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1. 发明授权

US5616520A Semiconductor integrated circuit device and fabrication method thereof 失效
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US5616520A
公开(公告)日：1997-04-01
申请号：US367490
申请日：1994-12-30
申请人： Masahiko Nishiuma , Norio Nakazato , Hiroyuki Takahashi , Chiyoshi Kamada , Motoo Suwa
发明人： Masahiko Nishiuma , Norio Nakazato , Hiroyuki Takahashi , Chiyoshi Kamada , Motoo Suwa
IPC分类号： H01L21/60 , H01L23/10 , H01L23/367 , H01L23/433 , H01L23/485 , H01L23/66
CPC分类号： H01L24/16 , H01L23/10 , H01L23/367 , H01L23/3672 , H01L23/3677 , H01L23/433 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/75 , H01L24/81 , H01L2224/1134 , H01L2224/1184 , H01L2224/1308 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45144 , H01L2224/73253 , H01L2224/749 , H01L2224/75 , H01L2224/75753 , H01L2224/78301 , H01L2224/81193 , H01L2224/81208 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , Y10T29/49144
摘要： A semiconductor device is fabricated by forming first metal balls on electrode pads of a semiconductor chip. The first metal balls each can have a sharp tipped anchor. All of the anchors simultaneously flattened slightly only to the extent of equalizing the height thereof. The first metal balls are bonded to electrodes formed on a substrate with wirings by embedding the anchors into the electrodes. Alternatively, second metal balls can be formed on the electrodes which are then flattened to equalize the height thereof. The first metal balls, either with or without the anchors, are bonded to the second metal balls. The first and second metal balls are preferably heated during the bonding step to soften the second metal balls.
摘要翻译：通过在半导体芯片的电极焊盘上形成第一金属球来制造半导体器件。第一个金属球各自可以具有尖锐的尖头锚。所有的锚点同样平坦化，只能达到使其高度均匀的程度。通过将锚固件嵌入电极中，第一金属球通过布线与形成在基板上的电极结合。或者，可以在电极上形成第二金属球，然后将其平坦化以使其高度均匀。具有或不具有锚固件的第一金属球结合到第二金属球。第一和第二金属球优选在接合步骤期间被加热以软化第二金属球。

2. 发明授权

US07508054B2 Semiconductor device and a method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07508054B2
公开(公告)日：2009-03-24
申请号：US11153359
申请日：2005-06-16
申请人： Fujiaki Nose , Hiroshi Kikuchi , Satoshi Ueno , Norio Nakazato
发明人： Fujiaki Nose , Hiroshi Kikuchi , Satoshi Ueno , Norio Nakazato
IPC分类号： H01L23/495
CPC分类号： H01L23/642 , H01L23/3107 , H01L23/49551 , H01L23/5222 , H01L23/66 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L2223/6627 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/78701 , H01L2224/78755 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/10162 , H01L2924/1305 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/18301 , H01L2924/19033 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , Y10T29/49121 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a die pad smaller than a main surface of the semiconductor chip, a sealing member, plural leads each comprising an outer terminal portion and an inner lead portion, and plural bonding wires for connection between bonding pads formed on the semiconductor chip and the inner lead portions of the leads, each of the inner lead portions being bent in a direction away from a mounting surface of the sealing member, thereby approximating the height of the chip-side bonding pads and that of a bonding position of the inner lead portions to each other, whereby the wire length can be made shorter and it is possible to suppress an increase in inductance of the wire portions and attain impedance matching at various portion of a high-frequency signal input/output transmission path.
摘要翻译：公开了一种用于形成封装的装置，其中使用引线接合方法在其上安装了形成有高速LSI的半导体芯片。封装包括半导体芯片，小于半导体芯片的主表面的管芯焊盘，密封构件，多个引线，每个引线包括外部端子部分和内部引线部分，以及多个接合线，用于连接形成在半导体芯片和引线的内引线部分，每个内引线部分沿着远离密封部件的安装表面的方向弯曲，从而接近芯片侧焊盘的高度和接合位置的接合位置内部引线部分彼此之间，从而可以缩短导线长度，并且可以抑制线部分的电感增加，并在高频信号输入/输出传输路径的各个部分获得阻抗匹配。

