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1. 发明授权

US5166036A Electrodeposition coating composition and image-forming method using the same 失效
标题翻译：电沉积涂料组合物和使用其的成像方法
公开(公告)号：US5166036A
公开(公告)日：1992-11-24
申请号：US727523
申请日：1991-07-09
申请人： Mamoru Seio , Takeshi Ikeda , Kanji Nishijima , Katsukiyo Ishikawa
发明人： Mamoru Seio , Takeshi Ikeda , Kanji Nishijima , Katsukiyo Ishikawa
IPC分类号： G03F7/023 , G03F7/16
CPC分类号： G03F7/164 , G03F7/0233 , Y10S430/136
摘要： The invention provides an aqueous electrodeposition coating composition for a positive working resist and an image-forming method using the same. The coating composition is very stable under storage conditions and is capable of resulting in a positive working resist which is specifically useful in the preparation of a printed circuit board with mini-via-holes.
摘要翻译：本发明提供了一种用于正性抗蚀剂的水性电沉积涂料组合物和使用其的成像方法。涂料组合物在储存条件下非常稳定，并且能够产生正工作抗蚀剂，其特别可用于制备具有微通孔的印刷电路板。

2. 发明授权

US5055374A Electrodeposition coating composition containing an acrylic resin and a quinnone diazide group bearing resin 失效
标题翻译：含有丙烯酸树脂和二烯基双组份轴承树脂的电沉积涂料组合物
公开(公告)号：US5055374A
公开(公告)日：1991-10-08
申请号：US388471
申请日：1989-08-02
申请人： Mamoru Seio , Takeshi Ikeda , Kanji Nishijima , Katsukiyo Ishikawa
发明人： Mamoru Seio , Takeshi Ikeda , Kanji Nishijima , Katsukiyo Ishikawa
IPC分类号： G03F7/022 , G03F7/023 , G03F7/16 , H05K3/06
CPC分类号： G03F7/164 , G03F7/0233
摘要： The invention provides an aqueous electrodeposition coating composition for a positive working resist and an image-forming method using the same. The coating composition is very stable under storage conditions and is capable of resulting in a positive working resist which is specifically useful in the preparation of a printed circuit board with mini-via-holes.

3. 发明授权

US4999274A Positive type photosensitive resinous composition with 1,2 quinone diazide sulfonyl unit 失效
标题翻译：具有1,2-醌二叠氮基磺酰基单元的正型感光性树脂组合物
公开(公告)号：US4999274A
公开(公告)日：1991-03-12
申请号：US255193
申请日：1988-10-27
申请人： Mamoru Seio , Kanji Nishijima , Katsukiyo Ishikawa
发明人： Mamoru Seio , Kanji Nishijima , Katsukiyo Ishikawa
IPC分类号： G03C1/72 , C08G59/14 , C08G59/42 , C08G59/62 , G03F7/023
CPC分类号： G03F7/0233
摘要： The invention provides a positive type photosensitive resinous composition comprising a resin obtained by the reaction of a polyepoxide compound, an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) and 1,2-quinondiazido sulfonic acid halide with the use of those three components in a defined proportion, which is useful for microfabrication photo-resist and photosensitive materials for use in lithographic plates because of excellent flexibility and adhesion to supporting substrates, when developed, non-exposed area are extremely resistive toward swelling.

