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1. 发明授权

US5132351A Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent 失效
标题翻译：包含金属盐，聚苯醚和溶剂的化学焊料
公开(公告)号：US5132351A
公开(公告)日：1992-07-21
申请号：US728865
申请日：1991-07-11
申请人： Martin J. Goldberg , Hiroshi Ito , Caroline A. Kovac , Michael J. Palmer , Roger A. Pollak , Paige A. Poore
发明人： Martin J. Goldberg , Hiroshi Ito , Caroline A. Kovac , Michael J. Palmer , Roger A. Pollak , Paige A. Poore
IPC分类号： B23K1/00 , B23K35/22 , B23K35/34 , B23K101/40 , H05K3/10 , H05K3/34
CPC分类号： B23K35/34 , H05K3/3484 , H05K2203/121 , H05K3/105 , Y10T29/49169
摘要： A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal.A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

2. 发明授权

US5503698A Bonding method employing organometallic interconnectors 失效
标题翻译：使用有机金属互连器的接合方法
公开(公告)号：US5503698A
公开(公告)日：1996-04-02
申请号：US727099
申请日：1991-07-09
申请人： Martin J. Goldberg , Hiroshi Ito , Caroline A. Kovac , Michael J. Palmer , Roger A. Pollak , Paige A. Poore
发明人： Martin J. Goldberg , Hiroshi Ito , Caroline A. Kovac , Michael J. Palmer , Roger A. Pollak , Paige A. Poore
IPC分类号： B23K1/00 , B23K35/22 , B23K35/34 , B23K101/40 , H05K3/10 , H05K3/34 , B32B31/00
CPC分类号： B23K35/34 , H05K3/3484 , H05K2203/121 , H05K3/105 , Y10T29/49169
摘要： A chemical solder is described that includes an organometallic complex or compound which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.
摘要翻译：描述了包括在预定温度范围内对金属和挥发性化合物热降解的有机金属络合物或化合物的化学焊料。焊料还包括在相同温度范围内分解成挥发性部分的聚合物基质，从而仅留下金属。公开了一种用于接合第一和第二主体的方法，其中如上所述的化学焊料设置在第一和第二主体之间，并且施加热量以将焊料升高到预定温度范围以使有机金属化合物热分解并分解聚合物基质。其余的金属与第一和第二物体结合。

3. 发明授权

US4862322A Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween 失效
标题翻译：双电子器件结构，其具有无焊接地结合在每个器件上的接触位置之间并且从其间向外突出的光束引线
公开(公告)号：US4862322A
公开(公告)日：1989-08-29
申请号：US188805
申请日：1988-05-02
申请人： Harry R. Bickford , Mark F. Bregman , Paul A. Moskowitz , Michael J. Palmer , Timothy C. Reiley , Paige A. Poore , Caroline A. Kovac
发明人： Harry R. Bickford , Mark F. Bregman , Paul A. Moskowitz , Michael J. Palmer , Timothy C. Reiley , Paige A. Poore , Caroline A. Kovac
IPC分类号： H01L25/18 , H01L23/495 , H01L25/065 , H01L25/07
CPC分类号： H01L25/0657 , H01L23/49575 , H01L25/0652 , H01L2224/16145 , H01L2224/48091 , H01L2224/48247 , H01L2225/06513 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/04941 , H01L2924/09701 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107
摘要： An integrated circuit device package in which integrated circuit devices are mounted with active faces placed facing each other to form a double-device structure. Input/output terminals on the active faces of each device can be electrically interconnected by placing an interconnection means between the chips to electrically interconnect input/output terminals on the active faces of the first and second device. Beam leads, each having an inner and outer lead bond site, project outwardly from between the devices where each of the inner lead bond site is solderlessly bonded between conducting patterns on each device bonded. A series of double-device structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-device structure, the inner lead bond site being solderlessly bonded between conducting patterns on each device.