3. 发明申请

US20060261351A1 Semiconductor light source device 失效
标题翻译：半导体光源装置
公开(公告)号：US20060261351A1
公开(公告)日：2006-11-23
申请号：US11399607
申请日：2006-04-07
申请人： Norio Nakazato , Kimihiko Sudo
发明人： Norio Nakazato , Kimihiko Sudo
IPC分类号： H01L33/00 , H01L31/12
CPC分类号： H01L33/645 , H01L25/0753 , H01L2224/45144 , H01L2224/48464 , H01L2224/73265 , H01L2924/10253 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor light source device, for enabling to cool LED elements driven with short pulses, effectively, and also being cheaply producible without increasing the number of pats thereof, comprising a plural number of light emitting diode chips 202 on a heat diffusion plate 201, and Pertier elements 208, as being thermoelectric cooling elements, for cooling the plural number of light emitting diode chips 202, wherein a pair of members 208(n) and 2008(p), building up the Pertier element for cooling each the light emitting diode chip, are electrically connected on each of the light emitting diode chip through bumps 207, so as to form said light emitting diode chip and the Pertier element as a unit on the heat diffusion plate, respectively, and thereby moving heat generation within each of the light emitting diode chips, directly, into the heat diffusion plate and/or a heat radiation plate.
摘要翻译：一种半导体光源装置，其能够有效地冷却以短脉冲驱动的LED元件，并且也可以廉价地生产，而不增加其拍摄次数，包括在散热板201上的多个发光二极管芯片202，以及作为用于冷却多个发光二极管芯片202的热电冷却元件的像素元件208，其中一对构件208（n）和2008（p））构建用于冷却每个发光二极管芯片的Pertier元件通过凸块207电连接在每个发光二极管芯片上，以便分别在散热板上形成作为一个单元的所述发光二极管芯片和Pertier元件，从而在每个光源内移动发热发光二极管芯片直接放入热扩散板和/或散热板中。

4. 发明授权

US06498702B1 Magnetic head supporting apparatus having thermally insulated read/write IC mounted on arm portions thereof 失效
标题翻译：具有安装在其臂部上的热绝缘读/写IC的磁头支撑装置
公开(公告)号：US06498702B1
公开(公告)日：2002-12-24
申请号：US09510339
申请日：2000-02-22
申请人： Hayato Shimizu , Norio Nakazato , Masaaki Matsumoto , Yoshihiro Shiroishi , Mikio Tokuyama , Toshihiko Shimizu , Shigeo Nakamura
发明人： Hayato Shimizu , Norio Nakazato , Masaaki Matsumoto , Yoshihiro Shiroishi , Mikio Tokuyama , Toshihiko Shimizu , Shigeo Nakamura
IPC分类号： G11B548
CPC分类号： G11B5/486 , G11B5/4833
摘要： A magnetic head supporting apparatus includes a magnetic head for reading and writing information on a magnetic disc, a slider having the magnetic head, and a suspension for supporting the slider. An IC chip for controlling a signal of the magnetic head is mounted on a first surface of a heat insulating substrate, and a second surface of the heat insulating substrate opposite to the first surface thereof is mounted to the suspension.
摘要翻译：磁头支撑装置包括用于在磁盘上读取和写入信息的磁头，具有磁头的滑块和用于支撑滑块的悬架。用于控制磁头的信号的IC芯片安装在绝热基板的第一表面上，并且与其第一表面相对的绝热基板的第二表面安装在悬架上。

