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1. 发明授权

US07375379B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US07375379B2
公开(公告)日：2008-05-20
申请号：US11313120
申请日：2005-12-19
申请人： Mark Pugh , Gerard Harbers , Robert Scott West
发明人： Mark Pugh , Gerard Harbers , Robert Scott West
IPC分类号： H01L27/15 , F21V7/04
CPC分类号： G02B6/0021 , G02B6/0073 , H01L33/405 , H01L33/46 , H01L33/465 , H01L33/505 , H01L33/60
摘要： The invention provides a light-emitting device and a method of illumination. The light-emitting device includes one or more semiconductor layers, a reflective bottom surface, and a top surface coupled to semiconductor layer. The semiconductor layers include an active region where a primary light is generated. The relative position of the top surface, the reflective bottom surface and the active region is adjusted to substantially transmit the primary light through the sides of the light-emitting device.
摘要翻译：本发明提供一种发光装置和照明方法。发光器件包括一个或多个半导体层，反射底表面和耦合到半导体层的顶表面。半导体层包括产生初级光的有源区。顶表面，反射底表面和有源区域的相对位置被调节以基本上透过发光器件侧面的初级光。

2. 发明授权

US07344902B2 Overmolded lens over LED die 有权
标题翻译： LED模组上包覆成型镜片
公开(公告)号：US07344902B2
公开(公告)日：2008-03-18
申请号：US11069418
申请日：2005-02-28
申请人： Grigoriy Basin , Robert Scott West , Paul S. Martin , Gerard Harbers , Willem H. Smits , Robert F. M. Hendriks , Frans H. Konijn
发明人： Grigoriy Basin , Robert Scott West , Paul S. Martin , Gerard Harbers , Willem H. Smits , Robert F. M. Hendriks , Frans H. Konijn
IPC分类号： H01L21/00
CPC分类号： G02B19/0066 , G02B19/0028 , G02B19/0071 , H01L24/73 , H01L24/97 , H01L33/46 , H01L33/507 , H01L33/54 , H01L33/58 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/12041 , H01L2924/15787 , H01L2924/1815 , H01L2924/19107 , H05K3/284 , H05K2201/10106 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).
摘要翻译：一个或多个LED骰子安装在支撑结构上。支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。模具中的凹槽对应于支撑结构上的LED骰子的位置。凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。压痕的形状将是镜片的形状。模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。然后将模具加热以固化（硬化）硅树脂。然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。可以用不同的模具重复该过模制过程以产生透镜的同心壳。每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

3. 发明授权

US09081167B2 Lens compression molded over LED die 有权
标题翻译：透镜压缩成型在LED模具上
公开(公告)号：US09081167B2
公开(公告)日：2015-07-14
申请号：US12049239
申请日：2008-03-14
申请人： Grigoriy Basin , Robert Scott West , Paul S. Martin , Gerard Harbers , Willem H. Smits , Robert F. M. Hendriks , Frans H. Konijn
发明人： Grigoriy Basin , Robert Scott West , Paul S. Martin , Gerard Harbers , Willem H. Smits , Robert F. M. Hendriks , Frans H. Konijn
IPC分类号： H01L33/00 , G02B19/00 , H01L23/00 , H01L33/54 , H05K3/28 , H01L33/46 , H01L33/50 , H01L33/58
CPC分类号： G02B19/0066 , G02B19/0028 , G02B19/0071 , H01L24/73 , H01L24/97 , H01L33/46 , H01L33/507 , H01L33/54 , H01L33/58 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/12041 , H01L2924/15787 , H01L2924/1815 , H01L2924/19107 , H05K3/284 , H05K2201/10106 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).
摘要翻译：一个或多个LED骰子安装在支撑结构上。支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。模具中的凹槽对应于支撑结构上的LED骰子的位置。凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。压痕的形状将是镜片的形状。模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。然后将模具加热以固化（硬化）硅树脂。然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。可以用不同的模具重复该过模制过程以产生透镜的同心壳。每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