4. 发明授权

US5203955A Method for etching an organic polymeric material 失效
标题翻译：蚀刻有机聚合物材料的方法
公开(公告)号：US5203955A
公开(公告)日：1993-04-20
申请号：US705648
申请日：1991-05-24
申请人： Aldred Viehbeck , Stephen L. Buchwalter , John J. Glenning , Martin J. Goldberg , Caroline A. Kovac , Linda C. Matthew , Walter P. Pawlowski , Stephen L. Tisdale
发明人： Aldred Viehbeck , Stephen L. Buchwalter , John J. Glenning , Martin J. Goldberg , Caroline A. Kovac , Linda C. Matthew , Walter P. Pawlowski , Stephen L. Tisdale
IPC分类号： C23C18/16 , C23C18/28 , H05K3/38
CPC分类号： C23C18/2086 , C23C18/1608 , C23C18/30 , C23C18/36 , C23C18/405 , H05K3/381 , C25D5/022
摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.
摘要翻译：某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。该改变可用于改性或蚀刻聚合物材料。可以通过在受控的深度将金属种子并入材料中来修饰材料。种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

5. 发明授权

US5135779A Method for conditioning an organic polymeric material 失效
标题翻译：调理有机聚合物材料的方法
公开(公告)号：US5135779A
公开(公告)日：1992-08-04
申请号：US705556
申请日：1991-05-24
申请人： Alfred Viehbeck , Stephen L. Buchwalter , Martin J. Goldberg , Caroline A. Kovac , Stephen L. Tisdale
发明人： Alfred Viehbeck , Stephen L. Buchwalter , Martin J. Goldberg , Caroline A. Kovac , Stephen L. Tisdale
IPC分类号： C23C18/16 , C23C18/28 , H05K3/38
CPC分类号： H05K3/381 , C23C18/1608 , C23C18/2086 , C23C18/30 , C23C18/31
摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.
摘要翻译：某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。该改变可用于改性或蚀刻聚合物材料。可以通过在受控的深度将金属种子并入材料中来修饰材料。种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

6. 发明授权

US5242713A Method for conditioning an organic polymeric material 失效
标题翻译：用于调节有机聚合材料的方法
公开(公告)号：US5242713A
公开(公告)日：1993-09-07
申请号：US290486
申请日：1988-12-23
申请人： Alfred Viehbeck , Stephen L. Buchwalter , William A. Donson , John J. Glenning , Martin J. Goldberg , Kurt R. Grebe , Caroline A. Kovac , Linda C. Matthew , Walter P. Pawlowski , Mark J. Schadt , Michael R. Scheuermann , Stephen L. Tisdale
发明人： Alfred Viehbeck , Stephen L. Buchwalter , William A. Donson , John J. Glenning , Martin J. Goldberg , Kurt R. Grebe , Caroline A. Kovac , Linda C. Matthew , Walter P. Pawlowski , Mark J. Schadt , Michael R. Scheuermann , Stephen L. Tisdale
IPC分类号： C23C18/20 , C08J5/12 , C08J7/00 , C23C18/16 , C23C18/28 , H05K3/38
CPC分类号： C23C18/1608 , C23C18/166 , C23C18/2086 , C23C18/28 , C23C18/30 , H05K3/381 , Y10S525/903
摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

7. 发明授权

US4832255A Precision solder transfer method and means 失效
标题翻译：精密焊接传输方式和手段
公开(公告)号：US4832255A
公开(公告)日：1989-05-23
申请号：US223818
申请日：1988-07-25
申请人： Harry R. Bickford , Kurt R. Grebe , Caroline A. Kovac , Michael J. Palmer
发明人： Harry R. Bickford , Kurt R. Grebe , Caroline A. Kovac , Michael J. Palmer
IPC分类号： B23K3/06 , B23K35/14 , B23K35/40 , H01L21/60 , H05K3/04 , H05K3/34 , H05K13/04
CPC分类号： H01L24/27 , B23K3/06 , H05K13/0465 , H05K3/3473 , H05K3/3478 , H01L2224/13111 , H01L2224/29111 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/1579 , H05K2203/0108 , H05K2203/0338 , H05K2203/043 , H05K2203/0528 , H05K2203/0726 , H05K2203/1105 , H05K3/046 , Y10T29/49204 , Y10T29/4921 , Y10T29/49213
摘要： This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse.In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