5. 发明授权

US5674956A Method for producing high viscosity materials 失效
标题翻译：生产高粘度材料的方法
公开(公告)号：US5674956A
公开(公告)日：1997-10-07
申请号：US445102
申请日：1995-05-19
申请人： Hidekazu Nakamoto , Chikao Oda , Norio Nakazato , Morihisa Maruko , Kazuo Ihara , Takatoshi Kinoshita , Tokinobu Furukawa , Kenichi Watanabe
发明人： Hidekazu Nakamoto , Chikao Oda , Norio Nakazato , Morihisa Maruko , Kazuo Ihara , Takatoshi Kinoshita , Tokinobu Furukawa , Kenichi Watanabe
IPC分类号： B01F7/00 , B01F7/16 , B01F15/00 , B01F15/02 , B01F15/06 , B01J19/18 , C08F2/02
CPC分类号： B01F7/00175 , B01F15/00201 , B01F15/00376 , B01F15/028 , B01F15/0289 , B01F15/065 , B01F15/068 , B01F7/00391 , B01F7/16 , B01F7/166 , B01J19/18 , B01F7/0025 , B01F7/00441 , B01F7/00583 , B01J2219/00094 , B01J2219/00168 , B01J2219/185 , B01J2219/1946
摘要： Agitator blades formed by connecting a plurality of frame members are provided in a cylindrical or conical container to realize the agitator blade structure without rotary shaft. Therefore, less liquids being treated adhere onto the rotary shaft or the agitator blades and less residue of the liquids is formed, making it possible to obtain a final high viscosity polymer using the same agitator vessel preventing the quality from being deteriorated.
摘要翻译：通过连接多个框架构件形成的搅拌器叶片设置在圆柱形或锥形容器中，以实现没有旋转轴的搅拌器叶片结构。因此，处理较少的液体粘附在旋转轴或搅拌器叶片上，并且形成较少的液体残留物，使得可以使用相同的搅拌器容器获得最终的高粘度聚合物，从而防止质量劣化。

6. 发明授权

US4565601A Method and apparatus for controlling sample temperature 失效
标题翻译：用于控制样品温度的方法和装置
公开(公告)号：US4565601A
公开(公告)日：1986-01-21
申请号：US675863
申请日：1984-11-28
申请人： Yutaka Kakehi , Norio Nakazato , Yoshimasa Fukushima , Kousai Hiratsuka , Fumio Shibata , Noriaki Yamamoto , Tsunehiko Tsubone
发明人： Yutaka Kakehi , Norio Nakazato , Yoshimasa Fukushima , Kousai Hiratsuka , Fumio Shibata , Noriaki Yamamoto , Tsunehiko Tsubone
IPC分类号： B61D19/02 , C23C14/54 , G05D23/19 , H01J37/20 , B44C1/22 , C03C15/00 , C03C25/06 , C23F1/02
CPC分类号： G05D23/1919 , C23C14/541 , H01J37/20
摘要： This invention relates to a method and apparatus for controlling temperature of a sample and is intended to prevent a sample from being deformed by the pressure of a heat transmission gas by mounting and fixing the sample being mounted and processed in a vacuum on and to the sample stand and supplying the heat transmission gas to the gap between the under surface of the sample thus fixed and the sample stand; effectively control the temperature of the sample being processed in a vacuum by limiting the size of the gap between the under surface of the sample and the sample stand; and make the heat transmission gas least affect the process by limiting the flow of the heat transmission gas in the vacuum process chamber.
摘要翻译：本发明涉及一种用于控制样品温度的方法和装置，旨在通过将真空中安装和处理的样品安装并固定到样品上来防止样品被传热气体的压力变形将传热气体放置并供给到如此固定的样品的下表面与样品台之间的间隙; 通过限制样品的下表面和样品台之间的间隙的大小，有效地控制在真空中正在处理的样品的温度; 并且通过限制真空处理室中的传热气体的流动使得传热气体对该过程最不重要。

