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    • 1. 发明授权
    • Low profile side emitting LED
    • 薄型侧发光LED
    • US07626210B2
    • 2009-12-01
    • US11423419
    • 2006-06-09
    • Oleg Borisovich ShchekinMark PughGerard HarbersMichael R. KramesJohn E. Epler
    • Oleg Borisovich ShchekinMark PughGerard HarbersMichael R. KramesJohn E. Epler
    • H01L29/20
    • H01L33/50H01L33/22H01L33/38H01L33/46H01L33/60H01L2224/13
    • Low profile, side-emitting LEDs are described, where all light is efficiently emitted within a relatively narrow angle generally parallel to the surface of the light-generating active layer. The LEDs enable the creation of very thin backlights for backlighting an LCD. In one embodiment, the LED is a flip chip with the n and p electrodes on the same side of the LED, and the LED is mounted electrode-side down on a submount. A reflector is provided on the top surface of the LED so that light impinging on the reflector is reflected back toward the active layer and eventually exits through a side surface of the LED. A waveguide layer and/or one or more phosphors layers are deposed between the semiconductor layers and the reflector for increasing the side emission area for increased efficiency. Side-emitting LEDs with a thickness of between 0.2-0.4 mm can be created.
    • 描述了低侧面发光LED,其中所有光在与发光有源层的表面大致平行的相对窄的角度内被有效地发射。 LED使得能够创建非常薄的背光用于背光LCD。 在一个实施例中,LED是倒装芯片,其中n和p电极位于LED的同一侧,并且LED电极侧朝下安装在底座上。 在LED的顶表面上提供反射器,使得入射在反射器上的光被反射回有源层,最终通过LED的侧表面离开。 在半导体层和反射器之间布置波导层和/或一个或多个磷光体层以增加侧面发射面积以提高效率。 可以产生厚度在0.2-0.4mm之间的侧面发射LED。