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    • 2. 发明申请
    • Semiconductor light source device
    • 半导体光源装置
    • US20060261351A1
    • 2006-11-23
    • US11399607
    • 2006-04-07
    • Norio NakazatoKimihiko Sudo
    • Norio NakazatoKimihiko Sudo
    • H01L33/00H01L31/12
    • H01L33/645H01L25/0753H01L2224/45144H01L2224/48464H01L2224/73265H01L2924/10253H01L2924/181H01L2924/19107H01L2924/00H01L2924/00012
    • A semiconductor light source device, for enabling to cool LED elements driven with short pulses, effectively, and also being cheaply producible without increasing the number of pats thereof, comprising a plural number of light emitting diode chips 202 on a heat diffusion plate 201, and Pertier elements 208, as being thermoelectric cooling elements, for cooling the plural number of light emitting diode chips 202, wherein a pair of members 208(n) and 2008(p), building up the Pertier element for cooling each the light emitting diode chip, are electrically connected on each of the light emitting diode chip through bumps 207, so as to form said light emitting diode chip and the Pertier element as a unit on the heat diffusion plate, respectively, and thereby moving heat generation within each of the light emitting diode chips, directly, into the heat diffusion plate and/or a heat radiation plate.
    • 一种半导体光源装置,其能够有效地冷却以短脉冲驱动的LED元件,并且也可以廉价地生产,而不增加其拍摄次数,包括在散热板201上的多个发光二极管芯片202,以及 作为用于冷却多个发光二极管芯片202的热电冷却元件的像素元件208,其中一对构件208(n)和2008(p))构建用于冷却每个发光二极管芯片的Pertier元件 通过凸块207电连接在每个发光二极管芯片上,以便分别在散热板上形成作为一个单元的所述发光二极管芯片和Pertier元件,从而在每个光源内移动发热 发光二极管芯片直接放入热扩散板和/或散热板中。
    • 3. 发明授权
    • Semiconductor light source device
    • 半导体光源装置
    • US07525191B2
    • 2009-04-28
    • US11399607
    • 2006-04-07
    • Norio NakazatoKimihiko Sudo
    • Norio NakazatoKimihiko Sudo
    • H01L23/34H01L31/0232
    • H01L33/645H01L25/0753H01L2224/45144H01L2224/48464H01L2224/73265H01L2924/10253H01L2924/181H01L2924/19107H01L2924/00H01L2924/00012
    • A semiconductor light source device, for enabling to cool LED elements driven with short pulses, effectively, and also being cheaply producible without increasing the number of pats thereof, comprising a plural number of light emitting diode chips 202 on a heat diffusion plate 201, and Peltier elements 208, as being thermoelectric cooling elements, for cooling the plural number of light emitting diode chips 202, wherein a pair of members 208(n) and 2008(p), building up the Peltier element for cooling each the light emitting diode chip, are electrically connected on each of the light emitting diode chip through bumps 207, so as to form said light emitting diode chip and the Peltier element as a unit on the heat diffusion plate, respectively, and thereby moving heat generation within each of the light emitting diode chips, directly, into the heat diffusion plate and/or a heat radiation plate.
