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1. 发明授权

US4075294A Carburetor accelerating fuel circuit means 失效
标题翻译：化油器加速燃油回路的手段
公开(公告)号：US4075294A
公开(公告)日：1978-02-21
申请号：US773350
申请日：1977-03-01
申请人： Masaaki Saito , Kenji Okamura
发明人： Masaaki Saito , Kenji Okamura
IPC分类号： F02M7/08 , F02M7/093
CPC分类号： F02M7/093 , Y10T137/7792
摘要： A carburetor is provided with a flow control valve in a fuel discharge passageway leading from an acceleration pump to an air induction passage. The valve is pressure responsive and reduces effective cross sectional area of the passageway in response to pressure in the passageway, the pump discharge pressure.
摘要翻译：化油器在从加速泵引导到空气导入通道的燃料排放通道中设置有流量控制阀。该阀是压力响应的，并且响应于通道中的压力，泵排出压力而减小通道的有效横截面面积。

2. 发明授权

US08471169B2 Electrode for spot welding 有权
标题翻译：点焊用电极
公开(公告)号：US08471169B2
公开(公告)日：2013-06-25
申请号：US12308088
申请日：2007-06-06
申请人： Shingo Mukae , Kenji Okamura , Shuichi Teramoto , Jun Kurobe , Hiroshi Asada , Shouji Inoue , Shigeo Matsubara
发明人： Shingo Mukae , Kenji Okamura , Shuichi Teramoto , Jun Kurobe , Hiroshi Asada , Shouji Inoue , Shigeo Matsubara
IPC分类号： B23K11/11 , B23K35/22
CPC分类号： B23K11/3009 , B23K35/0266 , B23K35/32 , C22F1/18
摘要： Provided is an electrode (1) which has a double structure including Cu or a Cu alloy as an electrode body (2) and a core material (3) made of W, Mo, a W-based alloy, or a Mo-based alloy embedded in a surface of the electrode body (2) which is abutted against a material to be welded, the core material (3) being formed by using W, Mo, the W-based alloy, or the Mo-based alloy which is in the form of a fibrous structure extended by sintering, swaging, and annealing in an electrode axis direction, the fibrous structure having a horizontal cross-sectional average particle diameter of 50 μm or more and an aspect ratio of 1.5 or more. The electrode (1) can be used as an inexpensive electrode obtained by suppressing particle dropping/attrition and defects in electrodes for spot welding, in which heat and pressure are applied repeatedly, stably enhancing durability.
摘要翻译：提供一种具有包括Cu或Cu合金作为电极体（2）的双重结构的电极（1）和由W，Mo，W基合金或Mo基合金制成的芯材（3）嵌入与被焊接材料抵接的电极体（2）的表面，芯材（3）通过使用W，Mo，W基合金或Mo基合金通过在电极轴线方向进行烧结，模锻和退火而延伸的纤维结构体的形状，所述纤维结构体的水平截面平均粒径为50μm以上，纵横比为1.5以上。电极（1）可以用作通过抑制重复施加热和压力并且稳定地提高耐久性的点焊的电极中的颗粒滴下/磨损和缺陷而获得的便宜的电极。

3. 发明授权

US07993170B2 Terminal fitting and a connector 有权
标题翻译：端子接头和连接器
公开(公告)号：US07993170B2
公开(公告)日：2011-08-09
申请号：US12754328
申请日：2010-04-05
申请人： Takehiro Nakata , Kenji Okamura
发明人： Takehiro Nakata , Kenji Okamura
IPC分类号： H01R4/10
CPC分类号： H01R4/185 , H01R4/188 , H01R13/4223 , H01R13/4362 , H01R13/5205 , H01R13/5219
摘要： A terminal (20) has a terminal main body (51) with a projection (55) to be engaged with a retainer (40). A wire barrel (21) to be crimped to a core (11) of a wire (10), an insulation barrel (23) to be crimped to an insulating coating (12) and a rubber plug barrel (24) to be crimped to a rubber plug (15) are successively arranged behind the main body (51). Bottom parts of the wire barrel (21) and the insulation barrel (23) are at low positions having substantially the same height. A front end of the wire barrel (23) is crimped flat to suppress bend-up of the core (11). The front end of the crimped wire barrel (21) is insertable to a position facing a projecting end of the retainer (40) when the terminal (20) is inserted to a proper position in a cavity (31) of a housing (30).
摘要翻译：端子（20）具有端子主体（51），其具有与保持器（40）接合的突起（55）。要压接到线（10）的芯（11）的线筒（21），待压接到绝缘涂层（12）的绝缘筒（23）和待压接的橡胶塞筒（24）橡胶塞（15）依次布置在主体（51）后面。线筒（21）和绝缘筒（23）的底部位于具有基本相同高度的低位置。线筒（23）的前端被压平，以抑制芯部（11）的弯曲。当端子（20）插入到壳体（30）的空腔（31）中的适当位置时，卷曲的线筒（21）的前端可插入到面向保持器（40）的突出端的位置，。

