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1. 发明申请

US20120295504A1 CARBON FIBER REINFORCED COMPOSITE MATERIALS 审中-公开
标题翻译：碳纤维增强复合材料
公开(公告)号：US20120295504A1
公开(公告)日：2012-11-22
申请号：US13512716
申请日：2010-11-25
申请人： Masahiko Miyauchi , Takahisa Iwahara , Masato Kusakabe
发明人： Masahiko Miyauchi , Takahisa Iwahara , Masato Kusakabe
IPC分类号： C08K7/06 , C08L23/12 , B32B37/12 , B32B5/02
CPC分类号： C08J5/042 , B29C70/46 , C08J2351/06 , Y10T442/2984
摘要： The invention provides a carbon fiber-reinforced composite material including reinforcing fibers which are continuous carbon fibers in the form of a unidirectional (UD) material, a woven fabric, or a knitted fabric, and a matrix resin including a modified polyolefin resin, thereby achieving better adhesion and mechanical strength. The matrix resin forms a polyphase structure having a sea-island structure which has an average island (independent phase) diameter of not greater than 0.5 μm. The composite material includes as a matrix resin a modified polyolefin resin obtained by, for example, graft-modifying a polyolefin resin with a monomer that contains an ethylenic double bond and a polar group in the same molecule; and includes as reinforcing fibers continuous carbon fibers. For example, the fiber-reinforced composite material is obtained by stacking the modified polyolefin resin and carbon fibers in a mold with a predetermined shape, and impregnating the carbon fibers with the modified polyolefin resin in a molten state under pressure, followed by cooling and curing.
摘要翻译：本发明提供一种碳纤维增强复合材料，其包括作为单向（UD）材料，织造织物或针织物形式的连续碳纤维的增强纤维和包含改性聚烯烃树脂的基质树脂，从而实现更好的附着力和机械强度。基质树脂形成具有平均岛（独立相））不大于0.5μm的海岛结构的多相结构。复合材料包括作为基质树脂的改性聚烯烃树脂，其通过例如在同一分子中用含有烯属双键和极性基团的单体接枝改性聚烯烃树脂而获得; 并且包括作为增强纤维的连续碳纤维。例如，纤维增强复合材料通过将改性聚烯烃树脂和碳纤维堆叠在具有预定形状的模具中，并在压力下在熔融状态下用改性聚烯烃树脂浸渍碳纤维，然后冷却和固化。

2. 发明授权

US5623030A Curable composition and process for producing molded articles using the same 失效
标题翻译：可固化组合物及其制备方法
公开(公告)号：US5623030A
公开(公告)日：1997-04-22
申请号：US564593
申请日：1995-11-29
申请人： Manabu Tsumura , Masafumi Hiraishi , Takahisa Iwahara , Toshifumi Hirose
发明人： Manabu Tsumura , Masafumi Hiraishi , Takahisa Iwahara , Toshifumi Hirose
IPC分类号： C08G77/50 , C08G77/52 , C08L83/04 , C08F283/00
CPC分类号： C08G77/52 , C08G77/50 , C08L83/04 , C08G77/16 , C08G77/18 , C08G77/70
摘要： A curable composition providing a cured product having a silicon type interpenetrating polymer network, which comprises (A) a silsesquioxane ladder polymer, (B) a silicon compound having at least two SiH groups per molecule, (C) a silicon compound having at least two vinylsilyl groups per molecule and (D) a neutral platinum catalyst; and a process for producing a molded article comprising heating the curable composition under a controlled temperature for synchronously causing hydrolysis and condensation of the alkoxysilyl group and/or silanol group and hydrosilylation.
摘要翻译：提供具有硅型互穿聚合物网络的固化产物的可固化组合物，其包含（A）倍半硅氧烷梯度聚合物，（B）每分子具有至少两个SiH基团的硅化合物，（C）具有至少两个乙烯基甲硅烷基和（D）中性铂催化剂; 以及生产模制品的方法，包括在受控温度下加热可固化组合物，以同时引起烷氧基甲硅烷基和/或硅烷醇基团的水解和缩合以及氢化硅烷化。