4. 发明授权

US07352011B2 Wide emitting lens for LED useful for backlighting 有权
标题翻译：用于LED的宽发射透镜可用于背光
公开(公告)号：US07352011B2
公开(公告)日：2008-04-01
申请号：US11093961
申请日：2005-03-29
申请人： Willem H. Smits , Robert F. M. Hendriks , Grigoriy Basin , Frans H. Konijn , Robert Scott West , Paul S. Martin , Gerard Harbers
发明人： Willem H. Smits , Robert F. M. Hendriks , Grigoriy Basin , Frans H. Konijn , Robert Scott West , Paul S. Martin , Gerard Harbers
IPC分类号： H01L29/22
CPC分类号： H01L33/58 , G02B19/0028 , G02B19/0066 , G02B19/0071 , H01L33/46 , H01L33/504 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/13 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak intensity. The lens is particularly useful in a LCD backlighting application. In one embodiment, the lens is affixed to the backplane on which the LED die is mounted and surrounds the LED die. The lens has a hollow portion that forms an air gap between the LED die and the lens, where the light is bent towards the sides both at the air gap interface and the outer lens surface interface. The lens may be a secondary lens surrounding an interior lens molded directly over the LED die.
摘要翻译：描述镜片和某些制造技术。宽发射透镜折射由LED管芯发射的光，使峰强度发生在离中心轴50-80度以内，沿着中心轴的强度在峰值强度的5％至33％之间。镜头在LCD背光应用中特别有用。在一个实施例中，透镜固定到其上安装有LED管芯的背板上，并且围绕LED管芯。透镜具有中空部分，其在LED管芯和透镜之间形成气隙，其中光在气隙界面和外透镜表面界面处朝向侧面弯曲。透镜可以是围绕直接模制在LED芯片上的内部透镜的次级透镜。

5. 发明申请

US20080157114A1 Multiple Lenses Molded Over LED Die 有权
标题翻译：多个镜片模制在LED模具
公开(公告)号：US20080157114A1
公开(公告)日：2008-07-03
申请号：US12049239
申请日：2008-03-14
申请人： Grigoriy Basin , Robert Scott West , Paul S. Martin , Gerard Harbers , Willem H. Smits , Robert F. M. Hendriks , Frans H. Konijn
发明人： Grigoriy Basin , Robert Scott West , Paul S. Martin , Gerard Harbers , Willem H. Smits , Robert F. M. Hendriks , Frans H. Konijn
IPC分类号： H01L33/00
CPC分类号： G02B19/0066 , G02B19/0028 , G02B19/0071 , H01L24/73 , H01L24/97 , H01L33/46 , H01L33/507 , H01L33/54 , H01L33/58 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/12041 , H01L2924/15787 , H01L2924/1815 , H01L2924/19107 , H05K3/284 , H05K2201/10106 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).
摘要翻译：一个或多个LED骰子安装在支撑结构上。支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。模具中的凹槽对应于支撑结构上的LED骰子的位置。凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。压痕的形状将是镜片的形状。模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。然后将模具加热以固化（硬化）硅树脂。然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。可以用不同的模具重复该过模制过程以产生透镜的同心壳。每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

6. 发明授权

US07682850B2 White LED for backlight with phosphor plates 有权
标题翻译：白色LED用于带荧光板的背光
公开(公告)号：US07682850B2
公开(公告)日：2010-03-23
申请号：US11378812
申请日：2006-03-17
申请人： Gerard Harbers , Serge Bierhuizen , Mark Pugh
发明人： Gerard Harbers , Serge Bierhuizen , Mark Pugh
IPC分类号： H01L21/00
CPC分类号： H01L33/505 , C09K11/7774 , G02F1/133603 , G02F2001/133614 , H01L33/504 , H01L2224/16225 , H01L2933/0041 , Y02B20/181
摘要： A white light LED for use in backlighting or otherwise illuminating an LCD is described where the white light LED comprises a blue LED over which is affixed a preformed red phosphor platelet and a preformed green phosphor platelet. In one embodiment, to form a platelet, a controlled amount of phosphor powder is placed in a mold and heated under pressure to sinter the grains together. The platelet can be made very smooth on all surfaces. A UV LED may also be used in conjunction with red, green, and blue phosphor plates. The LED dies vary in color and brightness and are binned in accordance with their light output characteristics. Phosphor plates with different characteristics are matched to the binned LEDs to create white light LEDs with a consistent white point for use in backlights for liquid crystal displays.
摘要翻译：描述了用于背光或以其他方式照明LCD的白光LED，其中白光LED包括蓝色LED，其上附着预先形成的红色荧光体片和预制的绿色荧光体片。在一个实施方案中，为了形成血小板，将受控量的荧光体粉末放置在模具中并在压力下加热以将颗粒烧结在一起。血小板可以在所有表面上非常光滑。 UV LED也可以与红色，绿色和蓝色荧光体板一起使用。 LED管芯的颜色和亮度不同，并根据其光输出特性进行分样。具有不同特性的荧光板与分箱LED匹配，以创建白光LED，并具有用于液晶显示器背光源的一致白点。