4. 发明授权

US4671854A Method for preparing a printed circuit board with solder plated circuit and through-holes 失效
标题翻译：制备具有焊料电路和通孔的印刷电路板的方法
公开(公告)号：US4671854A
公开(公告)日：1987-06-09
申请号：US855362
申请日：1986-04-24
申请人： Katsukiyo Ishikawa , Kanji Nishijima , Mamoru Seio
发明人： Katsukiyo Ishikawa , Kanji Nishijima , Mamoru Seio
IPC分类号： H05K3/42 , G03F7/004 , G03F7/16 , H05K3/06 , H05K3/10 , H05K3/34 , C23F1/02 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： G03F7/164 , G03F7/004 , H05K3/062 , H05K3/108 , H05K2203/0793 , H05K2203/135 , H05K3/3473 , H05K3/427 , Y10T29/49165
摘要： The invention provides a method for preparing a printed circuit board with solder plated circuit and through-holes, using a specifically prepared photoresist material and a combination of exposure, development, solder plating and etching means.This method is particularly useful for the preparation of a printed circuit-board with solder plated circuit and through-holes bearing a high density circuit pattern.
摘要翻译：本发明提供一种使用特定制备的光致抗蚀剂材料以及曝光，显影，焊料镀覆和蚀刻装置的组合制备具有焊料电镀电路和通孔的印刷电路板的方法。该方法对于制备具有焊接电路的印刷电路板和具有高密度电路图案的通孔特别有用。

5. 发明授权

US4946757A Positive type 1,2 quinone diazide containing photosensitive resinous composition with acrylic copolymer resin 失效
标题翻译：含有丙烯酸共聚物树脂的含有感光性树脂组合物的正型1,2醌二叠氮化物
公开(公告)号：US4946757A
公开(公告)日：1990-08-07
申请号：US255191
申请日：1988-10-27
申请人： Mamoru Seio , Kanji Nishijima , Katsukiyo Ishikawa
发明人： Mamoru Seio , Kanji Nishijima , Katsukiyo Ishikawa
IPC分类号： G03C1/72 , C08G59/62 , C08G59/68 , G03F7/022 , G03F7/023 , G03F7/032 , G03F7/033
CPC分类号： G03F7/0233
摘要： The invention provides a photosensitive resin composition specifically useful for microfabrication resist films and photosensitive materials for use in lithographic plates because of excellent flexibility and adhesion, and moreover, when developed, non-exposed parts being of extremely less swelling nature.

6. 再颁专利

USRE33108E Method for preparing a printed circuit board 失效
标题翻译：印刷电路板的制备方法
公开(公告)号：USRE33108E
公开(公告)日：1989-11-07
申请号：US271710
申请日：1988-11-16
申请人： Katsukiyo Ishikawa , Kanji Nishijima , Mamoru Seio
发明人： Katsukiyo Ishikawa , Kanji Nishijima , Mamoru Seio
IPC分类号： G03F7/16 , H05K3/06
CPC分类号： H05K3/064 , G03F7/164 , H05K2203/135 , Y10T29/49165
摘要： The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.

7. 发明授权

US4673458A Method for preparing a printed circuit board 失效
标题翻译：印刷电路板的制备方法
公开(公告)号：US4673458A
公开(公告)日：1987-06-16
申请号：US837767
申请日：1986-03-10
申请人： Katsukiyo Ishikawa , Kanji Nishijima , Mamoru Seio
发明人： Katsukiyo Ishikawa , Kanji Nishijima , Mamoru Seio
IPC分类号： G03F7/16 , H05K3/06 , C23F1/02 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H05K3/064 , G03F7/164 , H05K2203/135 , Y10T29/49165
摘要： The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.
摘要翻译：本发明提供了使用特定制备的光致抗蚀剂材料以及曝光，显影和蚀刻装置的组合来制备具有电镀通孔的印刷电路板的方法。该方法对于制备具有高密度电路图案的电镀通孔的印刷电路板特别有用。

8. 发明授权

US5474666A Method of treating an electrodeposited photosensitive resist to reduce water spotting 失效
标题翻译：处理电沉积光敏抗蚀剂以减少水斑的方法
公开(公告)号：US5474666A
公开(公告)日：1995-12-12
申请号：US156722
申请日：1993-11-24
申请人： Mamoru Seio , Kazuyuki Suga , Kanji Nishijima
发明人： Mamoru Seio , Kazuyuki Suga , Kanji Nishijima
IPC分类号： H05K3/06 , G03F7/16 , H05K3/00 , C25D5/48 , C25D13/06
CPC分类号： H05K3/0073 , G03F7/164 , G03F7/168 , H05K2203/122 , H05K2203/135 , Y10S205/92
摘要： Water spotting which occurs during rinsing of an electrodeposited photosensitive resist composition on a copper layer of a printed circuit board is reduced by applying an aqueous solution containing a surfactant. The surfactant is preferably a salt of an acylated polypeptide which is solid at ambient room temperature and forms a thin uniform film when the solution is dried.
摘要翻译：通过涂布含有表面活性剂的水溶液来减少在印刷电路板的铜层上漂洗电沉积光敏抗蚀剂组合物时发生的水斑。表面活性剂优选是酰化多肽的盐，其在环境室温下为固体，并且当溶液干燥时形成薄均匀的膜。

