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1. 发明授权

US08846552B2 Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance 有权
标题翻译：可溶性末端改性酰亚胺低聚物，使用2-苯基-4,4'-二氨基二苯醚，清漆，其固化产物，其酰亚胺预浸料，以及具有优异耐热性的纤维增强层压材料
公开(公告)号：US08846552B2
公开(公告)日：2014-09-30
申请号：US13062132
申请日：2009-09-03
申请人： Masahiko Miyauchi , Yuichi Ishida , Toshio Ogasawara , Rikio Yokota
发明人： Masahiko Miyauchi , Yuichi Ishida , Toshio Ogasawara , Rikio Yokota
IPC分类号： B32B5/26 , B05D3/10 , C08G73/10 , C08K5/3415 , C09D179/08 , C09J5/02 , D04H3/14 , D04H3/16 , C07D209/48 , C08L79/08 , C08F290/06 , C07D487/04 , C08F299/00 , C08F299/02 , C08J5/24 , C08K7/02
CPC分类号： C08F290/065 , C07D209/48 , C07D487/04 , C08F299/00 , C08F299/02 , C08G73/1042 , C08G73/105 , C08G73/1071 , C08J5/24 , C08J2379/08 , C08K7/02 , C08L79/08 , C09D179/08 , Y10T428/24994 , Y10T428/24995 , Y10T442/2631 , Y10T442/671 , Y10T442/69
摘要： A novel terminally modified imide oligomer having excellent solubility in organic solvents, excellent solution storage stability, and excellent molding properties such as low melt viscosity. Also, a varnish obtained by dissolving the terminally modified imide oligomer in an organic solvent; a cure product obtained by using the terminally modified imide oligomer and having excellent thermal and mechanical characteristics such as heat resistance, elastic modulus, tensile strength at break and tensile elongation at break; a prepreg; and a fiber-reinforced laminate. The soluble terminally modified imide oligomer is represented by general formula (1). In the formula, R1 and R2 each represents a divalent aromatic diamine residue; R3 and R4 each represents a tetravalent aromatic tetracarboxylic acid residue; R5 and R6 each represents a hydrogen atom or a phenyl group, with R5 or R6 being a phenyl group; m and n satisfy the following relations: m≧1, n≧0, 1≦m+n≦20 and 0.05≦m/(m+n)≦1; and the repeating units may be arranged in blocks or randomly.
摘要翻译：一种在有机溶剂中具有优异溶解性的新型末端改性酰亚胺低聚物，优异的溶液保存稳定性，以及优异的成型性能如熔融粘度低。另外，将末端改性酰亚胺低聚物溶解在有机溶剂中得到的清漆; 通过使用末端改性的酰亚胺低聚物得到的固化产物，具有优异的耐热性，弹性模量，断裂拉伸强度和断裂拉伸伸长率等热和机械特性。预浸料和纤维增强层压板。可溶性末端改性酰亚胺低聚物由通式（1）表示。在该式中，R 1和R 2各自表示二价芳族二胺残基; R3和R4各自表示四价芳族四羧酸残基; R5和R6各自表示氢原子或苯基，R5或R6是苯基; m和n满足以下关系：m≥1，n≥0,1＆nlE; m + n＆nlE; 20和0.05＆nlE; m /（m + n）＆nlE; 1; 并且重复单元可以以块或随机方式排列。

2. 发明申请

US20140011950A1 RESIN-TRANSFER-MOLDABLE TERMINAL-MODIFIED IMIDE OLIGOMER USING 2-PHENYL-4,4' DIAMINODIPHENYL ETHER AND HAVING EXCELLENT MOLDABILITY, MIXTURE THEREOF, VARNISH CONTAINING SAME, AND CURED RESIN THEREOF AND FIBER-REINFORCED CURED RESIN THEREOF MADE BY RESIN TRANSFER MOLDING AND HAVING EXCELLENT HEAT RESISTANCE 有权
标题翻译：使用2-苯基-4,4'-二氨基二苯醚的具有优异成型性的树脂转移的可熔融的端接改性的二异氰酸酯，其混合物，含有它们的混合物，其固化树脂及其通过树脂转移成型制成的纤维增强的固化树脂具有优异的耐热性
公开(公告)号：US20140011950A1
公开(公告)日：2014-01-09
申请号：US14005450
申请日：2012-03-15
申请人： Masahiko Miyauchi , Yuichi Ishida , Toshio Ogasawara , Rikio Yokota
发明人： Masahiko Miyauchi , Yuichi Ishida , Toshio Ogasawara , Rikio Yokota
IPC分类号： C08G73/10 , C08L79/08 , C09D179/08
CPC分类号： C08G73/1071 , C08G73/1014 , C08G73/105 , C08J5/04 , C08J2379/08 , C08L79/08 , C09D179/08
摘要： A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more. In the formula, R1 and R2 are a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of R1 and R2 is the aromatic hydrocarbon group having 6 to 10 carbon atoms; R3 is an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, R3s are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.
摘要翻译：一种具有四价芳族四羧酸残基并由通式（1）表示的新型树脂转移可成型末端改性酰亚胺低聚物，酰亚胺低聚物含有其中n为0的低聚物，其量为10摩尔％，或更多。式中，R 1，R 2为氢原子或碳原子数6〜10的芳香族烃基，R 1和R 2中的一个为碳原子数为6〜10的芳香族烃基。 R3是在芳香族四羧酸中被四个羰基包围的芳香族有机基团，对于n为2以上的式，R 3可以相同也可以不同， n为0以上且6以下的整数。

