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    • 5. 发明申请
    • Method for making filled epoxy resin compositions
    • 填充环氧树脂组合物的制备方法
    • US20060083851A1
    • 2006-04-20
    • US10967646
    • 2004-10-14
    • Yongan YanDouglas MeyersMark MorrisD. MeixnerSatyabrata Raychaudhuri
    • Yongan YanDouglas MeyersMark MorrisD. MeixnerSatyabrata Raychaudhuri
    • H05K3/00B05D5/12
    • C08G59/24C08G59/4215C08G59/688C08K9/06C08L63/00Y10T428/31511
    • An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.
    • 对于光电器件或光学部件描述了一种密封剂,其提供小于50ppm /℃的热膨胀系数,其变化小于±30%,并进一步提供至少20%的光透射率, 在400至900nm范围内的波长处,密封剂厚度约为1mm。 密封剂包括基本上由直径小于500μm的玻璃颗粒组成的填料,其基本上不含二氧化钛和氧化铅,并且折射率在1.48至1.60范围内,其变化小于约0.001。 还描述了制造密封剂的方法,该方法包括以下步骤:(1)处理玻璃以形成直径在1至500μm之间的颗粒;(2)制备环氧树脂组合物,其在固化阶段的折射率接近 (3)将环氧树脂组合物与填料颗粒混合以形成填充的环氧树脂组合物,(4)用填充的环氧树脂组合物封装光电器件,和(5)固化填充的环氧树脂 组成。