3. 发明授权

US4845255A Method of preparing cyclic disilanylene-acetylenes 失效
标题翻译：制备环二亚苯基 - 乙炔的方法
公开(公告)号：US4845255A
公开(公告)日：1989-07-04
申请号：US227703
申请日：1988-08-03
申请人： Takahisa Iwahara , Robert C. West
发明人： Takahisa Iwahara , Robert C. West
IPC分类号： H01B1/12 , C07F7/08 , C08G77/48 , C08G77/60
CPC分类号： C07F7/0821
摘要： 1,2-dichlorodisilanes are reacted with the diGrignard reagents of 1,2-diethynyldisilane to yield the eight-membered ring disilanylene acetylenes of the formula: ##STR1## where R=an alkyl group, and R'=an alkyl group or an aromatic group.
摘要翻译： 1,2-二氯二硅烷与1,2-二乙炔基二乙基二锗试剂反应，得到下式的八元环二亚苯基乙炔：其中R =烷基，R'=烷基或芳族组。

4. 发明授权

US09178120B2 Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode 有权
标题翻译：可固化树脂组合物，可固化树脂组合物片，模塑体，半导体封装，半导体组件和发光二极管
公开(公告)号：US09178120B2
公开(公告)日：2015-11-03
申请号：US13638992
申请日：2011-03-30
申请人： Tadashi Kokubo , Katsuya Ouchi , Takahisa Iwahara , Kazuhiko Hirabayashi , Hiroshi Okoshi , Tomokazu Tozawa , Shuhei Ozaki
发明人： Tadashi Kokubo , Katsuya Ouchi , Takahisa Iwahara , Kazuhiko Hirabayashi , Hiroshi Okoshi , Tomokazu Tozawa , Shuhei Ozaki
IPC分类号： H01L33/56 , H01L23/29 , H01L33/60 , H01L23/31 , C08K3/22 , C08K3/36 , C08K5/098 , H01L23/495 , H01L33/62
CPC分类号： H01L33/56 , C08K3/22 , C08K3/36 , C08K5/098 , C08K2003/2241 , H01L23/295 , H01L23/296 , H01L23/3171 , H01L23/49586 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
摘要翻译：本发明的目的在于提供一种固化性树脂组合物，其具有低的线性膨胀系数的固化物。本发明的固化性树脂组合物含有作为必要成分的（A）每分子具有至少两个与SiH基反应的碳 - 碳双键的有机化合物，（B）每分子含有至少两个SiH基的化合物，（C）氢化硅烷化催化剂，（D）每分子具有至少一个与SiH基反应的碳 - 碳双键的硅氧烷化合物和（E）无机填料。

5. 发明授权

US5449734A Curable composition 失效
标题翻译：可固化组合物
公开(公告)号：US5449734A
公开(公告)日：1995-09-12
申请号：US208106
申请日：1994-03-08
申请人： Jun Kotani , Kiyoshi Andoh , Takahisa Iwahara , Kazuya Yonezawa
发明人： Jun Kotani , Kiyoshi Andoh , Takahisa Iwahara , Kazuya Yonezawa
IPC分类号： C08G77/12 , C08G77/06 , C08G77/18 , C08G77/20 , C08G77/22 , C08G77/50 , C08K5/5419 , C08L83/04 , C08L83/05 , C08L83/06 , C08L83/07 , C08G77/08
CPC分类号： C08G77/50 , C08G77/06 , C08L83/04 , C08G77/12 , C08G77/18 , C08G77/24 , C08G77/70
摘要： A curable composition containing (A) a compound having at least two Si--H bonds, (B) a silicon compound having at least two substituents bonded to the silicon atom thereof, wherein the substituents each have an olefin bond, (C) a neutral platinum catalyst, (D) a silicon compound having at least two alkoxy groups bonded to the silicon atom thereof, and (E) a catalyst for silanol condensation.
摘要翻译：一种可固化组合物，其包含（A）具有至少两个Si-H键的化合物，（B）具有至少两个与其硅原子键合的取代基的硅化合物，其中所述取代基各自具有烯烃键，（C）中性铂催化剂，（D）具有与硅原子键合的至少两个烷氧基的硅化合物，（E）硅烷醇缩合用催化剂。