7. 发明授权

US07626210B2 Low profile side emitting LED 有权
标题翻译：薄型侧发光LED
公开(公告)号：US07626210B2
公开(公告)日：2009-12-01
申请号：US11423419
申请日：2006-06-09
申请人： Oleg Borisovich Shchekin , Mark Pugh , Gerard Harbers , Michael R. Krames , John E. Epler
发明人： Oleg Borisovich Shchekin , Mark Pugh , Gerard Harbers , Michael R. Krames , John E. Epler
IPC分类号： H01L29/20
CPC分类号： H01L33/50 , H01L33/22 , H01L33/38 , H01L33/46 , H01L33/60 , H01L2224/13
摘要： Low profile, side-emitting LEDs are described, where all light is efficiently emitted within a relatively narrow angle generally parallel to the surface of the light-generating active layer. The LEDs enable the creation of very thin backlights for backlighting an LCD. In one embodiment, the LED is a flip chip with the n and p electrodes on the same side of the LED, and the LED is mounted electrode-side down on a submount. A reflector is provided on the top surface of the LED so that light impinging on the reflector is reflected back toward the active layer and eventually exits through a side surface of the LED. A waveguide layer and/or one or more phosphors layers are deposed between the semiconductor layers and the reflector for increasing the side emission area for increased efficiency. Side-emitting LEDs with a thickness of between 0.2-0.4 mm can be created.
摘要翻译：描述了低侧面发光LED，其中所有光在与发光有源层的表面大致平行的相对窄的角度内被有效地发射。 LED使得能够创建非常薄的背光用于背光LCD。在一个实施例中，LED是倒装芯片，其中n和p电极位于LED的同一侧，并且LED电极侧朝下安装在底座上。在LED的顶表面上提供反射器，使得入射在反射器上的光被反射回有源层，最终通过LED的侧表面离开。在半导体层和反射器之间布置波导层和/或一个或多个磷光体层以增加侧面发射面积以提高效率。可以产生厚度在0.2-0.4mm之间的侧面发射LED。

8. 发明申请

US20080315228A1 LOW PROFILE SIDE EMITTING LED WITH WINDOW LAYER AND PHOSPHOR LAYER 有权
标题翻译：具有窗户层和磷光体层的低剖面发光LED
公开(公告)号：US20080315228A1
公开(公告)日：2008-12-25
申请号：US11954712
申请日：2007-12-12
申请人： Michael R. Krames , Gerd Mueller , Oleg Borisovich Shchekin , Mark Pugh , Gerard Harbers , John E. Epler , Serge Bierhuizen , Regina Mueller-Mach
发明人： Michael R. Krames , Gerd Mueller , Oleg Borisovich Shchekin , Mark Pugh , Gerard Harbers , John E. Epler , Serge Bierhuizen , Regina Mueller-Mach
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L33/385 , H01L33/405 , H01L33/46 , H01L33/60 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/13 , H01L2924/00014 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Low profile, side-emitting LEDs are described that generate white light, where all light is emitted within a relatively narrow angle generally parallel to the surface of the light-generating active layer. The LEDs enable the creation of very thin backlights for backlighting an LCD. In one embodiment, the LED emits blue light and is a flip chip with the n and p electrodes on the same side of the LED. Separately from the LED, a transparent wafer has deposited on it a red and green phosphor layer. The phosphor color temperature emission is tested, and the color temperatures vs. positions along the wafer are mapped. A reflector is formed over the transparent wafer. The transparent wafer is singulated, and the phosphor/window dice are matched with the blue LEDs to achieve a target white light color temperature. The phosphor/window is then affixed to the LED.
摘要翻译：描述了产生白光的低轮廓侧面发射LED，其中所有光在通常平行于发光有源层的表面的相对窄的角度内发射。 LED使得能够创建非常薄的背光用于背光LCD。在一个实施例中，LED发射蓝光，并且是LED和LED的同一侧上的n和p电极的倒装芯片。与LED分开，透明晶片在其上沉积有红色和绿色磷光体层。测试荧光体色温发射，并且映射色温与晶片上的位置。在透明晶片上形成反射器。将透明晶片分离，并将荧光体/窗口骰子与蓝色LED匹配以实现目标白光色温。然后将磷光体/窗口固定到LED。