9. 发明授权

US5232816A Positive type photosensitive resinous composition comprising a resin copolymer having at least a phosphoric acid ester monomer 失效
标题翻译：含有至少一种磷酸酯单体的树脂共聚物的正型型感光性树脂组合物
公开(公告)号：US5232816A
公开(公告)日：1993-08-03
申请号：US575651
申请日：1990-08-31
申请人： Mamoru Seio , Takeshi Ikeda , Kiyomi Sakurai
发明人： Mamoru Seio , Takeshi Ikeda , Kiyomi Sakurai
IPC分类号： G03F7/039 , C08K3/10 , C08L33/14 , G03F7/023
CPC分类号： G03F7/0233 , Y10S430/107 , Y10S430/111
摘要： A positive type photosensitive resinous composition comprising a binder resin and a quinone diazide compound, the binder resin being a copolymer of(a) at least one phosphoric acid ester monomer represented by the formula: ##STR1## (b) at least one acid group containing .alpha.,.beta.-ethylenically unsaturated monomer, and(c) other copolymerizable .alpha.,.beta.-ethylenically unsaturated monomers than (a) and (b), which is specifically useful for the formation of resist coating in the preparation of printed circuit board.

10. 发明授权

US5368884A Method of forming solder mask 失效
标题翻译：形成焊接掩模的方法
公开(公告)号：US5368884A
公开(公告)日：1994-11-29
申请号：US118231
申请日：1993-09-09
申请人： Yoshikazu Yamagami , Akio Kashihara , Mamoru Seio , Hisaki Tanabe
发明人： Yoshikazu Yamagami , Akio Kashihara , Mamoru Seio , Hisaki Tanabe
IPC分类号： G03F7/16 , H05K3/00 , H05K3/28 , B05D1/00
CPC分类号： G03F7/164 , H05K3/28 , H05K2203/1105 , H05K2203/1355 , H05K3/0079
摘要： The present invention has as its object providing a solder mask which permits high density mounting, is suitable for protecting conductor circuits, particularly has mask thickness on the circuit parts and each edge part of the circuits which make almost no difference from those on other parts, and is excellent in electrical insulation, heat resistance and solvent resistance.This invention provides a method of forming a solder mask for printed circuit boards, using any powder paint which is curable by both irradiation of ultraviolet ray and heat, comprising:(1) a step of coating the powder paint on a printed circuit board, while holding it at a temperature higher than a softening point of the powder paint,(2) a step of irradiating ultraviolet rays thereon through a pattern mask,(3) a step of making development with a medium which dissolves the region not irradiated by ultraviolet rays and,(4) a step of completely curing the coating part developed on the printed circuit board at a temperature higher than the curing temperature of the powder paint.
摘要翻译：本发明的目的是提供一种允许高密度安装的焊接掩模，适用于保护导体电路，特别是在电路部件和电路的每个边缘部分具有掩模厚度，与其它部件几乎没有区别，电绝缘性，耐热性和耐溶剂性优异。本发明提供一种形成印刷电路板用焊料掩模的方法，使用可通过紫外线照射和热照射两者固化的任何粉末涂料，其包括：（1）在粉末涂料上涂布印刷电路板的步骤，同时将其保持在高于粉末涂料的软化点的温度下，（2）通过图案掩模在其上照射紫外线的步骤，（3）利用溶解未被紫外线照射的区域的介质进行显影的步骤和（4）在高于粉末涂料的固化温度的温度下完全固化在印刷电路板上显影的涂层部分的步骤。

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