    • 一种半导体光源装置,其能够有效地冷却以短脉冲驱动的LED元件,并且也可以廉价地生产,而不增加其拍摄次数,包括在散热板201上的多个发光二极管芯片202,以及 作为热电冷却元件的珀耳帖元件208用于冷却多个发光二极管芯片202,其中一对构件208(n)和2008(p)构成珀尔帖元件,用于冷却每个发光二极管芯片 通过凸块207电连接在每个发光二极管芯片上,以分别在散热板上形成作为单元的所述发光二极管芯片和珀耳帖元件,从而在每个光源内移动发热 发光二极管芯片直接放入热扩散板和/或散热板中。
    • 6. 发明授权
    • Hermetically resealable hard-disk drive configured for recharging with a low-density gas
    • 密封可重新密封的硬盘驱动器配置为用低密度气体充电
    • US08659849B2
    • 2014-02-25
    • US13340332
    • 2011-12-29
    • Takako HayakawaKouki UefuneKimihiko SudoNoritaka Otake
    • Takako HayakawaKouki UefuneKimihiko SudoNoritaka Otake
    • G11B33/08G11B33/14
    • G11B25/043G11B33/148
    • A hermetically resealable hard-disk drive (HDD) configured for recharging with a low-density gas. The hermetically resealable HDD includes a disk enclosure (DE), a magnetic-recording disk, a head-slider, an actuator, a low-density gas, a through-hole, and a plug. The DE includes a base, and a first cover and a second cover joined to the base. The second cover is disposed above the first cover. The through-hole is configurable for injection of a low-density gas into the DE. The low-density gas, having a density less than air, substantially fills the DE. The plug is press-fitted into, and hermetically seals, the through-hole. The plug is removable to allow recharging the DE with the low-density gas; and, the through-hole is configured to accept a resealing plug to be press-fit into, and to reseal hermetically, the through-hole after recharging. A method for injecting low-density gas into, and sealing, the hermetically resealable HDD is also provided.
    • 密封可重新密封的硬盘驱动器(HDD),配置为用低密度气体充电。 气密可再密封的HDD包括盘盒(DE),磁记录盘,头滑块,致动器,低密度气体,通孔和插头。 DE包括基座,以及连接到基座的第一盖和第二盖。 第二盖设置在第一盖的上方。 通孔可配置为将低密度气体注入到DE中。 密度小于空气的低密度气体基本上填满了DE。 将插头压入并密封通孔。 该插头是可拆卸的,以允许DE与低密度气体充电; 并且通孔被配置为接受重新密封的塞子,以在再充电之后被压配合并且密封地重新密封通孔。 还提供了一种将低密度气体注入并密封可密封再密封的HDD的方法。
    • 8. 发明申请
    • HERMETICALLY RESEALABLE HARD-DISK DRIVE CONFIGURED FOR RECHARGING WITH A LOW-DENSITY GAS
    • 用低密度气体补充配置的可吸收硬磁盘驱动器
    • US20130170074A1
    • 2013-07-04
    • US13340332
    • 2011-12-29
    • Takako HayakawaKouki UefuneKimihiko SudoNoritaka Otake
    • Takako HayakawaKouki UefuneKimihiko SudoNoritaka Otake
    • G11B33/14
    • G11B25/043G11B33/148
    • A hermetically resealable hard-disk drive (HDD) configured for recharging with a low-density gas. The hermetically resealable HDD includes a disk enclosure (DE), a magnetic-recording disk, a head-slider, an actuator, a low-density gas, a through-hole, and a plug. The DE includes a base, and a first cover and a second cover joined to the base. The second cover is disposed above the first cover. The through-hole is configurable for injection of a low-density gas into the DE. The low-density gas, having a density less than air, substantially fills the DE. The plug is press-fitted into, and hermetically seals, the through-hole. The plug is removable to allow recharging the DE with the low-density gas; and, the through-hole is configured to accept a resealing plug to be press-fit into, and to reseal hermetically, the through-hole after recharging. A method for injecting low-density gas into, and sealing, the hermetically resealable HDD is also provided.
    • 密封可重新密封的硬盘驱动器(HDD),配置为用低密度气体充电。 气密可再密封的HDD包括盘盒(DE),磁记录盘,头滑块,致动器,低密度气体,通孔和插头。 DE包括基座,以及连接到基座的第一盖和第二盖。 第二盖设置在第一盖的上方。 通孔可配置为将低密度气体注入到DE中。 密度小于空气的低密度气体基本上填满了DE。 将插头压入并密封通孔。 该插头是可拆卸的,以允许DE与低密度气体充电; 并且通孔被配置为接受重新密封的塞子,以在再充电之后被压配合并且密封地重新密封通孔。 还提供了一种将低密度气体注入并密封可密封再密封的HDD的方法。