7. 发明授权

US4208199A Process of and system for liquefying air to separate its component 失效
标题翻译：用于液化空气以分离其组分的方法和系统
公开(公告)号：US4208199A
公开(公告)日：1980-06-17
申请号：US951974
申请日：1978-10-16
申请人： Norio Nakazato , Norihide Saho , Sachihiro Yoshimatsu , Michimasa Okabe
发明人： Norio Nakazato , Norihide Saho , Sachihiro Yoshimatsu , Michimasa Okabe
IPC分类号： F25J3/04
CPC分类号： F25J3/04878 , F25J3/04303 , F25J3/04424 , F25J3/04872 , F25J2290/10
摘要： In a process of and a system for liquefying air to separate its components employing a so-called compound fractionating column, the system includes a fractionating medium pressure column into which a part of feed air is introduced to flow therethrough as an upwardly flowing gas for contact with a returning liquid, so as to obtain nitrogen gas at the top thereof and change the returning liquid to liquefied air as it reaches the bottom thereof, a first condenser adapted for a heat exchange between a liquefied air of a reduced pressure, which has been obtained by allowing an expansion of the liquefied air available at the bottom of the medium pressure column, and the nitrogen gas obtained at the top of the medium pressure column, so as to liquefy the nitrogen gas to make use of it as the returning liquid for the medium pressure column, a second condenser adapted for a heat exchange between the remainder part of feed air and liquefied oxygen to evaporate the oxygen, and a fractionating low pressure column through which the evaporated oxygen is made to flow as an upwardly flowing gas adapted to be contacted by a returning liquid coming down from the top of the low pressure column for a fractionation, whereby an impure gas is obtained at the top of the low pressure column, while the returning liquid is changed to liquefied oxygen as it reaches the bottom of the low pressure column.
摘要翻译：在使用所谓的化合物分馏塔分离其组分的过程和用于液化空气的系统的过程中，该系统包括分馏中压塔，一部分进料空气被引入其中，作为向上流动的气体用于接触返回液体，以便在其顶部获得氮气，并且当返回液体到达其底部时将返回液体改变为液化空气，第一冷凝器适于在已经被减压的液化空气之间进行热交换通过允许在中压塔底部可获得的液化气体的膨胀和在中压塔顶部获得的氮气而膨胀，以使氮气液化以利用其作为返回液体中压塔，第二冷凝器，适于在进料空气的剩余部分和液化氧之间进行热交换以蒸发氧气，以及分馏低使蒸发的氧气通过该压力塔作为向上流动的气体流动，该气体适于与从低压塔的顶部下来的回流液体接触，以进行分馏，由此在低温的顶部获得不纯的气体压力塔，同时返回的液体在达到低压塔的底部时变为液化的氧气。

8. 发明授权

US08547502B2 Light source module 失效
标题翻译：光源模块
公开(公告)号：US08547502B2
公开(公告)日：2013-10-01
申请号：US12254852
申请日：2008-10-21
申请人： Norio Nakazato , Kimihiko Sudo , Hiroshi Akai , Naoki Yotsumoto , Hiroshi Oyama , Shigeyuki Sasaki , Atsushi Hatakeyama , Takaaki Maruyama , Kouichi Tanabe
发明人： Norio Nakazato , Kimihiko Sudo , Hiroshi Akai , Naoki Yotsumoto , Hiroshi Oyama , Shigeyuki Sasaki , Atsushi Hatakeyama , Takaaki Maruyama , Kouichi Tanabe
IPC分类号： G02F1/13339
CPC分类号： H01L33/483 , H01L33/54 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/48471 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/00
摘要： It is to provide a light source module capable of downsizing an edge-light type backlight in thickness and reducing the usage amount of resin. A method of manufacturing a light source module includes a process of preparing a substrate with a first reflector including a reflecting surface mounted thereon, a process of mounting a plurality of light emitting elements on the substrate, a process of mounting a wiring board having an electrode on the substrate, a process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire, a process of mounting a second reflector having a reflecting surface on the wiring board, and a process of filling the space between the first reflector and the second reflector, with resin.
摘要翻译：提供能够使边缘光型背光的厚度小型化并且减少树脂的使用量的光源模块。一种制造光源模块的方法包括：制备具有安装在其上的反射表面的第一反射器的基板的处理，将多个发光元件安装在基板上的工艺，安装具有电极的布线板的工艺在基板上，使用金属线将发光元件的电极和布线板的电极连接的过程，在布线基板上安装具有反射面的第二反射体的处理以及填充第一反射器和第二反射器，具有树脂。

