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    • 1. 发明授权
    • Method for fabricating passive devices for 3D non-volatile memory
    • 用于制造3D非易失性存储器的无源器件的方法
    • US08951859B2
    • 2015-02-10
    • US13301560
    • 2011-11-21
    • Masaaki HigashitaniPeter Rabkin
    • Masaaki HigashitaniPeter Rabkin
    • H01L21/8239H01L29/792H01L49/02H01L27/115
    • H01L29/7926H01L27/11565H01L27/1157H01L27/11573H01L27/11575H01L27/11582H01L28/20H01L28/87H01L28/88
    • A method for fabricating passive devices such as resistors and capacitors for a 3D non-volatile memory device. In a peripheral area of a substrate, alternating layers of a dielectric such as oxide and a conductive material such as heavily doped polysilicon or metal silicide are provided in a stack. The substrate includes one or more lower metal layers connected to circuitry. One or more upper metal layers are formed above the stack. Contact structures are formed which extend from the layers of conductive material to portions of the one or more upper metal layers so that the layers of conductive material are connected to one another in parallel or serially by the contact structures and the at least one upper metal layer. Additional contact structures can connect the circuitry to the one or more upper metal layers. The passive device can be fabricated concurrently with a 3D memory array using common processing steps.
    • 一种用于制造用于3D非易失性存储器件的诸如电阻器和电容器的无源器件的方法。 在衬底的外围区域中,叠层中提供诸如氧化物和诸如重掺杂多晶硅或金属硅化物的导电材料的电介质的交替层。 衬底包括连接到电路的一个或多个下部金属层。 在堆叠上方形成一个或多个上金属层。 形成了从导电材料层延伸到一个或多个上金属层的部分的接触结构,使得导电材料层彼此平行或连续地由接触结构和至少一个上金属层 。 附加接触结构可以将电路连接到一个或多个上金属层。 可以使用常规的处理步骤与3D存储器阵列同时地制造无源器件。
    • 3. 发明申请
    • Controlling Dummy Word Line Bias During Erase In Non-Volatile Memory
    • 在非易失性存储器中擦除期间控制虚拟字线偏置
    • US20130314995A1
    • 2013-11-28
    • US13479649
    • 2012-05-24
    • Deepanshu DuttaMohan DungaMasaaki Higashitani
    • Deepanshu DuttaMohan DungaMasaaki Higashitani
    • G11C16/14G11C16/04
    • G11C16/14G11C7/1006G11C11/5635G11C16/0483G11C16/16
    • A technique for erasing non-volatile memory such as a NAND string which includes non-user data or dummy storage elements. The voltages of the non-user data storage elements are capacitively coupled higher by controlled increases in an erase voltage which is applied to a substrate. The voltages are floated by rendering a pass gate transistor in a non-conductive state, where the pass gate transistor is between a voltage driver and a non-user data storage element. Voltages of select gate transistors can also be capacitively coupled higher. The substrate voltage can be increased in steps and/or as a continuous ramp. In one approach, outer dummy storage elements are floated while inner dummy storage elements are driven. In another approach, both outer and inner dummy storage elements are floated. Write-erase endurance of the storage elements is increased due to reduced charge trapping in the substrate.
    • 一种用于擦除诸如包括非用户数据或虚拟存储元件的NAND串的非易失性存储器的技术。 非用户数据存储元件的电压通过施加到衬底的擦除电压的受控增加而被电容性耦合。 通过使通路栅极晶体管处于非导通状态来浮置电压,其中通过栅极晶体管位于电压驱动器和非用户数据存储元件之间。 选择栅极晶体管的电压也可以电容耦合得更高。 衬底电压可以逐步增加和/或作为连续斜坡增加。 在一种方法中,外部虚拟存储元件浮动,同时内部虚拟存储元件被驱动。 在另一种方法中,外部和内部虚拟存储元件都浮起来。 由于基板中的电荷捕获减少,存储元件的写擦除耐久性增加。
    • 5. 发明申请
    • Method For Fabricating Passive Devices For 3D Non-Volatile Memory
    • 用于制造3D非易失性存储器的无源器件的方法
    • US20130130468A1
    • 2013-05-23
    • US13301560
    • 2011-11-21
    • Masaaki HigashitaniPeter Rabkin
    • Masaaki HigashitaniPeter Rabkin
    • H01L21/02
    • H01L29/7926H01L27/11565H01L27/1157H01L27/11573H01L27/11575H01L27/11582H01L28/20H01L28/87H01L28/88
    • A method for fabricating passive devices such as resistors and capacitors for a 3D non-volatile memory device. In a peripheral area of a substrate, alternating layers of a dielectric such as oxide and a conductive material such as heavily doped polysilicon or metal silicide are provided in a stack. The substrate includes one or more lower metal layers connected to circuitry. One or more upper metal layers are formed above the stack. Contact structures are formed which extend from the layers of conductive material to portions of the one or more upper metal layers so that the layers of conductive material are connected to one another in parallel or serially by the contact structures and the at least one upper metal layer. Additional contact structures can connect the circuitry to the one or more upper metal layers. The passive device can be fabricated concurrently with a 3D memory array using common processing steps.
