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    • 5. 发明申请
    • Photosensitive Resin Composition for Flexographic Printing
    • 用于柔版印刷的感光树脂组合物
    • US20090176176A1
    • 2009-07-09
    • US12226025
    • 2007-04-05
    • Yoshifumi ArakiKazuyoshi Yamazawa
    • Yoshifumi ArakiKazuyoshi Yamazawa
    • G03F7/075
    • G03F7/033G03F7/0757G03F7/202G03F7/36
    • There is provided a photosensitive resin composition for a solvent-developing or thermally-developing flexographic printing plate, the photosensitive resin composition comprising: (a) a block copolymer containing a polymer block having conjugated diene as a main component and a polymer block having a vinyl aromatic hydrocarbon as a main component; (b) a photopolymerizable monomer; (c) a photopolymerization initiator; and (d) an organosilicon compound. A photosensitive resin composition for printing in which the organosilicon compound is a silicone oil containing a specific group is preferable, and a photosensitive resin composition for printing in which the organosilicon compound is a silicone oil containing an amino group or an aryl group is most preferable.
    • 提供一种用于溶剂显影或热显影柔性版印刷版的感光性树脂组合物,该感光性树脂组合物包含:(a)含有共轭二烯作为主要成分的聚合物嵌段的嵌段共聚物和具有乙烯基 芳烃为主要成分; (b)可光聚合单体; (c)光聚合引发剂; 和(d)有机硅化合物。 优选其中有机硅化合物为含有特定基团的硅油的印刷用感光性树脂组合物,最优选为有机硅化合物为含有氨基或芳基的硅油的印刷用感光性树脂组合物。
    • 6. 发明授权
    • Photosensitive resin composition for flexographic printing
    • 用于柔性版印刷的感光树脂组合物
    • US08114566B2
    • 2012-02-14
    • US12226025
    • 2007-04-05
    • Yoshifumi ArakiKazuyoshi Yamazawa
    • Yoshifumi ArakiKazuyoshi Yamazawa
    • G03F7/004G03F7/027G03F7/028
    • G03F7/033G03F7/0757G03F7/202G03F7/36
    • There is provided a photosensitive resin composition for a solvent-developing or thermally-developing flexographic printing plate, the photosensitive resin composition comprising: (a) a block copolymer containing a polymer block having conjugated diene as a main component and a polymer block having a vinyl aromatic hydrocarbon as a main component; (b) a photopolymerizable monomer; (c) a photopolymerization initiator; and (d) an organosilicon compound. A photosensitive resin composition for printing in which the organosilicon compound is a silicone oil containing a specific group is preferable, and a photosensitive resin composition for printing in which the organosilicon compound is a silicone oil containing an amino group or an aryl group is most preferable.
    • 提供一种用于溶剂显影或热显影柔性版印刷版的感光性树脂组合物,该感光性树脂组合物包含:(a)含有共轭二烯作为主要成分的聚合物嵌段的嵌段共聚物和具有乙烯基 芳烃为主要成分; (b)可光聚合单体; (c)光聚合引发剂; 和(d)有机硅化合物。 优选其中有机硅化合物为含有特定基团的硅油的印刷用感光性树脂组合物,最优选为有机硅化合物为含有氨基或芳基的硅油的印刷用感光性树脂组合物。
    • 10. 发明申请
    • Photosensitive Resin Composition for Flexographic Printing
    • 用于柔版印刷的感光树脂组合物
    • US20080318161A1
    • 2008-12-25
    • US11666692
    • 2005-11-10
    • Katsuya NakanoYoshifumi ArakiMasahiro Fujiwara
    • Katsuya NakanoYoshifumi ArakiMasahiro Fujiwara
    • G03C1/06C08L53/02C08K5/13C08K5/49
    • G03F7/033
    • A photosensitive resin composition for flexographic printing comprising a thermoplastic elastomer (a), a photopolymerizable unsaturated monomer (b), and a photopolymerization initiator (c) as essential ingredients, wherein the thermoplastic elastomer (a) is a block copolymer composition containing a block copolymer (i) having at least one polymer block comprised mainly of a mono-alkenyl aromatic compound and at least one polymer block comprised mainly of butadiene, and a branched block copolymer (ii) having at least two polymer blocks comprised mainly of a mono-alkenyl aromatic compound and at least one polymer block comprised mainly of butadiene; the amount of the mono-alkenyl aromatic compound unit in the thermoplastic elastomer (a) is 10-28 mass %; the amount of the block copolymer (i) in the thermoplastic elastomer (a) is 15-50 mass %; and the number average molecular weight (number average molecular weight in terms of polystyrene measured by GPC) of the branched block copolymer (ii) is 200,000-400,000.
    • 一种用于柔性版印刷的感光性树脂组合物,其包含热塑性弹性体(a),光聚合性不饱和单体(b)和光聚合引发剂(c)作为必要成分,其中,所述热塑性弹性体(a)为含有嵌段共聚物 (i)具有至少一个主要由单链烯基芳族化合物和至少一个主要由丁二烯组成的聚合物嵌段的聚合物嵌段和具有至少两个聚合物嵌段的支链嵌段共聚物(ii),所述支链嵌段共聚物(ii)主要包含单链烯基 芳族化合物和至少一种主要由丁二烯组成的聚合物嵌段; 热塑性弹性体(a)中的单链烯基芳香族化合物单元的量为10〜28质量% 热塑性弹性体(a)中的嵌段共聚物(i)的量为15〜50质量%。 并且支链嵌段共聚物(ii)的数均分子量(以GPC计的聚苯乙烯换算的数均分子量)为20万〜400万。