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1. 发明授权

US06888072B2 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same 失效
标题翻译：夹具，带夹具的电路板和电子元件安装体及其制造方法
公开(公告)号：US06888072B2
公开(公告)日：2005-05-03
申请号：US09810846
申请日：2001-03-16
申请人： Masahide Tsukamoto , Kazufumi Yamaguchi , Takeshi Shimamoto , Fumikazu Tateishi
发明人： Masahide Tsukamoto , Kazufumi Yamaguchi , Takeshi Shimamoto , Fumikazu Tateishi
IPC分类号： H01L21/68 , H01L23/32 , H05K3/32 , H05K1/16
CPC分类号： H01L21/6835 , H01L23/32 , H01L24/16 , H01L24/72 , H01L2224/16238 , H01L2224/73251 , H01L2224/81901 , H01L2924/01078 , H01L2924/19041 , H05K3/325 , Y10T29/49137 , H01L2224/16 , H01L2224/72
摘要： A fixture with movable pawls and positioning walls is attached to a circuit board. An electronic component is inserted into the fixture from its upper side. Since the movable pawls move outward due to their slopes, the electronic component is allowed to fit between the positioning walls. After the fitting of the electronic component, the movable pawls hold the sides of the upper face of the electronic component and the positioning walls are in contact with the peripheral walls of the electronic component. Bumps provided on electrode pads of the electronic component are connected to electrodes on the circuit board. Thus, the electronic component can be mounted using the flip chip technique. In addition, the electronic component can be removed easily by moving the movable pawls even after being mounted.
摘要翻译：具有可移动爪和定位壁的夹具连接到电路板。电子部件从其上侧插入固定装置。由于可动爪由于其斜面而向外移动，所以允许电子部件配合在定位壁之间。在电子部件的装配之后，可动爪保持电子部件的上表面的侧面并且定位壁与电子部件的周壁接触。提供在电子部件的电极焊盘上的凸起连接到电路板上的电极。因此，可以使用倒装芯片技术来安装电子部件。此外，即使在安装之后，通过移动可动爪也能够容易地去除电子部件。

2. 发明授权

US06197407B1 Circuit board and method of manufacturing the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US06197407B1
公开(公告)日：2001-03-06
申请号：US09304714
申请日：1999-05-04
申请人： Daizou Andou , Toshio Sugawa , Tadashi Nakamura , Hideki Higashitani , Masahide Tsukamoto
发明人： Daizou Andou , Toshio Sugawa , Tadashi Nakamura , Hideki Higashitani , Masahide Tsukamoto
IPC分类号： B32B300
CPC分类号： H05K3/20 , H05K3/007 , H05K3/205 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/4623 , H05K3/4658 , H05K3/4688 , H05K2201/0116 , H05K2201/0195 , H05K2201/10378 , H05K2203/0152 , H05K2203/0384 , H05K2203/061 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/2804
摘要： Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.
摘要翻译：形成在其两面具有粘合层的电绝缘基板中的通孔填充有导体。然后，将具有预定图案的布线层的支撑基板层压在电绝缘基板的两个表面上，然后被加热和加压。之后，除去支撑基底，从而获得其中布线层已经嵌入粘合剂层中的电路板。通孔内的导体被充分压缩，从而形成具有高可靠性的微通孔。

