专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080118761A1 MODIFIED SOLDER ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
公开(公告)号：US20080118761A1
公开(公告)日：2008-05-22
申请号：US11853556
申请日：2007-09-11
申请人： Martin W. Weiser , Jianxing Li
发明人： Martin W. Weiser , Jianxing Li
IPC分类号： C22C12/00 , B32B15/04
CPC分类号： C22C12/00 , B23K35/26 , B23K35/264 , H01L24/29 , H01L2224/32225 , H01L2924/01322 , H01L2924/1301 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , Y10T428/31678 , H01L2924/00
摘要： Lead-free solder compositions having a thermal conductivity are disclosed that include at least about 2% of silver, at least about 60% of bismuth, and at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range. Methods of producing these lead-free solder compositions are also disclosed that include providing at least about 2% of silver, providing at least about 60% of bismuth, providing at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, blending the bismuth with the at least one additional metal to form a bismuth-metal blend, and blending the bismuth-metal blend with copper to form the solder composition, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range. Additional methods of producing a lead-free solder composition having a thermal conductivity include providing at least about 2% of silver, providing at least about 60% of bismuth, providing at least one additional metal in an amount that will increase the thermal conductivity of the solder composition over a comparison solder composition consisting of silver and bismuth, blending the silver with the at least one additional metal to form a silver-metal alloy, and blending the silver-metal alloy with bismuth to form the solder composition, wherein the at least one additional metal does not significantly modify the solidus temperature and does not shift the liquidus temperature outside of an acceptable liquidus temperature range

2. 发明申请

US20100206133A1 METHOD OF REFINING SOLDER MATERIALS 有权
标题翻译：精炼金属材料的方法
公开(公告)号：US20100206133A1
公开(公告)日：2010-08-19
申请号：US12769130
申请日：2010-04-28
申请人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
发明人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
IPC分类号： C22B9/00
CPC分类号： H01L24/10 , B23K35/025 , B23K35/26 , B23K35/268 , C22B13/06 , C25C1/18 , H01L23/3128 , H01L23/49816 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/01092 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3463 , H05K3/3484 , H01L2924/00 , H01L2224/05599
摘要： The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
摘要翻译：本发明包括具有低浓度α粒子发射体的焊料材料，并且包括纯化材料以降低材料内的α粒子发射体浓度的方法。本发明包括通过纯化材料来减少各种含铅和无铅材料中的α粒子通量的方法。本发明还包括在纯化材料期间估计低浓度的一种或多种α粒子发射体的分馏的方法。

3. 发明申请

US20080291634A1 THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面材料，生产方法及其用途
公开(公告)号：US20080291634A1
公开(公告)日：2008-11-27
申请号：US12124998
申请日：2008-05-21
申请人： Martin W. Weiser , Kikue S. Burnham , De-Ling Zhou , Roger Y. Leung , Jan Nedbal , Ravi Rastogi
发明人： Martin W. Weiser , Kikue S. Burnham , De-Ling Zhou , Roger Y. Leung , Jan Nedbal , Ravi Rastogi
IPC分类号： H05K7/20
CPC分类号： C09K5/14 , H01L23/3737 , H01L23/42 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/0665 , H01L2924/00
摘要： Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.
摘要翻译：公开了热界面材料，其包括至少一种基质材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂改善所述热界面材料的热性能，相容性，物理质量或其组合。还公开了形成热界面材料的方法，其包括提供至少一种基质材料组分，至少一种高电导率填料，至少一种焊料材料和至少一种材料改性剂中的每一种，混合组分; 并且可选地将热界面材料预施加或后施加到表面，基材或组分上固化。此外，公开了热界面材料，其包括至少一种基体材料组分，至少一种高电导率填料组分，至少一种焊料材料; 和至少一种材料改性剂，其中所述至少一种材料改性剂至少一种改性的热填料型材。

4. 发明授权

US09666547B2 Method of refining solder materials 有权
公开(公告)号：US09666547B2
公开(公告)日：2017-05-30
申请号：US12769130
申请日：2010-04-28
申请人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
发明人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
IPC分类号： H01L21/44 , H01L23/00 , B23K35/02 , C25C1/18 , H01L23/498 , B23K35/26 , C22B13/06 , H01L23/31 , H05K3/34
CPC分类号： H01L24/10 , B23K35/025 , B23K35/26 , B23K35/268 , C22B13/06 , C25C1/18 , H01L23/3128 , H01L23/49816 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/01092 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3463 , H05K3/3484 , H01L2924/00 , H01L2224/05599
摘要： The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.