4. 发明授权

US07901257B2 Terminal fitting 有权
标题翻译：端子接头
公开(公告)号：US07901257B2
公开(公告)日：2011-03-08
申请号：US12483480
申请日：2009-06-12
申请人： Kenji Okamura , Motoki Kubota , Kazuhide Muneyasu
发明人： Kenji Okamura , Motoki Kubota , Kazuhide Muneyasu
IPC分类号： H01R4/10
CPC分类号： H01R4/185 , H01R43/16
摘要： A terminal fitting (10, 130, 510) has a connecting portion (11, 131, 511) to be connected with a mating connecting portion, and a crimping portion (12, 140) continuous with the rear end of the connecting portion (11, 131, 511) and including a bottom plate (21, 148, 515) and crimping pieces (22, 147, 516) standing up from the bottom plate (21, 148, 515). The crimping portion (12, 140) is crimped into connection with a wire (30, 120, 590) while surrounding an end portion of the wire (30, 120, 590) by the bottom plate (21, 148, 515) and the crimping pieces (22, 147, 516). The bottom plate (21, 148, 515) is formed with a reinforcing rib (24, 150, 250, 350, 450, 525) extending in forward and backward directions.
摘要翻译：端子接头（10,130,510）具有与配合连接部分连接的连接部分（11,131,511），以及与连接部分（11）的后端连续的压接部分（12,140），131,511），并且包括从底板（21,148,515）竖起的底板（21,148,515）和压接片（22,147,516）。卷边部分（12,140）通过底板（21,148,515）围绕导线（30,120,590）的端部而与线（30,120,590）连接，并且卷边件（22,147,516）。底板（21,148,515）形成有沿前后方向延伸的加强肋（24,150,250,350,450,525）。

5. 发明授权

US07862374B2 Connector having a locking lance 失效
标题翻译：具有锁定枪的连接器
公开(公告)号：US07862374B2
公开(公告)日：2011-01-04
申请号：US12487867
申请日：2009-06-19
申请人： Toshifumi Ichio , Kenji Okamura
发明人： Toshifumi Ichio , Kenji Okamura
IPC分类号： H01R13/40
CPC分类号： H01R13/4223 , H01R2201/20
摘要： Locking lances (12) are formed at an outer wall (10B) of a housing (10) and are resiliently deformable between engaging positions to engage terminals (20) and disengaging positions outward from the engaging positions to permit the insertion and withdrawal of the terminals (20). Leading end surfaces (12B) of the locking lances (12) are inclined to project gradually forward toward an inner side of the housing (10). A facing surface (15A) of the outer wall (10B) of the housing 10 facing the leading end surfaces (12B) of the locking lances 12 is inclined to project gradually toward the locking lances (12) at more outward positions on the housing (10). The leading end surfaces (12B) of the locking lances (12) contact the facing surface (15A) when the locking lances (12) are deformed outward beyond the disengaging positions.
摘要翻译：锁定枪（12）形成在壳体（10）的外壁（10B）处，并且在接合位置之间可弹性变形，以接合端子（20）和从接合位置向外脱离位置，以允许端子的插入和拉出（20）。锁定喷枪（12）的前端表面（12B）倾斜向着壳体（10）的内侧逐渐向前突出。壳体10的面向锁定矛杆12的前端表面（12B）的外壁（10B）的面对表面（15A）倾斜以在壳体上的更多外部位置逐渐朝向锁定矛杆（12）突出 10）。当锁定矛杆（12）向外变形超出脱离位置时，锁定矛杆（12）的前端表面（12B）与相对表面（15A）接触。