3. 发明授权

US5635006A Pattern forming method and ink compostion 失效
标题翻译：图案形成方法和油墨组合
公开(公告)号：US5635006A
公开(公告)日：1997-06-03
申请号：US540622
申请日：1990-06-19
申请人： Hirotoshi Watanabe , Yutaka Nishimura , Koji Matsuo , Noboru Aikawa , Masahide Tsukamoto
发明人： Hirotoshi Watanabe , Yutaka Nishimura , Koji Matsuo , Noboru Aikawa , Masahide Tsukamoto
IPC分类号： B41M1/10 , G02F1/1335 , H01J9/227 , H01J29/32 , B05D5/00
CPC分类号： H01J29/327 , B41M1/10 , G02F1/133516 , H01J9/2277 , H01J9/2278
摘要： The fine-line pattern forming method is to form a pattern by transferring the pattern formed on the blanket of which surface is covered with an elastic material mainly composed of silicone resin, on a substrate on which a tack layer is formed. As an example thereof, the forming method of cathode-ray tube anode comprises a step of filling the groove of an intaglio with a graphite ink, a step of transferring the graphite ink in the groove of the intaglio on a blanket of which surface is covered with an elastic material mainly composed of silicone resin, a step of forming a tack layer on a substrate, a step of transferring and printing the pattern transferred on the blanket onto the substrate, a step of filling the groove of the intaglio with a phosphor ink, a step of transferring the ink in the groove of the intaglio on the blanket of which surface is covered with an elastic material mainly composed of silicone resin, a step of forming a tack layer on the substrate, a step of transferring and printing the pattern transferred on the blanket on the substrate on which the graphite pattern has been formed, a step of transferring an aluminum thin film possessing multiple pores as a metal-backed layer so as to cover a black matrix and a phosphor layer, and a step of firing the substrate covered with the aluminum thin film. The graphite ink comprises graphite powder, vehicle containing depolymerization type organic binder, and organic acid metal salt. The phosphor ink comprises phosphor powder and vehicle containing polymerization type organic binder.
摘要翻译：细线图案形成方法是在形成有粘性层的基板上，通过将主要由硅树脂构成的弹性材料覆盖在其表面的毯子上的图案转印而形成图案。作为其示例，阴极射线管阳极的形成方法包括用石墨墨水填充凹版的凹槽的步骤，将石墨墨在凹版的凹槽中的表面覆盖的毯子上的步骤主要由硅树脂构成的弹性材料，在基材上形成粘性层的步骤，将在橡皮布上转印的图案转印印刷到基材上的步骤，用荧光体墨水填充凹版的凹槽的步骤将主要由硅树脂构成的弹性材料覆盖在表面的毯子上的凹版凹槽中的墨水转印到基板上形成粘着层的工序，转印印刷图案的步骤转印在已经形成有石墨图案的基板上的橡皮布上，转印具有多个孔的铝薄膜作为金属背衬层以覆盖黑矩阵a 和荧光体层，以及烧制被铝薄膜覆盖的基板的步骤。石墨油墨包括石墨粉，含有解聚型有机粘合剂的载体和有机酸金属盐。荧光体油墨包含荧光体粉末和含有聚合型有机粘合剂的载体。

4. 发明授权

US5622590A Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5622590A
公开(公告)日：1997-04-22
申请号：US430484
申请日：1995-04-28
申请人： Yoshinobu Kunitomo , Makoto Nozu , Yasuyuki Sakashita , Masahide Tsukamoto , Seiichi Nakatani , Keiji Saeki , Yoshifumi Kitayama
发明人： Yoshinobu Kunitomo , Makoto Nozu , Yasuyuki Sakashita , Masahide Tsukamoto , Seiichi Nakatani , Keiji Saeki , Yoshifumi Kitayama
IPC分类号： H01L21/56 , H01L21/60 , H01L23/13 , H01L23/29 , H01L23/485 , B32B7/12 , B29C65/54 , H01L21/58 , H05K3/32
CPC分类号： H01L24/83 , H01L21/563 , H01L23/13 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/81 , H01L2224/0401 , H01L2224/04026 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/29386 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2224/92125 , H01L2224/92247 , H01L24/45 , H01L24/48 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1579 , H01L2924/16152 , H01L2924/351
摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.
摘要翻译：绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。在绝缘基板上设置半导体芯片。半导体芯片的下表面形成有凸块电极。用于凸块连接的电极通过导电粘合剂电连接到凸块电极。半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

5. 发明授权

US5550408A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5550408A
公开(公告)日：1996-08-27
申请号：US408965
申请日：1995-03-23
申请人： Yoshinobu Kunitomo , Makoto Nozu , Yasuyuki Sakashita , Masahide Tsukamoto , Seiichi Nakatani , Keiji Saeki , Yoshifumi Kitayama
发明人： Yoshinobu Kunitomo , Makoto Nozu , Yasuyuki Sakashita , Masahide Tsukamoto , Seiichi Nakatani , Keiji Saeki , Yoshifumi Kitayama
IPC分类号： H01L21/56 , H01L21/60 , H01L23/13 , H01L23/29 , H01L23/485 , H01L23/28
CPC分类号： H01L21/563 , H01L23/13 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2224/83805 , H01L2224/92125 , H01L24/45 , H01L24/48 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/351
摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in a matrix. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.
摘要翻译：绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成矩阵的外部端子。在绝缘基板上设置半导体芯片。半导体芯片的下表面形成有凸块电极。用于凸块连接的电极通过导电粘合剂电连接到凸块电极。半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