6. 发明授权

US5409995A Curing agent, preparation thereof and curable composition comprising the same 失效
标题翻译：固化剂及其制备方法及其可固化组合物
公开(公告)号：US5409995A
公开(公告)日：1995-04-25
申请号：US29993
申请日：1993-03-08
申请人： Takahisa Iwahara , Makoto Chiba , Tomoko Takahara , Kazuya Yonezawa
发明人： Takahisa Iwahara , Makoto Chiba , Tomoko Takahara , Kazuya Yonezawa
IPC分类号： C07F7/08 , C07F7/21 , C08G65/336 , C08G77/48 , C08G77/50 , C08K5/54 , C08L43/04 , C08L71/00 , C08L101/10 , C08F8/00
CPC分类号： C08L71/00 , C07F7/0896 , C07F7/21 , C08G65/336 , C08G77/48 , C08G77/50 , C08K5/54 , C08L101/10 , C08L43/04
摘要： A curable composition which comprises (C) a non-polymeric organic curing agent having at least two hydrosilyl groups in a molecule, (D) an organic polymer having at least one alkenyl group in a molecule, and (E) a hydrosilylation catalyst has rapid curability and good depth curability, and gives a homogeneous cured material having good mechanical properties.
摘要翻译：一种可固化组合物，其包含（C）在分子中具有至少两个氢化甲硅烷基的非聚合有机固化剂，（D）在分子中具有至少一个烯基的有机聚合物和（E）氢化硅烷化催化剂具有快速固化性和良好的深度固化性，并得到具有良好机械性能的均匀固化材料。

7. 发明授权

US5567833A Curing agent, preparation thereof and curable composition comprising the same 失效
公开(公告)号：US5567833A
公开(公告)日：1996-10-22
申请号：US313923
申请日：1994-09-26
申请人： Takahisa Iwahara , Makoto Chiba , Tomoko Takahara , Kazuya Yonezawa
发明人： Takahisa Iwahara , Makoto Chiba , Tomoko Takahara , Kazuya Yonezawa
IPC分类号： C07F7/08 , C07F7/21 , C08G65/336 , C08G77/48 , C08G77/50 , C08K5/54 , C08L43/04 , C08L71/00 , C08L101/10
CPC分类号： C08L71/00 , C07F7/0896 , C07F7/21 , C08G65/336 , C08G77/48 , C08G77/50 , C08K5/54 , C08L101/10 , C08L43/04
摘要： A curable composition which comprises(C) a non-polymeric organic curing agent having at least two hydrosilyl groups in a molecule,(D) an organic polymer having at least one alkenyl group in a molecule, and(E) a hydrosilylation catalysthas rapid curability and good depth curability, and gives a homogeneous cured material having good mechanical properties.