3. 发明授权

US09051430B2 Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4′diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance 有权
标题翻译：使用2-苯基-4,4'-二氨基二苯醚的具有优异成型性的树脂转移成型性末端改性酰亚胺低聚物，其混合物，含有它们的清漆，其固化树脂和通过树脂传递模塑制成的纤维增强固化树脂，具有优异的耐热性
公开(公告)号：US09051430B2
公开(公告)日：2015-06-09
申请号：US14005450
申请日：2012-03-15
申请人： Masahiko Miyauchi , Yuichi Ishida , Toshio Ogasawara , Rikio Yokota
发明人： Masahiko Miyauchi , Yuichi Ishida , Toshio Ogasawara , Rikio Yokota
IPC分类号： C08G73/10 , C09D179/08 , C08L79/08 , C08J5/04
CPC分类号： C08G73/1071 , C08G73/1014 , C08G73/105 , C08J5/04 , C08J2379/08 , C08L79/08 , C09D179/08
摘要： A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more. In the formula, R1 and R2 are a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of R1 and R2 is the aromatic hydrocarbon group having 6 to 10 carbon atoms; R3 is an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, Ras are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.
摘要翻译：一种具有四价芳族四羧酸残基并由通式（1）表示的新型树脂转移可成型末端改性酰亚胺低聚物，酰亚胺低聚物含有其中n为0的低聚物，其量为10摩尔％，或更多。式中，R 1，R 2为氢原子或碳原子数6〜10的芳香族烃基，R 1和R 2中的一个为碳原子数为6〜10的芳香族烃基。 R3是在芳香族四羧酸中被四个羰基包围的芳香族有机基团，对于n为2以上的式，Ras可以相同也可以不同， n为0以上且6以下的整数。

4. 发明申请

US20110165809A1 SOLUBLE TERMINALLY MODIFIED IMIDE OLIGOMER USING 2-PHENYL-4, 4'-DIAMINODIPHENYL ETHER, VARNISH, CURED PRODUCT THEREOF, IMIDE PREPREG THEREOF, AND FIBER-REINFORCED LAMINATE HAVING EXCELLENT HEAT RESISTANCE 有权
标题翻译：使用2-苯基-4,4'-二氨基二苯醚，变性剂，其固化产物，其制备物和具有优异耐热性的纤维增强层压板的可溶终端改性的二氯化铝
公开(公告)号：US20110165809A1
公开(公告)日：2011-07-07
申请号：US13062132
申请日：2009-09-03
申请人： Masahiko Miyauchi , Yuichi Ishida , Toshio Ogasawara , Rikio Yokota
发明人： Masahiko Miyauchi , Yuichi Ishida , Toshio Ogasawara , Rikio Yokota
IPC分类号： B32B5/26 , C08G73/10 , C08K5/3415 , C09D179/08 , B05D3/10 , D04H3/16 , C09J5/02 , D04H3/14
CPC分类号： C08F290/065 , C07D209/48 , C07D487/04 , C08F299/00 , C08F299/02 , C08G73/1042 , C08G73/105 , C08G73/1071 , C08J5/24 , C08J2379/08 , C08K7/02 , C08L79/08 , C09D179/08 , Y10T428/24994 , Y10T428/24995 , Y10T442/2631 , Y10T442/671 , Y10T442/69
摘要： A novel terminally modified imide oligomer having excellent solubility in organic solvents, excellent solution storage stability, and excellent molding properties such as low melt viscosity. Also, a varnish obtained by dissolving the terminally modified imide oligomer in an organic solvent; a cure product obtained by using the terminally modified imide oligomer and having excellent thermal and mechanical characteristics such as heat resistance, elastic modulus, tensile strength at break and tensile elongation at break; a prepreg; and a fiber-reinforced laminate. The soluble terminally modified imide oligomer is represented by general formula (1). In the formula, R1 and R2 each represents a divalent aromatic diamine residue; R3 and R4 each represents a tetravalent aromatic tetracarboxylic acid residue; R5 and R6 each represents a hydrogen atom or a phenyl group, with R5 or R6 being a phenyl group; m and n satisfy the following relations: m≧1, n≧0, 1≦m+n≦20 and 0.05≦m/(m+n)≦1; and the repeating units may be arranged in blocks or randomly.
摘要翻译：一种在有机溶剂中具有优异溶解性的新型末端改性酰亚胺低聚物，优异的溶液保存稳定性，以及优异的成型性能如熔融粘度低。另外，将末端改性酰亚胺低聚物溶解在有机溶剂中得到的清漆; 通过使用末端改性的酰亚胺低聚物得到的固化产物，具有优异的耐热性，弹性模量，断裂拉伸强度和断裂拉伸伸长率等热和机械特性。预浸料和纤维增强层压板。可溶性末端改性酰亚胺低聚物由通式（1）表示。在该式中，R 1和R 2各自表示二价芳族二胺残基; R3和R4各自表示四价芳族四羧酸残基; R5和R6各自表示氢原子或苯基，R5或R6是苯基; m和n满足以下关系：m≥1，n≥0,1＆nlE; m + n＆nlE; 20和0.05＆nlE; m /（m + n）＆nlE; 1; 并且重复单元可以以块或随机方式排列。

