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    • 3. 发明申请
    • DATA CODING FOR IMPROVED ECC EFFICIENCY
    • 数据编码提高ECC效率
    • US20110126080A1
    • 2011-05-26
    • US12839237
    • 2010-07-19
    • Jun WanAlex MakTien-Chien KuoYan LiJian Chen
    • Jun WanAlex MakTien-Chien KuoYan LiJian Chen
    • G06F12/02H03M13/05G06F11/10
    • G11C11/5642G11C11/5628G11C29/00
    • Non-volatile storage devices and techniques for operating non-volatile storage are described herein. One embodiment includes accessing “n” pages of data to be programmed into a group of non-volatile storage elements. The “n” pages are mapped to a data state for each of the non-volatile storage elements based on a coding scheme that evenly distributes read errors across the “n” pages of data. Each of the non-volatile storage elements in the group are programmed to a threshold voltage range based on the data states to which the plurality of pages have been mapped. The programming may include programming the “n” pages simultaneously. In one embodiment, mapping the plurality of pages is based on a coding scheme that distributes a significant failure mode (for example, program disturb errors) to a first of the pages and a significant failure mode (for example, data retention errors) to a second of the pages.
    • 本文描述了用于操作非易失性存储器的非易失性存储设备和技术。 一个实施例包括访问要编程到一组非易失性存储元件中的“n”页数据。 基于在“n”页数据上均匀分布读取错误的编码方案,将“n”个页映射到每个非易失性存储元件的数据状态。 基于已经映射了多个页面的数据状态,组中的每个非易失性存储元件被编程到阈值电压范围。 编程可以包括同时对“n”页进行编程。 在一个实施例中,映射多个页面是基于将显着的故障模式(例如,程序干扰错误)分配给第一页面的编码方案和将重大故障模式(例如,数据保留错误)分配给 第二页。
    • 5. 发明申请
    • Programmable Chip Enable and Chip Address in Semiconductor Memory
    • 半导体存储器中的可编程芯片使能和芯片地址
    • US20080311684A1
    • 2008-12-18
    • US11763287
    • 2007-06-14
    • Loc TuJian ChenAlex MakTien-chien KuoLong Pham
    • Loc TuJian ChenAlex MakTien-chien KuoLong Pham
    • H01L21/66
    • H01L22/20H01L27/108H01L27/11H01L27/115H01L27/11524
    • Memory die are provided with programmable chip enable circuitry to allow particular memory die to be disabled after packaging and/or programmable chip address circuitry to allow particular memory die to be readdressed after being packaged. In a multi-chip memory package, a memory die that fails package-level testing can be disabled and isolated from the memory package by a programmable circuit that overrides the master chip enable signal received from the controller or host device. To provide a continuous address range, one or more of the non-defective memory die can be re-addressed using another programmable circuit that replaces the unique chip address provided by the pad bonding. Memory chips can also be also be readdressed after packaging independently of detecting a failed memory die.
    • 存储器管芯具有可编程芯片使能电路,以允许在封装和/或可编程芯片地址电路之后禁止特定存储器管芯,以允许特定存储器管芯在封装之后被读取。 在多芯片存储器封装中,可以通过可覆盖从控制器或主机设备接收的主芯片使能信号的可编程电路来禁止与存储器封装隔离的封装级测试失败的存储器管芯。 为了提供连续的地址范围,可以使用替代由焊盘键合提供的唯一芯片地址的另一个可编程电路来重新寻址无缺陷存储器管芯中的一个或多个。 封装后的存储器芯片也可以被独立于检测出错的存储器芯片而被读取。
    • 8. 发明授权
    • Selective word line erase in 3D non-volatile memory
    • 3D非易失性存储器中的选择性字线擦除
    • US08897070B2
    • 2014-11-25
    • US13287343
    • 2011-11-02
    • Yingda DongAlex MakSeungpil LeeJohann Alsmeier
    • Yingda DongAlex MakSeungpil LeeJohann Alsmeier
    • G11C11/34G11C16/04G11C16/16
    • G11C16/14G11C16/0483G11C16/16H01L27/11582H01L29/7926
    • An erase process for a 3D stacked memory device allows a portion of a block of memory cells to be erased. In one approach, in a U-shaped NAND string configuration, memory cells in the drain- or source-side columns are erased. In another approach, such as in a U-shaped or a straight NAND string configuration, memory cells in a portion of a column of memory cells are erased, and a dummy memory cell is provided between the erased and non-erased memory cells. A dummy memory cell can be on either side (e.g., above and below) of an erase memory cell, or on either side of a non-erased memory cell. A dummy memory cell is ineligible to store user data, but prevents a downshift in the threshold voltage of an erased memory cell from changing the threshold voltage of a non-erased memory cell, due to capacitive coupling.
    • 用于3D堆叠存储器件的擦除处理允许擦除存储单元块的一部分。 在一种方法中,在U形NAND串配置中,漏极或源极侧列中的存储单元被擦除。 在另一种方法中,例如在U形或直的NAND串配置中,擦除存储器单元列的一部分中的存储单元,并且在擦除和未擦除的存储器单元之间提供虚拟存储单元。 虚拟存储器单元可以在擦除存储器单元的任一侧(例如,高于和低于),或者在未擦除的存储器单元的任一侧上。 虚拟存储单元不能存储用户数据,但是由于电容耦合,防止擦除的存储单元的阈值电压的降档改变未擦除的存储单元的阈值电压。
    • 10. 发明申请
    • SYSTEMS FOR PROGRAMMABLE CHIP ENABLE AND CHIP ADDRESS IN SEMICONDUCTOR MEMORY
    • 用于半导体存储器中可编程芯片使能和芯片地址的系统
    • US20080310242A1
    • 2008-12-18
    • US11763292
    • 2007-06-14
    • Loc TuJian ChenAlex MakTien-chien KuoLong Pham
    • Loc TuJian ChenAlex MakTien-chien KuoLong Pham
    • G11C7/00G11C8/00
    • G11C29/88G11C5/04
    • Memory die are provided with programmable chip enable circuitry to allow particular memory die to be disabled after packaging and/or programmable chip address circuitry to allow particular memory die to be readdressed after being packaged. In a multi-chip memory package, a memory die that fails package-level testing can be disabled and isolated from the memory package by a programmable circuit that overrides the master chip enable signal received from the controller or host device. To provide a continuous address range, one or more of the non-defective memory die can be re-addressed using another programmable circuit that replaces the unique chip address provided by the pad bonding. Memory chips can also be also be readdressed after packaging independently of detecting a failed memory die.
    • 存储器管芯具有可编程芯片使能电路,以允许在封装和/或可编程芯片地址电路之后禁止特定存储器管芯,以允许特定存储器管芯在封装之后被读取。 在多芯片存储器封装中,可以通过可覆盖从控制器或主机设备接收的主芯片使能信号的可编程电路来禁止与存储器封装隔离的封装级测试失败的存储器管芯。 为了提供连续的地址范围,可以使用替代由焊盘键合提供的唯一芯片地址的另一个可编程电路来重新寻址无缺陷存储器管芯中的一个或多个。 封装后的存储器芯片也可以被独立于检测出错的存储器芯片而被读取。