8. 发明授权

US4788254A Curable polymer composition 失效
标题翻译：可固化的聚合物组成
公开(公告)号：US4788254A
公开(公告)日：1988-11-29
申请号：US75229
申请日：1987-07-13
申请人： Fumio Kawakubo , Sadao Yukimoto , Miyako Takanoo , Katsuhiko Isayama , Takahisa Iwahara
发明人： Fumio Kawakubo , Sadao Yukimoto , Miyako Takanoo , Katsuhiko Isayama , Takahisa Iwahara
IPC分类号： C08K5/54 , C08F8/00
CPC分类号： C08K5/54
摘要： A moisture curable polymer composition comprising (A) an organic polymer having at least one reactive silicone group in a molecule and (B) a compound having one silanol group in a molecule and/or a compound which reacts with water or moisture to form a compound having one silanol group in a molecule, which is cured with moisture to give an elastomeric material with improved tensile properties and surface characteristics.
摘要翻译：一种湿气固化聚合物组合物，其包含（A）在分子中具有至少一个反应性硅氧烷基团的有机聚合物和（B）在分子中具有一个硅烷醇基团的化合物和/或与水或水分反应以形成化合物的化合物在分子中具有一个硅烷醇基团，其被水分固化以得到具有改进的拉伸性能和表面特性的弹性体材料。

9. 发明授权

US4657986A Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer 失效
标题翻译：包含环氧树脂和含硅弹性体聚合物的可固化树脂组合物
公开(公告)号：US4657986A
公开(公告)日：1987-04-14
申请号：US812378
申请日：1985-12-23
申请人： Katsuhiko Isayama , Toshifumi Hirose , Takahisa Iwahara , Fumio Kawakubo
发明人： Katsuhiko Isayama , Toshifumi Hirose , Takahisa Iwahara , Fumio Kawakubo
IPC分类号： C08G59/00 , C08G59/18 , C08G59/40 , C08G59/68 , C08L43/04 , C08L63/00 , C08L83/10 , C08G65/32
CPC分类号： C08L43/04 , C08G59/4085 , C08L63/00 , C08L83/10
摘要： A curable resinous composition comprising:(A) an organic elastomeric polymer having at least one silicon-containing reactive group in a molecule,(B) an epoxy resin,(C) a silicone compound having a silicon-containing group and a functional group reactive with an epoxy group, and(D) a curing agent for the epoxy resin, wherein said silicon-containing reactive group is a group of the formula: ##STR1## wherein X is a hydroxyl group or a hydrolyzable group, R.sup.1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms or an organosiloxy group, "a" is 0, 1, 2, or 3, "b" is 0, 1 or 2 provided that the total of "a" and "b" is at least 1, and "m" is 0 or an integer of 1 to 18, a weight ratio of (A) to (B) being from 1:100 to 100:1 and a weight ratio of (A)+(B) to (C) being from 100:0.1 to 100:20.
摘要翻译：一种可固化树脂组合物，其包含：（A）在分子中具有至少一个含硅反应性基团的有机弹性体聚合物，（B）环氧树脂，（C）具有含硅基团和官能团反应性的硅氧烷化合物和（D）环氧树脂的固化剂，其中所述含硅反应性基团是下式的基团：其中X是羟基或可水解基团，R 1是碳原子数为1〜20的一价烃基或有机甲硅烷氧基，“a”为0,1,2或3，“b”为0,1或2，条件是“a”和“b” 至少1，“m”为0或1〜18的整数，（A）〜（B）的重量比为1：100〜100：1，（A）+（B）至（C）为100：0.1至100：20。

10. 发明申请

US20130082369A1 CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION TABLET, MOLDED BODY, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR COMPONENT AND LIGHT EMITTING DIODE 有权
公开(公告)号：US20130082369A1
公开(公告)日：2013-04-04
申请号：US13638992
申请日：2011-03-30
申请人： Tadashi Kokubo , Katsuya Ouchi , Takahisa Iwahara , Kazuhiko Hirabayashi , Hiroshi Okoshi , Tomokazu Tozawa , Shuhei Ozaki
发明人： Tadashi Kokubo , Katsuya Ouchi , Takahisa Iwahara , Kazuhiko Hirabayashi , Hiroshi Okoshi , Tomokazu Tozawa , Shuhei Ozaki
IPC分类号： H01L23/29
CPC分类号： H01L33/56 , C08K3/22 , C08K3/36 , C08K5/098 , C08K2003/2241 , H01L23/295 , H01L23/296 , H01L23/3171 , H01L23/49586 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

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