorded in a position corresponding to the recorded track of that picture so that the operating state of the camera at the time of taking the video signal which has already been recorded can reappear. Therefore, in a case where a video signal is recorded in continuity with this recorded portion, the camera operating state is controlled in a joint portion of these to improve the continuity in this joint portion.
摘要翻译：一种在带状记录介质上并行形成多个记录轨道的同时记录视频信号的装置，其中在拍摄每个图像时表示相机的操作状态的相机信息被记录在与该记录轨迹的记录轨迹相对应的位置使得在拍摄已经记录的视频信号时相机的操作状态可以重新出现。因此，在与该记录部分连续记录视频信号的情况下，照相机操作状态被控制在这些连接部分中，以提高该关节部分的连续性。

10. 发明申请

US20120211271A1 MULTILAYER WIRING BOARD 有权
标题翻译：多层接线板
公开(公告)号：US20120211271A1
公开(公告)日：2012-08-23
申请号：US13399547
申请日：2012-02-17
申请人： Takuya HANDO , Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Hidetoshi WADA
发明人： Takuya HANDO , Masahiro INOUE , Hajime SAIKI , Atsuhiko SUGIMOTO , Hidetoshi WADA
IPC分类号： H05K1/02
CPC分类号： H05K3/4007 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/81192 , H01L2924/01084 , H05K3/0097 , H05K3/4682 , H05K2201/0367
摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.
摘要翻译：一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从提供表面。导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。可以在导电焊盘的上表面上形成焊料层。某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。

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