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1. 发明申请

US20050017268A1 Display apparatus and its manufacturing method 审中-公开
标题翻译：显示装置及其制造方法
公开(公告)号：US20050017268A1
公开(公告)日：2005-01-27
申请号：US10488590
申请日：2002-09-09
申请人： Masahide Tsukamoto , Yoshihiro Bessho , Takeo Ukai
发明人： Masahide Tsukamoto , Yoshihiro Bessho , Takeo Ukai
IPC分类号： G02F1/1333 , G09F9/30 , G09F9/313 , G09F9/35 , G09G3/00 , G09G3/20 , G09G3/28 , G09G3/32 , H01J17/49 , H01L27/32 , H01L31/0336
CPC分类号： H01L27/3293 , G02F1/13336 , G09F9/30 , G09F9/313 , G09G3/20 , G09G3/2014 , G09G3/2085 , G09G3/3208 , G09G2300/026 , G09G2310/0221 , G09G2310/04 , H01J11/10 , H01J2211/46 , H01L27/3251
摘要： An object of the present invention is to provide a display apparatus that has, even when it is a large-sized one, a high manufacturing yield, as well as a simple structure as a whole including wirings. In order to achieve the object, the display apparatus comprises a display unit that has, on a surface of a substrate, display elements that each include a light display member and a display unit terminal and are disposed in an array; module substrates each disposed in a different one of the areas into which a surface of the display unit on which the display unit terminals are disposed is divided; and a main wiring substrate disposed so as to cover the module substrates, wherein a first wiring for transferring electricity and signals to the module substrates is provided on the main wiring substrate, and (i)drive elements that supply drive signals, (ii) the second wiring for transferring the electricity and the signals transferred via the first wiring to the drive elements, and (iii) module output terminals for transferring the drive signals from the drive elements to the display unit terminals are provided on the module substrates.
摘要翻译：本发明的目的在于提供一种显示装置，即使是大尺寸的显示装置，也具有制造成品率高的结构，以及整体上由布线构成的简单结构。为了实现该目的，显示装置包括：显示单元，其在基板的表面上具有各自包括光显示部件和显示单元端子并且排列成阵列的显示元件; 模块基板，分别设置在设置有显示单元端子的显示单元的表面的不同的一个区域中; 以及以覆盖所述模块基板的方式配置的主布线基板，其中，在所述主布线基板上设置有用于将电力和信号传递到所述模块基板的第一布线，以及（i）提供驱动信号的驱动元件，（ii）用于将电力传送的第二布线和经由第一布线传送的信号到驱动元件，以及（iii）用于将驱动信号从驱动元件传送到显示单元端子的模块输出端子设置在模块基板上。

2. 发明授权

US06465082B1 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body 有权
标题翻译：应力松弛电子部件，应力松弛线路板和应力松弛电子部件安装体
公开(公告)号：US06465082B1
公开(公告)日：2002-10-15
申请号：US09554502
申请日：2000-05-16
申请人： Hiroaki Takezawa , Masahide Tsukamoto , Minehiro Itagaki , Yoshihiro Bessho , Hideo Hatanaka , Yasushi Fukumura , Kazuo Eda , Toru Ishida
发明人： Hiroaki Takezawa , Masahide Tsukamoto , Minehiro Itagaki , Yoshihiro Bessho , Hideo Hatanaka , Yasushi Fukumura , Kazuo Eda , Toru Ishida
IPC分类号： H05K100
CPC分类号： H05K3/3436 , H01L23/49816 , H01L2224/16225 , H05K1/0271 , H05K3/105 , H05K3/321 , H05K2201/0212 , H05K2201/0379 , H05K2201/10257 , H05K2201/10992 , H05K2203/121 , Y02P70/613 , Y10S428/901 , Y10T428/24917 , Y10T428/254 , Y10T428/31681
摘要： A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.
摘要翻译：一种要安装在电路板上的应力松弛型电子部件，其中应力松弛机构部件设置在所述电子部件的表面上，所述表面位于要连接所述电子部件的连接部分的一侧到所述电路板，并且所述应力松弛机构构件是导电的。

3. 发明授权

US6045897A Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same 失效
标题翻译：印刷电路板用无纺布布基材和使用其的预浸料
公开(公告)号：US6045897A
公开(公告)日：2000-04-04
申请号：US178852
申请日：1998-10-26
申请人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
发明人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
IPC分类号： B32B15/14 , C08J5/04 , C09D5/25 , D04H1/00 , D04H1/42 , D04H1/58 , D21H13/26 , D21H17/52 , H05K1/02 , H05K1/03 , D21H13/02
CPC分类号： H05K1/0366 , B32B15/14 , C08J5/04 , D04H1/00 , D04H1/4342 , D04H1/4382 , D04H1/64 , D21H13/26 , D21H17/52 , H05K1/024 , H05K2201/0239 , H05K2201/0278 , H05K2201/0293 , H05K2203/0783 , H05K2203/087 , H05K2203/097 , H05K2203/1105 , Y10T442/198 , Y10T442/2049 , Y10T442/2475 , Y10T442/2902 , Y10T442/626
摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.
摘要翻译：一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。