6. 发明申请

US20100234205A1 TiO2-containing quartz glass substrate 审中-公开
标题翻译：含TiO2的石英玻璃基板
公开(公告)号：US20100234205A1
公开(公告)日：2010-09-16
申请号：US12659595
申请日：2010-03-15
申请人： Yoshiaki Ikuta , Yasutomi Iwahashi , Kenji Okamura
发明人： Yoshiaki Ikuta , Yasutomi Iwahashi , Kenji Okamura
IPC分类号： C03C3/04
CPC分类号： B29C33/38 , B82Y10/00 , B82Y40/00 , C03C3/06 , C03C2201/12 , C03C2201/42 , G03F7/0002
摘要： An object of the present invention is to provide a TiO2-containing quartz glass substrate which, when used as a mold base for nanoimprint lithography, can form a concavity and convexity pattern having a dimensional variation falling within ±10%. The invention relates to a TiO2-containing quartz glass substrate: in which a coefficient of thermal expansion in the range of from 15 to 35° C. is within ±200 ppb/° C.; a TiO2 concentration is from 4 to 9 wt %; and a TiO2 concentration distribution, in a substrate surface on the side where a transfer pattern is to be formed, is within ±1 wt %.
摘要翻译：本发明的目的是提供一种含TiO 2的石英玻璃基板，其用作纳米压印光刻用的模具基底时，可以形成尺寸变化在±10％以内的凹凸图案。本发明涉及一种含TiO 2的石英玻璃基板，其中15至35℃范围内的热膨胀系数在±200ppb /℃以内。 TiO 2浓度为4〜9重量％。并且在要形成转印图案的一侧的基板表面中的TiO 2浓度分布在±1重量％以内。

7. 发明申请

US20100101940A1 METHOD FOR REMOVING FOREIGN MATTER FROM GLASS SUBSTRATE SURFACE AND METHOD FOR PROCESSING GLASS SUBSTRATE SURFACE 审中-公开
标题翻译：从玻璃基板表面去除外来物质的方法及处理玻璃基板表面的方法
公开(公告)号：US20100101940A1
公开(公告)日：2010-04-29
申请号：US12648481
申请日：2009-12-29
申请人： Masabumi Ito , Kenji Okamura , Hiroshi Kojima
发明人： Masabumi Ito , Kenji Okamura , Hiroshi Kojima
IPC分类号： C23F1/00
CPC分类号： C03C15/02 , B82Y10/00 , B82Y40/00 , C03C23/0025 , C03C23/006 , C03C23/0075 , G03F1/24 , G03F1/82 , H01J2237/0812 , H01J2237/3151
摘要： An object of the invention is to provide a method for removing foreign matter from a glass substrate surface to be finish-processed by a method accompanied with beam irradiation or laser light irradiation on the glass substrate surface. The present invention relates to a method for removing foreign matter from a glass substrate surface, which includes subjecting the glass substrate surface to gas cluster ion beam etching at an accelerating voltage of from 5 to 15 keV.
摘要翻译：本发明的目的是提供一种通过伴随着在玻璃基板表面上的光束照射或激光照射的方法从待处理的玻璃基板表面去除异物的方法。本发明涉及一种从玻璃基板表面除去异物的方法，其包括以5至15keV的加速电压对玻璃基板表面进行气体簇离子束蚀刻。

8. 发明申请

US20090042445A1 JOINT CONNECTOR 有权
标题翻译：接头连接器
公开(公告)号：US20090042445A1
公开(公告)日：2009-02-12
申请号：US12187461
申请日：2008-08-07
申请人： Toshifumi Ichio , Kenji Okamura
发明人： Toshifumi Ichio , Kenji Okamura
IPC分类号： H01R24/00 , G01R31/04
CPC分类号： H01R13/514 , H01R13/4361 , H01R13/6456
摘要： A joint connector (10) has sub-housings (S) (S1 to S6) that can be built up in plural levels. Projecting pieces (31) project on outer sides of the respective sub-housings (S) in directions intersecting a build-up direction (BUD) of the sub-housings (S) and define hand-push portions (13) by building up the sub-housings (S). The sub-housings (S) built up in levels are fit into the intermediate connector (20) by pushing the hand-push portions (13) towards the intermediate connector (20) so that terminal fittings (40) in the joint connector (10) are connected electrically with intermediate terminals (24) in the intermediate connector (20). Identifying projections (A) on the lower mating surfaces of the projecting pieces (31) enter identifying recesses (B) in the upper mating surfaces of adjacent projecting pieces (31) if the sub-housings (S) are built up properly.
摘要翻译：接头连接器（10）具有可以多层建立的子壳体（S）（S1至S6）。投影片（31）在与副壳体（S）的累积方向（BUD）相交的方向上突出于相应副壳体（S）的外侧，并且通过构成手推动部分子外壳（S）。通过将手推部分（13）推向中间连接器（20），通过将接合连接器（10）中的端子接头（40）推到中间连接器（20）中，构成水平的子壳体（S））与中间连接器（20）中的中间端子（24）电连接。如果副壳体（S）正确地组装，则在突出片（31）的下配合表面上识别突起（A）进入相邻突片（31）的上配合表面中的识别凹部（B）。