6. 发明授权

US5406459A Surface mounting module for an electric circuit board 失效
标题翻译：电路板表面安装模块
公开(公告)号：US5406459A
公开(公告)日：1995-04-11
申请号：US939000
申请日：1992-09-02
申请人： Masahide Tsukamoto , Seiichi Nakatani , Toru Ishida
发明人： Masahide Tsukamoto , Seiichi Nakatani , Toru Ishida
IPC分类号： H05K1/18 , H05K3/28 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/38 , H05K3/40 , H05K3/46 , H05K1/16
CPC分类号： H05K3/462 , H05K3/321 , H05K1/181 , H05K2201/0129 , H05K2201/0195 , H05K2201/09536 , H05K2201/10378 , H05K2201/10719 , H05K2201/10977 , H05K2201/10984 , H05K2203/0191 , H05K3/28 , H05K3/305 , H05K3/32 , H05K3/3484 , H05K3/386 , H05K3/4069 , H05K3/4623
摘要： An electric circuit board module includes a substrate with electric components mounted on one side thereof and electrodes provided on the other side thereof for the electric connection with the mounted electrical components. The electric circuit board module further includes conductor columns adhered to the electrodes and an adhesion layer provided on the other side of the substrate and around the conductor columns such that the conductor columns extrude from the adhesion layer by a predetermined length. By pressing the electric circuit board module against a separate circuit board to mount thereon, the electric components are electrically connected with electrodes of the sperate circuit board through conductor columns. Since conductor columns are made of a resinous paste with metallic powders dispersed therein, no heating operation as required in conventional module using a solder flow is necessary, resulting in that electric components are kept from the degradation caused by the heat.
摘要翻译：一种电路板模块，包括其一侧安装有电气部件的基板和设置在其另一侧上的电极，用于与所安装的电气部件的电连接。电路板模块还包括粘附到电极的导体柱和设置在基板的另一侧上并围绕导体柱的粘合层，使得导体列从粘合层挤出预定长度。通过将电路板模块压靠在单独的电路板上以安装在其上，电气部件通过导体柱与工作电路板的电极电连接。由于导体柱由分散有金属粉末的树脂浆料制成，因此不需要使用焊料流动的常规模块中的加热操作，导致电子部件不受热引起的劣化。

7. 发明授权

US5089372A Transfer recording medium utilizing diazo or azide compounds wherein light energy is converted to heat energy 失效
标题翻译：转移记录媒质利用光能转换为热能的DIAZO或AZIDE化合物
公开(公告)号：US5089372A
公开(公告)日：1992-02-18
申请号：US439014
申请日：1989-11-20
申请人： Yoshihiro Kirihata , Chikara Murata , Masahide Tsukamoto , Yutaka Nishimura
发明人： Yoshihiro Kirihata , Chikara Murata , Masahide Tsukamoto , Yutaka Nishimura
IPC分类号： B41M5/48
CPC分类号： B41M5/48 , Y10S430/146 , Y10S430/165
摘要： A transfer recording medium is disclosed, comprising a light transmitting support having provided thereon a heat transfer solid ink layer via an interlayer having a photolyzable compound. The recording medium provides a clear and high-quality color image on an image-receiving sheet at high speed and low cost irrespective of surface smoothness of the image-receiving sheet.
摘要翻译：公开了一种转印记录介质，其包括透光支撑件，其上具有经由具有可光致化合物的中间层的传热固体油墨层。记录介质在图像接收片材上以高速和低成本提供清晰和高质量的彩色图像，而与图像接收片材的表面平滑度无关。