4. 发明授权

US5960538A Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US5960538A
公开(公告)日：1999-10-05
申请号：US31082
申请日：1998-02-26
申请人： Kouji Kawakita , Seiichi Nakatani , Masahide Tsukamoto
发明人： Kouji Kawakita , Seiichi Nakatani , Masahide Tsukamoto
IPC分类号： H05K1/11 , H01L21/48 , H01L23/367 , H01L23/538 , H05K1/02 , H05K3/06 , H05K3/40 , H05K3/46 , H05K3/02
CPC分类号： H05K3/4069 , H01L21/4857 , H01L21/486 , H01L23/3677 , H01L23/5384 , H05K1/0206 , H01L2224/16 , H01L2224/16235 , H01L2924/01046 , H01L2924/01079 , H01L2924/15311 , H05K2201/0209 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156 , Y10T428/24917 , Y10T428/24926
摘要： The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be formed at a high density. A cover film is laminated on both surfaces of a resin impregnated fabric sheet, holes are formed by laser beams in the direction of the thickness of the sheet and cover film, an electrically conductive paste that contains the electrically conductive particles and a thermosetting resin is filled in the holes. The cover film is removed, a copper foil is placed on both sides of the sheet, and pressed and heated, and the resin component of the sheet and that of the electrically conductive paste are hardened. The copper foil is etched to form circuit patterns, and further etching removes the electrically conductive particles present at a surface layer portion so that an electrical insulating layer is thus formed.
摘要翻译：本发明提供一种印刷电路板，其中电极层可以通过内部通孔连接而电连接，板的热膨胀系数等于半导体的热膨胀系数，可以获得高导热性，并且布线可以以高密度形成。在树脂浸渍织物片的两个表面上层压覆盖膜，在片材和覆盖膜的厚度方向上通过激光束形成孔，填充含有导电性粒子和热固性树脂的导电性糊剂在洞里除去覆盖膜，将铜箔放置在片材的两侧，并被加压和加热，并且片材的树脂成分和导电膏的树脂成分硬化。蚀刻铜箔以形成电路图案，并且进一步蚀刻除去存在于表面层部分的导电颗粒，从而形成电绝缘层。

5. 发明授权

US5407511A Process for forming a sintered conductor circuit board 失效
标题翻译：形成烧结导体电路板的工艺
公开(公告)号：US5407511A
公开(公告)日：1995-04-18
申请号：US214267
申请日：1994-03-17
申请人： Seiichi Nakatani , Masahide Tsukamoto , Mikinari Shimada
发明人： Seiichi Nakatani , Masahide Tsukamoto , Mikinari Shimada
IPC分类号： H05K1/09 , C04B35/583 , H01L21/48 , H05K1/03 , H05K1/11 , H05K3/20 , H05K3/40 , H05K3/46 , B44C1/165 , B32B31/00
CPC分类号： C04B35/583 , H01L21/4857 , H01L21/4867 , H05K3/207 , H05K3/4069 , H05K1/0313 , H05K1/092 , H05K1/095 , H05K2201/0394 , H05K2203/016 , H05K2203/1453 , H05K2203/1461 , H05K3/4614 , H05K3/462
摘要： A circuit board that is made compact or highly dense and can be prepared using no chemical etching is obtained by patternwise printing a sinterable conductor on a releasing substrate, sintering the conductor by heating at a given temperature, and transferring the sintered conductor to a resin support. A plurality of sintered conductors each prepared by the above process may be laminated to give a multi-layered circuit board.
摘要翻译：通过在剥离基板上图案化印刷可烧结导体，通过在给定温度下加热烧结导体，并将烧结导体转印到树脂载体上，获得致密或高密度且不经化学蚀刻制备的电路板。可以将通过上述方法制备的多个烧结导体层叠以形成多层电路板。

6. 发明授权

US5141461A Method of forming a metal-backed layer and a method of forming an anode 失效
标题翻译：形成金属背层的方法和形成阳极的方法
公开(公告)号：US5141461A
公开(公告)日：1992-08-25
申请号：US478499
申请日：1990-02-12
申请人： Yutaka Nishimura , Masahide Tsukamoto , Hirotoshi Watanabe , Kohji Matsuo , Noboru Aikawa
发明人： Yutaka Nishimura , Masahide Tsukamoto , Hirotoshi Watanabe , Kohji Matsuo , Noboru Aikawa
IPC分类号： H01J9/14 , H01J29/08 , H01J29/28
CPC分类号： H01J29/085 , H01J29/28 , H01J9/14
摘要： This invention proposes methods of effectively forming a metal-backed layer and an anode using a metal film transferring sheet in which micro-holes are formed. that is, the metal film transferring sheet is structured by forming a metal film on a mold-releasable, highly characteristic sheet. Then, the metal film having micro-holes of the metal film transferring sheet is transferred onto a phosphor screen. Or, on the metal film of the above-mentioned metal film transferring sheet, is formed a phosphor screen and the metal film, the phosphor screen, etc. are all transferred onto a face plate form an anode of a cathode-ray tube. Then the methods proposed by this invention are applied for making phosphor products of, for example, a cathode-ray tube or a plasma display. According to these methods, there is no need to use a large-scaled manufacturing facility and high quality, low cost products can be obtainable.