9. 发明申请

US20050263869A1 Semiconductor device and manufacturing process therefor 审中-公开
标题翻译：半导体器件及其制造工艺
公开(公告)号：US20050263869A1
公开(公告)日：2005-12-01
申请号：US11138936
申请日：2005-05-25
申请人： Naotaka Tanaka , Norio Nakazato , Takahiro Naito
发明人： Naotaka Tanaka , Norio Nakazato , Takahiro Naito
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/485 , H01L23/495 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/481 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/05001 , H01L2224/05022 , H01L2224/05147 , H01L2224/05166 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： To provide a very-low-cost and short-TAT connection structure superior in connection reliability in accordance with a method for three-dimensionally connecting a plurality of semiconductor chips at a shortest wiring length by using a through-hole electrode in order to realize a compact, high-density, and high-function semiconductor system. The back of a semiconductor chip is decreased in thickness up to a predetermined thickness through back-grinding, a hole reaching a surface-layer electrode is formed at a back position corresponding to a device-side external electrode portion through dry etching, a metallic deposit is applied to the sidewall of the hole and the circumference of the back of the hole, a metallic bump (protruded electrode) of another semiconductor chip laminated on the upper side is deformation-injected into the through-hole by compression bonding, and the metallic bump is geometrically caulked and electrically connected to the inside of a through-hole formed in an LSI chip. It is possible to realize a unique connection structure having a high reliability in accordance with the caulking action using the plastic flow of a metallic bump in a very-low-cost short-TAT process and provide a three-dimensional inter-chip connection structure having a high practicability.
摘要翻译：为了提供一种根据用于通过使用通孔电极以最短布线长度三维连接多个半导体芯片的方法来提供优异的连接可靠性的极低成本和短TAT连接结构，以便实现紧凑，高密度和高功能的半导体系统。通过背面研磨，半导体芯片的背面的厚度减小到规定的厚度，通过干法蚀刻，在与设备侧的外部电极部对应的后方位置形成到达表层电极的孔，金属沉积物施加到孔的侧壁和孔的背面的周围，层叠在上侧的另一半导体芯片的金属凸块（突出电极）通过压接而变形注入到通孔中，并且金属凸块几何地被铆接并电连接到形成在LSI芯片中的通孔的内部。可以在非常低成本的短TAT工艺中实现使用金属凸块的塑性流动的铆接动作具有高可靠性的独特的连接结构，并且提供一种三维芯片间连接结构，其具有实用性高。

10. 发明授权

US06924549B2 Semiconductor device and a method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06924549B2
公开(公告)日：2005-08-02
申请号：US10621411
申请日：2003-07-18
申请人： Fujiaki Nose , Hiroshi Kikuchi , Satoshi Ueno , Norio Nakazato
发明人： Fujiaki Nose , Hiroshi Kikuchi , Satoshi Ueno , Norio Nakazato
IPC分类号： H01L23/50 , H01L23/31 , H01L23/495 , H01L23/522 , H01L23/64 , H01L23/66
CPC分类号： H01L23/642 , H01L23/3107 , H01L23/49551 , H01L23/5222 , H01L23/66 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L2223/6627 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/78701 , H01L2224/78755 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/10162 , H01L2924/1305 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/18301 , H01L2924/19033 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , Y10T29/49121 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a die pad smaller than a main surface of the semiconductor chip, a sealing member, plural leads each comprising an outer terminal portion and an inner lead portion, and plural bonding wires for connection between bonding pads formed on the semiconductor chip and the inner lead portions of the leads, each of the inner lead portions being bent in a direction away from a mounting surface of the sealing member, thereby approximating the height of the chip-side bonding pads and that of a bonding position of the inner lead portions to each other, whereby the wire length can be made shorter and it is possible to suppress an increase in inductance of the wire portions and attain impedance matching at various portion of a high-frequency signal input/output transmission path.
摘要翻译：公开了一种用于形成封装的装置，其中使用引线接合方法在其上安装了形成有高速LSI的半导体芯片。封装包括半导体芯片，小于半导体芯片的主表面的管芯焊盘，密封构件，多个引线，每个引线包括外部端子部分和内部引线部分，以及多个接合线，用于连接形成在半导体芯片和引线的内引线部分，每个内引线部分沿着远离密封部件的安装表面的方向弯曲，从而接近芯片侧焊盘的高度和接合位置的接合位置内部引线部分彼此之间，从而可以缩短导线长度，并且可以抑制线部分的电感增加，并在高频信号输入/输出传输路径的各个部分获得阻抗匹配。

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