    • 一种用于制造用于3D非易失性存储器件的诸如电阻器和电容器的无源器件的方法。 在衬底的外围区域中,叠层中提供诸如氧化物和诸如重掺杂多晶硅或金属硅化物的导电材料的电介质的交替层。 衬底包括连接到电路的一个或多个下部金属层。 在堆叠上方形成一个或多个上金属层。 形成了从导电材料层延伸到一个或多个上金属层的部分的接触结构,使得导电材料层彼此平行或连续地由接触结构和至少一个上金属层 。 附加接触结构可以将电路连接到一个或多个上金属层。 可以使用常规的处理步骤与3D存储器阵列同时地制造无源器件。
    • 6. 发明授权
    • Programming non-volatile storage with synchonized coupling
    • 用同步耦合编程非易失性存储器
    • US08406063B2
    • 2013-03-26
    • US13590155
    • 2012-08-20
    • Nima MokhlesiHenry ChinMasaaki Higashitani
    • Nima MokhlesiHenry ChinMasaaki Higashitani
    • G11C11/34
    • G11C11/5628G11C16/0483G11C16/10
    • A process for programming non-volatile storage is able to achieve faster programming speeds and/or more accurate programming through synchronized coupling of neighboring word lines. The process for programming includes raising voltages for a set of word lines connected a group of connected non-volatile storage elements. The set of word lines include a selected word line, unselected word lines that are adjacent to the selected word line and other unselected word lines. After raising voltages for the set of word lines, the process includes raising the selected word line to a program voltage and raising the unselected word lines that are adjacent to the selected word line to one or more voltage levels concurrently with the raising the selected word line to the program voltage. The program voltage causes at least one of the non-volatile storage elements to experience programming.
    • 用于编程非易失性存储器的过程能够通过相邻字线的同步耦合来实现更快的编程速度和/或更精确的编程。 编程过程包括为连接一组连接的非易失性存储元件的一组字线提升电压。 所述字线组包括所选择的字线,与所选字线和其它未选字线相邻的未选字线。 在提高该组字线的电压之后,该处理包括将所选择的字线升高到编程电压,并将与所选择的字线相邻的未选字线与提升所选择的字线同时提升到一个或多个电压电平 到程序电压。 程序电压使至少一个非易失性存储元件经历编程。
    • 8. 发明申请
    • PROGRAMMING NON-VOLATILE STORAGE WITH SYNCHONIZED COUPLING
    • 编程具有同步耦合的非易失性存储
    • US20120314502A1
    • 2012-12-13
    • US13590155
    • 2012-08-20
    • Nima MokhlesiHenry ChinMasaaki Higashitani
    • Nima MokhlesiHenry ChinMasaaki Higashitani
    • G11C16/10
    • G11C11/5628G11C16/0483G11C16/10
    • A process for programming non-volatile storage is able to achieve faster programming speeds and/or more accurate programming through synchronized coupling of neighboring word lines. The process for programming includes raising voltages for a set of word lines connected a group of connected non-volatile storage elements. The set of word lines include a selected word line, unselected word lines that are adjacent to the selected word line and other unselected word lines. After raising voltages for the set of word lines, the process includes raising the selected word line to a program voltage and raising the unselected word lines that are adjacent to the selected word line to one or more voltage levels concurrently with the raising the selected word line to the program voltage. The program voltage causes at least one of the non-volatile storage elements to experience programming.
    • 用于编程非易失性存储器的过程能够通过相邻字线的同步耦合来实现更快的编程速度和/或更精确的编程。 编程过程包括为连接一组连接的非易失性存储元件的一组字线提升电压。 所述字线组包括所选择的字线,与所选字线和其它未选字线相邻的未选字线。 在提高该组字线的电压之后,该处理包括将所选择的字线升高到编程电压,并将与所选择的字线相邻的未选字线与提升所选择的字线同时提高到一个或多个电压电平 到程序电压。 程序电压使至少一个非易失性存储元件经历编程。