5. 发明申请

US20060249835A1 Package for receiving electronic parts, and electronic device and mounting structure thereof 有权
标题翻译：用于接收电子部件的包装件及其电子装置及其安装结构
公开(公告)号：US20060249835A1
公开(公告)日：2006-11-09
申请号：US11378859
申请日：2006-03-17
申请人： Masahiko Miyauchi
发明人： Masahiko Miyauchi
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H01L23/047 , H01L23/4334 , H01L24/48 , H01L2224/32188 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/16195 , H01L2924/19107 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package for receiving electronic part has a heat radiating plate having a mounting area where the electronic part is mounted at a center portion of one main surface, a frame body adhered to the one main surface to surround the mounting area, and a wiring conductor derived from the inside to the outside of the frame body. The heat radiating plate has a metallic base body, a metallic body filling inside of the metallic base body, and a metal layer deposited on the metallic base body and the metallic body. The mounting area is formed on the metal layer so as to be located above the metallic body, both of the metallic body and the metal layer have higher thermal conductivity than the metallic body, and both of the frame body and the metallic base body have a smaller coefficient of thermal expansion than the metal layer.
摘要翻译：用于接收电子部件的包装件具有散热板，该散热板具有安装区域，其中电子部件安装在一个主表面的中心部分，框架体粘附到一个主表面以围绕安装区域，并且导线导体从框架体的内部到外部。散热板具有金属基体，填充在金属基体内部的金属体和沉积在金属基体和金属体上的金属层。安装区域形成在金属层上，以便位于金属体的上方，金属体和金属层两者的导热性比金属体高，框体和金属基体都具有比金属层的热膨胀系数小。