9. 发明申请

US20070284600A1 Low Profile Side Emitting LED 有权
标题翻译：低边侧发光LED
公开(公告)号：US20070284600A1
公开(公告)日：2007-12-13
申请号：US11423419
申请日：2006-06-09
申请人： Oleg Borisovich Shchekin , Mark Pugh , Gerard Harbers , Michael R. Krames , John E. Epler
发明人： Oleg Borisovich Shchekin , Mark Pugh , Gerard Harbers , Michael R. Krames , John E. Epler
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L33/22 , H01L33/38 , H01L33/46 , H01L33/60 , H01L2224/13
摘要： Low profile, side-emitting LEDs are described, where all light is efficiently emitted within a relatively narrow angle generally parallel to the surface of the light-generating active layer. The LEDs enable the creation of very thin backlights for backlighting an LCD. In one embodiment, the LED is a flip chip with the n and p electrodes on the same side of the LED, and the LED is mounted electrode-side down on a submount. A reflector is provided on the top surface of the LED so that light impinging on the reflector is reflected back toward the active layer and eventually exits through a side surface of the LED. A waveguide layer and/or one or more phosphors layers are deposed between the semiconductor layers and the reflector for increasing the side emission area for increased efficiency. Side-emitting LEDs with a thickness of between 0.2-0.4 mm can be created.
摘要翻译：描述了低侧面发光LED，其中所有光在与发光有源层的表面大致平行的相对窄的角度内被有效地发射。 LED使得能够创建非常薄的背光用于背光LCD。在一个实施例中，LED是倒装芯片，其中n和p电极位于LED的同一侧，并且LED电极侧朝下安装在底座上。在LED的顶表面上提供反射器，使得入射在反射器上的光被反射回有源层，最终通过LED的侧表面离开。在半导体层和反射器之间布置波导层和/或一个或多个磷光体层以增加侧面发射面积以提高效率。可以产生厚度在0.2-0.4mm之间的侧面发射LED。

10. 发明申请

US20070138494A1 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US20070138494A1
公开(公告)日：2007-06-21
申请号：US11313120
申请日：2005-12-19
申请人： Mark Pugh , Gerard Harbers , Robert West
发明人： Mark Pugh , Gerard Harbers , Robert West
IPC分类号： H01L33/00
CPC分类号： G02B6/0021 , G02B6/0073 , H01L33/405 , H01L33/46 , H01L33/465 , H01L33/505 , H01L33/60
摘要： The invention provides a light-emitting device and a method of illumination. The light-emitting device includes one or more semiconductor layers, a reflective bottom surface, and a top surface coupled to semiconductor layer. The semiconductor layers include an active region where a primary light is generated. The relative position of the top surface, the reflective bottom surface and the active region is adjusted to substantially transmit the primary light through the sides of the light-emitting device.
摘要翻译：本发明提供一种发光装置和照明方法。发光器件包括一个或多个半导体层，反射底表面和耦合到半导体层的顶表面。半导体层包括产生初级光的有源区。顶表面，反射底表面和有源区域的相对位置被调节以基本上透过发光器件侧面的初级光。

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