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    • 2. 发明申请
    • Semiconductor light emitting element
    • 半导体发光元件
    • US20080185606A1
    • 2008-08-07
    • US12068019
    • 2008-01-31
    • Masahiko SanoTakahiko SakamotoKeiji EmuraKatsuyoshi Kadan
    • Masahiko SanoTakahiko SakamotoKeiji EmuraKatsuyoshi Kadan
    • H01L33/00
    • H01L33/38H01L33/02H01L33/405H01L33/42H01L33/44H01L33/46H01L2224/48091H01L2224/48247H01L2224/48465H01L2224/49107H01L2224/73265H01L2924/00014H01L2924/00
    • The present invention provides a light emitting element capable or realizing at least one of, preferably, most of lower resistance, higher output, higher power efficiency (1 m/W), higher mass productivity and lower cost of the element using a light transmissive electrode for an electrode arranged exterior to the light emitting structure.A semiconductor light emitting element including a light emitting section, a first electrode, and a second electrode on a semiconductor structure including first and second conductive type semiconductor layers, the first and the second electrodes being arranged on the first conductive type semiconductor layer and a second conductive type semiconductor layer of the light emitting section, respectively; and a light transmissive insulating film formed on at least one part of the second conductive type semiconductor layer; wherein the second electrode includes a first layer of a light transmissive conductive film for covering at least one part of the second conductive type semiconductor layer and a second layer which is arranged on at least one part of the light transmissive insulating film and which conducts to the first layer; a light reflecting part is formed on a surface side of the first layer, and a boundary region of the light transmissive insulating film and the semiconductor structure; and the second layer side surface of the light transmissive insulating film is distant from the semiconductor structure than the surface of the first layer is provided.
    • 本发明提供一种能够或实现低电阻,更高输出,更高功率效率(1m / W),更高的批量生产率和使用透光电极的元件的成本中的至少一个,优选地大多数的发光元件 用于布置在发光结构外部的电极。 一种半导体发光元件,包括在包括第一和第二导电类型半导体层的半导体结构上的发光部分,第一电极和第二电极,所述第一和第二电极布置在第一导电类型半导体层上, 导电型半导体层; 以及形成在所述第二导电类型半导体层的至少一部分上的透光绝缘膜; 其中所述第二电极包括用于覆盖所述第二导电类型半导体层的至少一部分的透光导电膜的第一层和布置在所述透光绝缘膜的至少一部分上的第二层, 第一层; 在第一层的表面侧和透光性绝缘膜与半导体结构的边界区域形成有光反射部, 并且提供透光绝缘膜的第二层侧表面比第一层的表面远离半导体结构。
    • 5. 发明授权
    • Semiconductor light emitting element and semiconductor light emitting device
    • 半导体发光元件及半导体发光元件
    • US08461617B2
    • 2013-06-11
    • US13060951
    • 2009-08-28
    • Katsuyoshi KadanYoshiki Inoue
    • Katsuyoshi KadanYoshiki Inoue
    • H01L33/08
    • H01L33/42H01L25/0753H01L27/15H01L27/153H01L33/20H01L33/32H01L33/38H01L33/382H01L33/40H01L2224/45144H01L2224/48091H01L2924/12032H01L2933/0016H01L2933/0025H01L2924/00
    • Provided is a semiconductor light emitting element wherein generation of an open failure of the light emitting device can be eliminated by ensuring a current pathway when disconnection is generated in a transparent electrode layer. A semiconductor light emitting element (10) is provided with: a first semiconductor layer (12) on a substrate (11); a light emitting layer (13) on the first semiconductor layer (12); a second semiconductor layer (14) on the light emitting layer (13); an insulator layer (15) provided with a hole portion (19) in a partial region on the second semiconductor layer (14); a transparent electrode layer (16) covering the upper surface of the insulator layer (15) and the second semiconductor layer (14) without covering the hole portion (19); and a second pad electrode (18) brought into contact with the second semiconductor layer (14) through the hole portion (19) and faces the insulator layer (15) with the transparent electrode layer (16) therebetween. Contact resistance between the second pad electrode (18) and the second semiconductor layer (14) is set larger than that between the transparent electrode layer (16) and the second semiconductor layer (14).
    • 提供了一种半导体发光元件,其中通过在透明电极层中产生断开而确保电流通路,可以消除发光器件的开路故障的产生。 半导体发光元件(10)具有:在基板(11)上的第一半导体层(12); 在所述第一半导体层(12)上的发光层(13); 在所述发光层(13)上的第二半导体层(14); 绝缘体层(15),其在所述第二半导体层(14)上的部分区域中设置有孔部分(19); 覆盖绝缘体层(15)的上表面的透明电极层(16)和不覆盖孔部分(19)的第二半导体层(14); 以及通过所述孔部(19)与所述第二半导体层(14)接触并与所述绝缘体层(15)面对的第二焊盘电极(18),所述第二焊盘电极与所述第二半导体层接触。 第二焊盘电极(18)和第二半导体层(14)之间的接触电阻被设定为大于透明电极层(16)和第二半导体层(14)之间的接触电阻。
    • 6. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 半导体发光元件和半导体发光器件
    • US20110156065A1
    • 2011-06-30
    • US13060951
    • 2009-08-28
    • Katsuyoshi KadanYoshiki Inoue
    • Katsuyoshi KadanYoshiki Inoue
    • H01L33/08H01L33/42
    • H01L33/42H01L25/0753H01L27/15H01L27/153H01L33/20H01L33/32H01L33/38H01L33/382H01L33/40H01L2224/45144H01L2224/48091H01L2924/12032H01L2933/0016H01L2933/0025H01L2924/00
    • Provided is a semiconductor light emitting element wherein generation of an open failure of the light emitting device can be eliminated by ensuring a current pathway when disconnection is generated in a transparent electrode layer. A semiconductor light emitting element (10) is provided with: a first semiconductor layer (12) on a substrate (11); a light emitting layer (13) on the first semiconductor layer (12); a second semiconductor layer (14) on the light emitting layer (13); an insulator layer (15) provided with a hole portion (19) in a partial region on the second semiconductor layer (14); a transparent electrode layer (16) covering the upper surface of the insulator layer (15) and the second semiconductor layer (14) without covering the hole portion (19); and a second pad electrode (18) brought into contact with the second semiconductor layer (14) through the hole portion (19) and faces the insulator layer (15) with the transparent electrode layer (16) therebetween. Contact resistance between the second pad electrode (18) and the second semiconductor layer (14) is set larger than that between the transparent electrode layer (16) and the second semiconductor layer (14).
    • 提供了一种半导体发光元件,其中通过在透明电极层中产生断开而确保电流通路,可以消除发光器件的开路故障的产生。 半导体发光元件(10)具有:在基板(11)上的第一半导体层(12); 在所述第一半导体层(12)上的发光层(13); 在所述发光层(13)上的第二半导体层(14); 绝缘体层(15),其在所述第二半导体层(14)上的部分区域中设置有孔部分(19); 覆盖绝缘体层(15)的上表面的透明电极层(16)和不覆盖孔部分(19)的第二半导体层(14); 以及通过所述孔部(19)与所述第二半导体层(14)接触并与所述绝缘体层(15)面对的第二焊盘电极(18),所述第二焊盘电极与所述第二半导体层接触。 第二焊盘电极(18)和第二半导体层(14)之间的接触电阻被设定为大于透明电极层(16)和第二半导体层(14)之间的接触电阻。