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    • 2. 发明授权
    • Semiconductor memory device having cylindrical capacitors
    • 具有圆柱形电容器的半导体存储器件
    • US5629539A
    • 1997-05-13
    • US400887
    • 1995-03-08
    • Masami AokiTohru OzakiTakashi YamadaHitomi Kawaguchiya
    • Masami AokiTohru OzakiTakashi YamadaHitomi Kawaguchiya
    • H01L21/8242H01L27/108H01L29/94H01L31/119
    • H01L27/10852H01L27/10817H01L29/94
    • A semiconductor memory device comprises a semiconductor substrate, a plurality of memory cells including a plurality of MOS transistors, each having a source, a drain and a gate, and a plurality of capacitors formed on the semiconductor substrate in a matrix manner, an interlayer insulating film formed on the memory cells and having a plurality of openings selectively formed, a plurality of plug electrodes formed in the openings of the interlayer insulating film, a plurality of bit lines, each bit line being connected to one of the source and the drain of each of the MOS transistors through a corresponding one of the plug electrodes, and a plurality word lines, each word line being the gate of each of the MOS transistors. The capacitors each comprise a storage node electrode having a cylindrical portion layered on another one of the source and the drain of each of the MOS transistors, a capacitor dielectric film formed on the storage node electrode, and a plate electrode formed to be opposed to at least the storage node electrode interposing the capacitor dielectric film therebetween. The bit lines are formed on the interlayer insulating film and connected to the upper surface of the plug electrode. The plug electrode has a pad electrode comprised of a lower side conductive member formed with a same layer as the storage node electrode and a cylindrical side wall conductive member, and an upper side conductive member formed on the pad electrode.
    • 半导体存储器件包括半导体衬底,包括多个MOS晶体管的多个存储单元,每个MOS晶体管具有源极,漏极和栅极以及以矩阵方式形成在半导体衬底上的多个电容器,层间绝缘 形成在存储单元上并具有选择性地形成的多个开口的多个插塞电极,形成在层间绝缘膜的开口中的多个插塞电极,多个位线,每个位线连接到源极和漏极之一 每个MOS晶体管通过相应的一个插头电极和多个字线,每个字线是每个MOS晶体管的栅极。 电容器各自包括存储节点电极,其具有层叠在每个MOS晶体管的源极和漏极的另一个上的圆柱形部分,形成在存储节点电极上的电容器电介质膜和形成为与 存储节点电极至少插入电容器电介质膜之间。 位线形成在层间绝缘膜上并连接到插塞电极的上表面。 插头电极具有由形成有与蓄电节点电极相同层的下侧导电部件和圆筒状侧壁导电部件构成的焊盘电极,以及形成在焊盘电极上的上侧导电部件。
    • 3. 发明授权
    • Dynamic random access memory device with the combined open/folded
bit-line pair arrangement
    • 具有组合打开/折叠位线对布置的动态随机存取存储器件
    • US5838038A
    • 1998-11-17
    • US478620
    • 1995-06-07
    • Daisaburo TakashimaShigeyoshi WatanabeTohru OzakiTakeshi HamamotoYukihito Oowaki
    • Daisaburo TakashimaShigeyoshi WatanabeTohru OzakiTakeshi HamamotoYukihito Oowaki
    • G11C7/18H01L27/108
    • G11C7/18G11C2211/4013
    • A semiconductor memory device includes active regions arranged on a semiconductor substrate such that those of the active regions which are adjacent in the word line direction deviate in the bit line direction, MOS transistors respectively formed in the active regions and each having a source and a drain one of which is connected to the bit line, a plurality of trenches each arranged to another set of source an drain regions and arranged to deviate in the word line direction in the respective active regions, those of the trenches which are adjacent with a through word line disposed therebetween being arranged to deviate in the bit line direction so as to be set closer to each other, a plurality of storage electrodes respectively formed in the trenches with capacitor insulative films disposed therebetween, and connection electrodes arranged between the word lines and each connecting the other of the source and drain to the storage electrode.
    • 半导体存储器件包括布置在半导体衬底上的有源区域,使得在字线方向上相邻的有源区域在位线方向偏离的有源区域分别形成在有源区域中并且各自具有源极和漏极 其中一个连接到位线,多个沟槽,每个沟槽被布置成另一组源极漏极区域,并且被布置成在相应的有源区域中的字线方向偏离,与通过字相邻的沟槽的那些沟槽 配置在它们之间的线被布置为在位线方向上偏离以使得彼此更靠近,分别形成在沟槽中的多个存储电极,其中设置有电容器绝缘膜,以及布置在字线和每个连接之间的连接电极 另一个源极和漏极到存储电极。
    • 8. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US06448618B1
    • 2002-09-10
    • US09640707
    • 2000-08-18
    • Satoshi InabaTohru OzakiYusuke KohyamaKazumesa Sunouchi
    • Satoshi InabaTohru OzakiYusuke KohyamaKazumesa Sunouchi
    • H01L27108
    • H01L27/10844H01L27/105H01L27/108Y10S257/90
    • In a DRAM, a plurality of first MOSFETs are formed in a cell region on a semiconductor substrate based on the minimum design rule, and a first gate side-wall having a side-wall insulation film is formed on the side-wall portion of a first gate electrode of each of the first MOSFETs. At least one second MOSFET is formed in a peripheral circuit region on the semiconductor substrate, and a second gate side-wall having side-wall insulation films is formed on the side-wall portion of a second gate electrode of the second MOSFET. Both the first MOSFETs, which is capable of forming a fine contact hole self-aligned with the first gate electrode, and the second MOSFET, which is capable of sufficiently mitigating the parasitic resistance while suppressing the short channel effect, can be formed on the same substrate.
    • 在DRAM中,基于最小设计规则,在半导体衬底上的单元区域中形成多个第一MOSFET,并且在侧壁部分上形成具有侧壁绝缘膜的第一栅极侧壁 每个第一MOSFET的第一栅电极。 在半导体衬底上的外围电路区域中形成至少一个第二MOSFET,并且在第二MOSFET的第二栅电极的侧壁部分上形成具有侧壁绝缘膜的第二栅极侧壁。 能够形成与第一栅电极自对准的精细接触孔的第一MOSFET和能够在抑制短沟道效应的同时充分减轻寄生电阻的第二MOSFET同时形成 基质。