5. 发明申请

US20080026181A1 Synergistically-modified surfaces and surface profiles for use with thermal interconnect and interface materials, methods of production and uses thereof 审中-公开
标题翻译：用于热互连和界面材料的协同改性的表面和表面轮廓，生产方法及其用途
公开(公告)号：US20080026181A1
公开(公告)日：2008-01-31
申请号：US11493778
申请日：2006-07-25
申请人： Ravi Rastogi , Martin W. Weiser
发明人： Ravi Rastogi , Martin W. Weiser
IPC分类号： G11B5/64
CPC分类号： H01L21/4878 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T428/24355 , H01L2924/00
摘要： Synergistically-modified surfaces are described herein, where a surface having a surface profile is synergistically modified such that the thermal contact resistance between the surface and the at least one thermal interface material is reduced as compared to a surface that is not synergistically modified. Methods are also described herein of producing a synergistically-modified surface, comprising a) providing a surface having a surface profile, b) providing at least one thermal interface material, c) synergistically modifying the surface profile of the surface such that thermal contact resistance between the surface and the at least one thermal interface material is reduced as compared to a surface that is not synergistically modified. Layered components are also disclosed that comprise a synergistically-modified surface; a thermal interface material; and at least one additional layer of material.
摘要翻译：这里描述了协同改性的表面，其中具有表面轮廓的表面协同地被修改，使得与未协同改性的表面相比，表面和至少一种热界面材料之间的热接触电阻降低。本文还描述了产生协同改性表面的方法，其包括a）提供具有表面轮廓的表面，b）提供至少一种热界面材料，c）协同地改变表面的表面轮廓，使得与未协同改性的表面相比，表面和至少一种热界面材料减少。还公开了包含协同改性表面的分层组分; 热界面材料; 和至少一个附加的材料层。

6. 发明授权

US07521286B2 Methods of refining lead-containing materials 有权
标题翻译：含铅材料的精炼方法
公开(公告)号：US07521286B2
公开(公告)日：2009-04-21
申请号：US11418668
申请日：2006-05-05
申请人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
发明人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/10 , B23K35/025 , B23K35/26 , B23K35/268 , C22B13/06 , C25C1/18 , H01L23/3128 , H01L23/49816 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/01092 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3463 , H05K3/3484 , H01L2924/00 , H01L2224/05599
摘要： The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
摘要翻译：本发明包括具有低浓度α粒子发射体的焊料材料，并且包括纯化材料以降低材料内的α粒子发射体浓度的方法。本发明包括通过纯化材料来减少各种含铅和无铅材料中的α粒子通量的方法。本发明还包括在纯化材料期间估计低浓度的一种或多种α粒子发射体的分馏的方法。

7. 发明申请

US20080023665A1 Thermal interconnect and interface materials, methods of production and uses thereof 审中-公开
标题翻译：热互连和界面材料，生产方法及其用途
公开(公告)号：US20080023665A1
公开(公告)日：2008-01-31
申请号：US11493788
申请日：2006-07-25
申请人： Martin W. Weiser , Ravi Rastogi , Meghana Nerurkar , Devesh Mathur , Colin Xingcun Tong
发明人： Martin W. Weiser , Ravi Rastogi , Meghana Nerurkar , Devesh Mathur , Colin Xingcun Tong
IPC分类号： C09K5/00
CPC分类号： H01L23/3733 , H01L23/3737 , H01L2224/2929 , H01L2224/293 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29386 , H01L2224/29439 , H01L2224/29499 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/014
摘要： Components and materials, including thermal interface materials, described herein include at least one matrix component, at least one high conductivity component, and at least one solder material. In some embodiments, the at least one high conductivity component includes a filler component, a lattice component or a combination thereof. Methods are also described herein of producing a thermal interface material that include providing at least one matrix component, providing at least one high conductivity component, providing at least one solder material, and blending the at least one matrix component, the at least one high conductivity component and the at least one solder material.
摘要翻译：包括本文所述的热界面材料的组分和材料包括至少一种基质组分，至少一种高电导率组分和至少一种焊料材料。在一些实施方案中，至少一种高电导率组分包括填料组分，晶格组分或其组合。本文还描述了生产热界面材料的方法，其包括提供至少一种基质组分，提供至少一种高电导率组分，提供至少一种焊料材料，以及混合所述至少一种基质组分，所述至少一种高导电性组分和至少一种焊料材料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式