6. 发明申请

US20100086813A1 Reaction Apparatus, Fuel Cell System and Electronic Device 审中-公开
标题翻译：反应装置，燃料电池系统和电子装置
公开(公告)号：US20100086813A1
公开(公告)日：2010-04-08
申请号：US12439614
申请日：2007-08-29
申请人： Tadao Yamamoto , Kaoru Saito , Naotomo Miyamoto , Masaharu Shioya , Ryuji Mori , Masahiko Miyauchi , Masaaki Miyahara , Yoshihiro Basho , Toshihiro Hashimoto , Atsushi Ogasawara
发明人： Tadao Yamamoto , Kaoru Saito , Naotomo Miyamoto , Masaharu Shioya , Ryuji Mori , Masahiko Miyauchi , Masaaki Miyahara , Yoshihiro Basho , Toshihiro Hashimoto , Atsushi Ogasawara
IPC分类号： H01M8/18 , B01J19/00
CPC分类号： B32B18/00 , B01J8/0438 , B01J8/0442 , B01J8/0492 , B01J8/0496 , B01J2208/00309 , B01J2208/00495 , B01J2208/00716 , B01J2219/00768 , B01J2219/1923 , C01B3/384 , C01B2203/0227 , C01B2203/044 , C01B2203/047 , C01B2203/066 , C01B2203/0811 , C01B2203/0822 , C01B2203/0827 , C01B2203/1035 , C01B2203/1047 , C01B2203/1064 , C01B2203/107 , C01B2203/1076 , C01B2203/1604 , C04B37/026 , C04B2237/12 , C04B2237/123 , C04B2237/343 , C04B2237/366 , C04B2237/406 , C04B2237/62 , C04B2237/76 , H01M8/0631 , Y02P20/128
摘要： The invention provides a reaction apparatus capable of efficiently causing a reaction, and a fuel cell system and an electronic device that include such a reaction apparatus. A reaction apparatus (1) includes a reformer (4), a CO remover (5) and a connecting portion (6) that connects the reformer (4) and the remover (5). The reformer (4) has a reforming reaction chamber (31) and a reformer combustion chamber (30) that generates heat to be supplied to the reforming reaction chamber (31), which (30, 31) are adjacent to each other with a partition interposed therebetween. The CO remover (5) has a removing reaction chamber (35) and a remover combustion chamber (34) that generates heat to be supplied to the removing reaction chamber (35), which (34, 35) are adjacent to each other with a partition interposed therebetween. The reformer (4) and the CO remover (5) are arranged spaced apart from each other, at least one of which is configured by combining ceramic parts (11, 12) and a reformer lid member (15) and a remover lid member (16), and heaters (48, 49) are disposed so as to face the ceramic parts (11, 12).
摘要翻译：本发明提供能够有效地引起反应的反应装置，以及包括这种反应装置的燃料电池系统和电子装置。反应装置（1）包括重整器（4），CO去除器（5）和连接重整器（4）和去除器（5）的连接部分（6）。重整器（4）具有重整反应室（31）和重整器燃烧室（30），该重整器燃烧室产生供给至重整反应室（31）的热量，所述重整反应室（30）与隔板插入其间。 CO去除器（5）具有除去反应室（35）和去除剂燃烧室（34），其产生供给到除去反应室（35）的热量，其中（34,35）彼此相邻，分隔开。重整器（4）和CO去除器（5）彼此间隔开，其中至少一个通过组合陶瓷部件（11,12）和重整器盖部件（15）和移除盖部件 16），并且加热器（48,49）设置成面对陶瓷部件（11,12）。

7. 发明授权

US06921971B2 Heat releasing member, package for accommodating semiconductor element and semiconductor device 失效
标题翻译：散热构件，用于容纳半导体元件的封装和半导体器件
公开(公告)号：US06921971B2
公开(公告)日：2005-07-26
申请号：US10758302
申请日：2004-01-15
申请人： Yoshihiro Basho , Ryuji Mori , Masahiko Miyauchi
发明人： Yoshihiro Basho , Ryuji Mori , Masahiko Miyauchi
IPC分类号： H01L23/057 , H01L23/24 , H01L23/367 , H01L23/373 , H01L23/10 , H01L23/48
CPC分类号： H01L23/3733 , H01L23/057 , H01L23/24 , H01L23/3677 , H01L23/3735 , H01L24/48 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package for accommodating a semiconductor element includes a heat releasing member having a mounting portion for a semiconductor element, a frame having a wiring conductor, and a lid attached so as to cover the mounting portion. In the heat releasing member, a plurality of through-metal members made of a copper are buried in the mounting portion of a substrate made of a matrix of tungsten or molybdenum and copper to another surface. Copper layers are joined at least to upper and lower surfaces of a portion in which the through-metal members are buried, and a cross-section area of each of the through-metal members is gradually increased from the center side of the substrate to a joint portion with the copper layers.
摘要翻译：用于容纳半导体元件的封装包括具有用于半导体元件的安装部分的散热构件，具有布线导体的框架和附接以覆盖安装部分的盖子。在散热构件中，将由铜制成的多个贯通金属构件埋设在由钨或钼和铜基体形成的基板的安装部分到另一表面。铜层至少连接到其中埋设有贯通金属构件的部分的上表面和下表面，并且每个通金属构件的横截面积从基板的中心侧逐渐增加到与铜层接合部分。