8. 发明授权

US4352162A Digital filter 失效
标题翻译：数字滤波器
公开(公告)号：US4352162A
公开(公告)日：1982-09-28
申请号：US162614
申请日：1980-06-24
申请人： Tomoaki Nyuji , Itaru Kawasaki , Masahiro Noguchi , Masahide Tsukamoto
发明人： Tomoaki Nyuji , Itaru Kawasaki , Masahiro Noguchi , Masahide Tsukamoto
IPC分类号： G10L13/047 , G10L19/06 , H03H17/02 , G06F15/34 , G10L1/00
CPC分类号： H03H17/0285 , G10L13/047 , G10L19/06
摘要： A digital filter for a voice synthesis circuit which operates on the basis of the principle of linear predictive coding. More particularly, a digital filter of the lattice type for voice synthesis on the basis of the principle of linear predictive coding and capable of operating with a low clock frequency. Furthermore, the digital filter may use one multiplication circuit and one addition/subtraction circuit as well as containing an attenuation term element.
摘要翻译：一种用于语音合成电路的数字滤波器，其基于线性预测编码的原理进行操作。更具体地，基于线性预测编码的原理并且能够以低时钟频率操作的用于语音合成的格子类型的数字滤波器。此外，数字滤波器可以使用一个乘法电路和一个加法/减法电路以及包含衰减项元件。

9. 发明授权

US07059039B2 Method for producing printed wiring boards 失效
标题翻译：印刷电路板的制造方法
公开(公告)号：US07059039B2
公开(公告)日：2006-06-13
申请号：US10762004
申请日：2004-01-21
申请人： Masahide Tsukamoto , Masanaru Hasegawa , Hideo Hatanaka
发明人： Masahide Tsukamoto , Masanaru Hasegawa , Hideo Hatanaka
IPC分类号： H05K3/36
CPC分类号： H05K3/462 , H05K3/205 , H05K3/207 , H05K3/4069 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0376 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/1461 , Y10S156/923 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T156/1168
摘要： A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.
摘要翻译：一种制造印刷电路板的方法包括以下步骤：在粘合绝缘片中的预定位置穿孔，在导电材料如导电膏或金属球填充通孔，转印形成在表面上的导电布线图案通过热和压力将可释放的支撑片材粘合到绝缘片的表面上。同时，通过填充到通孔中的导电材料进行层间通孔连接。

10. 发明申请

US20050017268A1 Display apparatus and its manufacturing method 审中-公开
标题翻译：显示装置及其制造方法
公开(公告)号：US20050017268A1
公开(公告)日：2005-01-27
申请号：US10488590
申请日：2002-09-09
申请人： Masahide Tsukamoto , Yoshihiro Bessho , Takeo Ukai
发明人： Masahide Tsukamoto , Yoshihiro Bessho , Takeo Ukai
IPC分类号： G02F1/1333 , G09F9/30 , G09F9/313 , G09F9/35 , G09G3/00 , G09G3/20 , G09G3/28 , G09G3/32 , H01J17/49 , H01L27/32 , H01L31/0336
CPC分类号： H01L27/3293 , G02F1/13336 , G09F9/30 , G09F9/313 , G09G3/20 , G09G3/2014 , G09G3/2085 , G09G3/3208 , G09G2300/026 , G09G2310/0221 , G09G2310/04 , H01J11/10 , H01J2211/46 , H01L27/3251
摘要： An object of the present invention is to provide a display apparatus that has, even when it is a large-sized one, a high manufacturing yield, as well as a simple structure as a whole including wirings. In order to achieve the object, the display apparatus comprises a display unit that has, on a surface of a substrate, display elements that each include a light display member and a display unit terminal and are disposed in an array; module substrates each disposed in a different one of the areas into which a surface of the display unit on which the display unit terminals are disposed is divided; and a main wiring substrate disposed so as to cover the module substrates, wherein a first wiring for transferring electricity and signals to the module substrates is provided on the main wiring substrate, and (i)drive elements that supply drive signals, (ii) the second wiring for transferring the electricity and the signals transferred via the first wiring to the drive elements, and (iii) module output terminals for transferring the drive signals from the drive elements to the display unit terminals are provided on the module substrates.
摘要翻译：本发明的目的在于提供一种显示装置，即使是大尺寸的显示装置，也具有制造成品率高的结构，以及整体上由布线构成的简单结构。为了实现该目的，显示装置包括：显示单元，其在基板的表面上具有各自包括光显示部件和显示单元端子并且排列成阵列的显示元件; 模块基板，分别设置在设置有显示单元端子的显示单元的表面的不同的一个区域中; 以及以覆盖所述模块基板的方式配置的主布线基板，其中，在所述主布线基板上设置有用于将电力和信号传递到所述模块基板的第一布线，以及（i）提供驱动信号的驱动元件，（ii）用于将电力传送的第二布线和经由第一布线传送的信号到驱动元件，以及（iii）用于将驱动信号从驱动元件传送到显示单元端子的模块输出端子设置在模块基板上。

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