8. 发明授权

US4574095A Selective deposition of copper 失效
标题翻译：选择性沉积铜
公开(公告)号：US4574095A
公开(公告)日：1986-03-04
申请号：US672975
申请日：1984-11-19
申请人： Thomas H. Baum , Frances A. Houle , Carol R. Jones , Caroline A. Kovac
发明人： Thomas H. Baum , Frances A. Houle , Carol R. Jones , Caroline A. Kovac
IPC分类号： C23C18/16 , C23C18/18 , C23C18/20 , C23C18/30 , C23C18/31 , H05K3/18 , B05D3/06 , B05D5/12
CPC分类号： C23C18/1879 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1831 , C23C18/1868 , C23C18/204 , C23C18/30 , C23C18/38 , H05K3/184 , H05K2203/107
摘要： A process for selectively depositing copper by first selectively depositing palladium seeds by irradiating a palladium compound with light. Following the deposition of the palladium seeds, copper is deposited by an electroless process.
摘要翻译：一种选择性沉积铜的方法，首先通过用光照射钯化合物来选择性地沉积钯种子。在钯种子沉积之后，通过无电镀方法沉积铜。

9. 发明授权

US5178914A Means of seeding and metallizing polymide 失效
标题翻译：播种和金属化聚酰亚胺的方法
公开(公告)号：US5178914A
公开(公告)日：1993-01-12
申请号：US606015
申请日：1990-10-30
申请人： Ronald D. Goldblatt , Caroline A. Kovac , Domenico Tortorella
发明人： Ronald D. Goldblatt , Caroline A. Kovac , Domenico Tortorella
IPC分类号： B32B15/088 , C08G73/10 , C08J5/18 , C08J7/12 , C09D179/08 , C23C18/30 , C23C18/31 , H05K1/03 , H05K3/18 , H05K3/38
CPC分类号： H05K3/181 , C23C18/30 , H05K1/0346 , H05K3/381
摘要： A method for seeding the surface of a polyimide film which has been generated from a precursor polyamic acid film comprising the steps of: generating a film of polyamic acid on a substance (which may be done by conventional spin coating or by other solution coating techniques well known in the art); then either exposing the polyamic acid film to a solution containing palladium cations; heat-treating the palladium-treated film in a time/temperature schedule that causes imidization of the polymer to occur; exposing the seeded film to an electroless plating bath which causes the deposition of blanket metal film on the surface of the polymer film; or curing the film to the polyimide form; mechanically abrading the film surface, exposing the film to a solution containing palladium cations; exposing the seeded film to an electroless plating bath which causes the deposition of blanket metal film on the surface of the polymer film.
摘要翻译：一种从前体聚酰胺酸薄膜生成的聚酰亚胺薄膜的表面接种方法，包括以下步骤：在物质上生成聚酰胺酸的膜（可以通过常规旋涂或其它溶液涂覆技术完成）本领域已知）; 然后将聚酰胺酸膜暴露于含有钯阳离子的溶液中; 在导致聚合物酰亚胺化的时间/温度表中热处理钯处理的膜; 将接种的膜暴露于化学镀浴，其导致在聚合物膜的表面上沉积橡皮布金属膜; 或将膜固化成聚酰亚胺形式; 机械研磨膜表面，将膜暴露于含有钯阳离子的溶液中; 将接种的膜暴露于化学镀浴，其导致覆盖金属膜沉积在聚合物膜的表面上。

10. 发明授权

US5130781A Dam for lead encapsulation 失效
标题翻译：大坝铅封装
公开(公告)号：US5130781A
公开(公告)日：1992-07-14
申请号：US593374
申请日：1990-10-01
申请人： Caroline A. Kovac , Peter G. Ledermann , Luu T. Nguyen
发明人： Caroline A. Kovac , Peter G. Ledermann , Luu T. Nguyen
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L2224/50
摘要： A method and apparatus to encapsulate a device and joints coupled to conductive leads with an encapsulating material. A fixture has a recess to hold via a vacuum the device in place. Conduits in the fixture supply air around the device to form an air dam that flows outward around the device and the leads. A nozzle supplies a metered amount of material to the surface of the device. By controlling the temperature of the fixture and/or the air forming the air dam, the flow of material can be confined to the surface of the device and the joints as it cures. The method can also provide encapsulant edge capping to reduce device stresses.
摘要翻译：一种用封装材料封装耦合到导电引线的器件和接头的方法和装置。固定装置具有通过真空将装置保持在适当位置的凹部。设备中的管道供应设备周围的空气，以形成围绕设备和引线向外流动的空气坝。喷嘴向设备的表面提供计量的材料。通过控制固定装置的温度和/或形成空气坝的空气，材料的流动可以在其固化时被限制在装置和接头的表面上。该方法还可以提供封装边缘封盖以减少器件应力。

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