7. 发明授权

US5006189A Coating method and cleaning method for heat-soluble material 失效
标题翻译：热溶性材料的涂布方法和清洗方法
公开(公告)号：US5006189A
公开(公告)日：1991-04-09
申请号：US357597
申请日：1989-05-26
申请人： Masahide Tsukamoto , Yutaka Nishimura , Yasuo Fukui
发明人： Masahide Tsukamoto , Yutaka Nishimura , Yasuo Fukui
IPC分类号： B41J17/40 , B41J31/14 , B41M5/26 , B41M5/382 , B44C1/00
CPC分类号： B41M5/38207 , B41J17/40 , B41J31/14 , Y10T156/1153
摘要： Coating of heat-soluble material on a substrate or cleaning is performed by supplying a heat-soluble material in heated and melted condition onto a substrate, laying a sheet member on the heat-soluble material, cooling the heat-soluble material to solidify, and peeling off the sheet member.

8. 发明授权

US4203082A Surface acoustic wave filter 失效
标题翻译：表面声波滤波器
公开(公告)号：US4203082A
公开(公告)日：1980-05-13
申请号：US911082
申请日：1978-05-31
申请人： Masahide Tsukamoto , Masahiro Nagasawa , Hiroshi Yamazoe
发明人： Masahide Tsukamoto , Masahiro Nagasawa , Hiroshi Yamazoe
IPC分类号： H03H3/08 , H03H9/00 , H03H9/145 , H03H9/64 , H03H9/04 , H01L41/10 , H03H9/26 , H03H9/32
CPC分类号： H03H9/1455 , H03H9/0038 , H03H9/1452 , H03H9/14547 , H03H9/14558 , H03H9/14564 , H03H9/14567 , H03H9/14594 , H03H9/6433 , H03H9/14552
摘要： To obtain low insertion loss and low TTE level, a first central transducer, a second transducer and a third transducer are disposed on one surface of a piezoelectric substrate in such a manner that the second and the third transducers are in the direction of propagation (X-direction) of surface acoustic waves launched by the first transducer and the distance between center lines of the first and the second transducers and also the distance between the center lines of the first and the third transducers vary along the Y-direction perpendicular to the X-direction.
摘要翻译：为了获得低插入损耗和低TTE电平，第一中心换能器，第二换能器和第三换能器以这样的方式设置在压电基板的一个表面上，使得第二和第三换能器处于传播方向（X 由第一换能器发射的表面声波和第一和第二换能器的中心线之间的距离以及第一和第三换能器的中心线之间的距离沿垂直于X的Y方向变化 -方向。

9. 发明授权

US06192581B1 Method of making printed circuit board 失效
标题翻译：制作印刷电路板的方法
公开(公告)号：US06192581B1
公开(公告)日：2001-02-27
申请号：US08997624
申请日：1997-12-23
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H01K310
CPC分类号： H01L24/80 , H01L23/3107 , H01L23/49827 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/115 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4658 , H05K2201/0367 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/1461 , Y10T29/49126 , Y10T29/49165 , Y10T29/49345 , H01L2924/00
摘要： A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.
摘要翻译：印刷电路板具有：具有第一通孔的基材层; 以及具有第二通孔的绝缘层，所述绝缘层设置在所述基材层的一个表面上，其中所述第二通孔的横截面面积小于所述第一通孔的横截面面积，以及其中所述第一和第二通孔用导电材料填充。

10. 发明授权

US5858884A Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same 失效
标题翻译：印刷电路板用无纺布布基材和使用其的预浸料
公开(公告)号：US5858884A
公开(公告)日：1999-01-12
申请号：US856548
申请日：1997-05-15
申请人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
发明人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
IPC分类号： B32B15/14 , C08J5/04 , C09D5/25 , D04H1/00 , D04H1/42 , D04H1/58 , D21H13/26 , D21H17/52 , H05K1/02 , H05K1/03 , C08J5/24
CPC分类号： H05K1/0366 , B32B15/14 , C08J5/04 , D04H1/00 , D04H1/4342 , D04H1/4382 , D04H1/64 , D21H13/26 , D21H17/52 , H05K1/024 , H05K2201/0239 , H05K2201/0278 , H05K2201/0293 , H05K2203/0783 , H05K2203/087 , H05K2203/097 , H05K2203/1105 , Y10T442/198 , Y10T442/2049 , Y10T442/2475 , Y10T442/2902 , Y10T442/626
摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.
摘要翻译：一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基材的预浸料坯和印刷线路板。

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