8. 发明申请

US20120295504A1 CARBON FIBER REINFORCED COMPOSITE MATERIALS 审中-公开
标题翻译：碳纤维增强复合材料
公开(公告)号：US20120295504A1
公开(公告)日：2012-11-22
申请号：US13512716
申请日：2010-11-25
申请人： Masahiko Miyauchi , Takahisa Iwahara , Masato Kusakabe
发明人： Masahiko Miyauchi , Takahisa Iwahara , Masato Kusakabe
IPC分类号： C08K7/06 , C08L23/12 , B32B37/12 , B32B5/02
CPC分类号： C08J5/042 , B29C70/46 , C08J2351/06 , Y10T442/2984
摘要： The invention provides a carbon fiber-reinforced composite material including reinforcing fibers which are continuous carbon fibers in the form of a unidirectional (UD) material, a woven fabric, or a knitted fabric, and a matrix resin including a modified polyolefin resin, thereby achieving better adhesion and mechanical strength. The matrix resin forms a polyphase structure having a sea-island structure which has an average island (independent phase) diameter of not greater than 0.5 μm. The composite material includes as a matrix resin a modified polyolefin resin obtained by, for example, graft-modifying a polyolefin resin with a monomer that contains an ethylenic double bond and a polar group in the same molecule; and includes as reinforcing fibers continuous carbon fibers. For example, the fiber-reinforced composite material is obtained by stacking the modified polyolefin resin and carbon fibers in a mold with a predetermined shape, and impregnating the carbon fibers with the modified polyolefin resin in a molten state under pressure, followed by cooling and curing.
摘要翻译：本发明提供一种碳纤维增强复合材料，其包括作为单向（UD）材料，织造织物或针织物形式的连续碳纤维的增强纤维和包含改性聚烯烃树脂的基质树脂，从而实现更好的附着力和机械强度。基质树脂形成具有平均岛（独立相））不大于0.5μm的海岛结构的多相结构。复合材料包括作为基质树脂的改性聚烯烃树脂，其通过例如在同一分子中用含有烯属双键和极性基团的单体接枝改性聚烯烃树脂而获得; 并且包括作为增强纤维的连续碳纤维。例如，纤维增强复合材料通过将改性聚烯烃树脂和碳纤维堆叠在具有预定形状的模具中，并在压力下在熔融状态下用改性聚烯烃树脂浸渍碳纤维，然后冷却和固化。

9. 发明授权

US07745914B2 Package for receiving electronic parts, and electronic device and mounting structure thereof 有权
标题翻译：用于接收电子部件的包装件及其电子装置及其安装结构
公开(公告)号：US07745914B2
公开(公告)日：2010-06-29
申请号：US11378859
申请日：2006-03-17
申请人： Masahiko Miyauchi
发明人： Masahiko Miyauchi
IPC分类号： H01L23/495
CPC分类号： H01L23/047 , H01L23/4334 , H01L24/48 , H01L2224/32188 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/16195 , H01L2924/19107 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package for receiving electronic part has a heat radiating plate having a mounting area where the electronic part is mounted at a center portion of one main surface, a frame body adhered to the one main surface to surround the mounting area, and a wiring conductor derived from the inside to the outside of the frame body. The heat radiating plate has a metallic base body, a metallic body filling inside of the metallic base body, and a metal layer deposited on the metallic base body and the metallic body. The mounting area is formed on the metal layer so as to be located above the metallic body, both of the metallic body and the metal layer have higher thermal conductivity than the metallic body, and both of the frame body and the metallic base body have a smaller coefficient of thermal expansion than the metal layer.
摘要翻译：用于接收电子部件的包装件具有散热板，该散热板具有安装区域，其中电子部件安装在一个主表面的中心部分，框架体粘附到一个主表面以围绕安装区域，并且导线导体从框架体的内部到外部。散热板具有金属基体，填充在金属基体内部的金属体和沉积在金属基体和金属体上的金属层。安装区域形成在金属层上，以便位于金属体的上方，金属体和金属层两者的导热性比金属体高，框体和金属基体都具有比金属层的热膨胀系数小。

10. 发明申请

US20050035447A1 Heat releasing member, package for accommodating semiconductor element and semiconductor device 失效
公开(公告)号：US20050035447A1
公开(公告)日：2005-02-17
申请号：US10758302
申请日：2004-01-15
申请人： Yoshihiro Basho , Ryuji Mori , Masahiko Miyauchi
发明人： Yoshihiro Basho , Ryuji Mori , Masahiko Miyauchi
IPC分类号： H01L23/057 , H01L23/24 , H01L23/367 , H01L23/373 , H01L23/10
CPC分类号： H01L23/3733 , H01L23/057 , H01L23/24 , H01L23/3677 , H01L23/3735 , H01L24/48 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package for accommodating a semiconductor element includes a heat releasing member having a mounting portion for a semiconductor element, a frame having a wiring conductor, and a lid attached so as to cover the mounting portion. In the heat releasing member, a plurality of through-metal members made of a copper are buried in the mounting portion of a substrate made of a matrix of tungsten or molybdenum and copper to another surface. Copper layers are joined at least to upper and lower surfaces of a portion in which the through-metal members are buried, and a cross-section area of each of the through-metal members is gradually increased from the center side of the substrate to a joint portion with the copper layers.

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