9. 发明申请

US20060264097A1 Connector to be mounted on an electric/electronic device 有权
标题翻译：要安装在电气/电子设备上的连接器
公开(公告)号：US20060264097A1
公开(公告)日：2006-11-23
申请号：US11435591
申请日：2006-05-17
申请人： Hiroshi Nakano , Kenji Okamura
发明人： Hiroshi Nakano , Kenji Okamura
IPC分类号： H01R13/60
CPC分类号： H01R12/707
摘要： A circuit board connector has metal fixing portions (60) for fixing a synthetic resin housing (10) to a circuit board (K). The fixing portions (60) are mounted into the housing (10) and are soldered to the circuit board (K). The housing (10) has mounting grooves (15) for receiving the fixing portions (60), whereas the fixing portions (60) have retaining portions (67) for biting in edges of the mounting grooves (15) to prevent the fixing portions (60) from coming out of the mounting grooves (15). Contact positions of the retaining portions (67) and edges of the mounting grooves (15) are lower than half the maximum height (L1) of the housing (10) for keeping the fixing portions (60) solder-connected with the circuit board (K) against a separating force on the fixing portions (60) in a direction away from the circuit board (K) as the housing (10) thermally expands.
摘要翻译：电路板连接器具有用于将合成树脂壳体（10）固定到电路板（K）的金属固定部分（60）。固定部分（60）安装到壳体（10）中并焊接到电路板（K）上。壳体（10）具有用于接收固定部分（60）的安装槽（15），而固定部分（60）具有用于咬住安装槽（15）边缘的保持部分（67），以防止固定部分 60）从安装槽（15）出来。保持部（67）和安装槽（15）的边缘的接触位置低于用于保持固定部（60）与电路板焊接的壳体（10）的最大高度（L 1）的一半（K）在远离电路板（K）的方向上抵抗固定部分（60）上的分离力。

10. 发明授权

US07077694B2 Connector to be fixed to a device and method of fixing a connector to a device 有权
标题翻译：要固定到设备的连接器和将连接器固定到设备的方法
公开(公告)号：US07077694B2
公开(公告)日：2006-07-18
申请号：US11073228
申请日：2005-03-04
申请人： Hiroshi Nakano , Kenji Okamura
发明人： Hiroshi Nakano , Kenji Okamura
IPC分类号： H01R13/369
CPC分类号： H01R12/707 , H01R12/57
摘要： Fixing members (30) fixable to a circuit board (K) by soldering are mounted in a housing (10). Each fixing member (30) is comprised of a main panel (31) and a solder leg (32) projecting sideways from the bottom end of the main portion (31). The solder leg (32) has solder entering holes (37) that open at a side of the solder leg (32) toward the circuit board K and at a side opposite therefrom. Each solder entering hole (37) has a cross-section that gradually increases toward both upper and lower open ends (37a, 37b). A locking portion (38) is formed on each solder entering hole (37) and bulges more inward than both open ends (37a, 37b). The locking portion (38) locks solder (H) that enters the solder entering hole (37).
摘要翻译：通过焊接固定到电路板（K）的固定构件（30）安装在壳体（10）中。每个固定构件（30）包括主板（31）和从主体部分（31）的底端侧向突出的焊接脚（32）。焊料支脚（32）具有焊料进入孔（37），该焊料进入孔（37）在焊料支脚（32）的一侧朝向电路板K和与其相反的一侧开口。每个焊料进入孔（37）具有朝着上开口端和下开口端（37a，37b）逐渐增加的横截面。在每个焊料进入孔（37）上形成锁定部分（38），并且比两个开口端（37a，37b）更向内凸出。锁定部分（38）锁定进入焊料进入孔（37）的焊料（H）。

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