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    • 3. 发明授权
    • Method of recognizing characters
    • 识别字符的方法
    • US06549662B1
    • 2003-04-15
    • US09084356
    • 1998-05-27
    • Katsutoshi KobaraShinichi EguchiYoshihiro NaganoHideki MatsunoKoichi ChibaYutaka Katsumata
    • Katsutoshi KobaraShinichi EguchiYoshihiro NaganoHideki MatsunoKoichi ChibaYutaka Katsumata
    • G06K934
    • G06K9/00469
    • Characters of data on a document are recognized by automatically determining the definitions of characters of the data from the arrangement of character strings of the data. Character strings on the document are extracted by reading the document, and headers and data on the document are distinguished from each other by determining the positional relationship between the character strings. Character attributes of the data are determined by recognizing characters of the character strings of the headers using a header recognition dictionary. Characters of the character strings of the data are recognized according to the determined character attributes of the data. Since character attributes of the data are determined from recognized characters of the headers after the headers and the data are distinguished from each other from the layout on the document, it is possible to enter automatically the character attributes of the data.
    • 通过从数据的字符串的排列自动确定数据的字符的定义来识别文档上的数据的字符。 通过读取文档来提取文档上的字符串,并且通过确定字符串之间的位置关系来区分文档上的标题和数据。 通过使用标题识别字典识别标题的字符串的字符来确定数据的字符属性。 根据确定的数据的字符属性来识别数据的字符串的字符。 由于数据的字符属性是从头文件的标识符和数据从文档的布局彼此区分开来的识别字符确定的,所以可以自动输入数据的字符属性。
    • 7. 发明授权
    • Method for soldering electronic component
    • 电子元器件焊接方法
    • US4979290A
    • 1990-12-25
    • US236979
    • 1988-08-26
    • Koichi Chiba
    • Koichi Chiba
    • B23K1/005B23K26/10H05K3/34H05K13/04
    • B23K26/10B23K1/0056H05K13/0413H05K13/0465H05K3/3421B23K2201/42H05K2201/10689H05K2201/10984H05K2203/107H05K3/3494Y02P70/613Y10T29/49131Y10T29/49144
    • A soldering method wherein a high-energy beam such as a laser beam is projected onto different lead terminal arrays of electronic components, the beam being projected in a scanning manner a plurality of times two-dimensionally and continuously is described. The invention further relates to a soldering apparatus comprising a mechanism for holding an electronic component by the tip thereof, a rotary drive mechanism (27) which turns the electronic component holding mechanism so that the position of the electronic component in the rotational direction is brought into agreement with a practical mounting position on the circuit board, holding unit-drive mechanisms (21, 22, 25) that move the electronic component-holding mechanism three-dimensionally, beam radiation mechanisms (41, 42) for irradiating the surface of the circuit board with high energy, beam radiation angle change mechanisms (53, 54) for changing the radiation angle of the high-energy beam emitted from the beam radiation mechanisms relative to the circuit board, and a beam scanning controller (47) which controls the beam radiation angle change mechanisms such that the high-energy beam scans a predetermined lead terminal array of the electronic components mounted on the circuit board a predetermined number of times. Using this apparatus, the soldering is effected under conditions where the temperature rise near the lead terminals and the temperature distribution are made uniform.
    • PCT No.PCT / JP87 / 01049 Sec。 371日期1988年8月26日 102(e)日期1988年8月26日PCT提交1987年12月28日PCT公布。 出版物WO88 / 05250 日期1988年7月14日。一种焊接方法,其中将诸如激光束的高能束投影到电子部件的不同引线端子阵列上,所述光束以扫描方式多次二维连续地投影 描述。 本发明还涉及一种焊接装置,其特征在于,包括用于通过其顶端保持电子部件的机构,旋转驱动机构(27),该旋转驱动机构使电子部件保持机构转动,使得电子部件沿旋转方向的位置进入 与电路板上的实际安装位​​置一致,保持用于三维地移动电子部件保持机构的保持单元驱动机构(21,22,25),用于照射电路表面的光束辐射机构(41,42) 具有高能量的光束辐射角度变化机构(53,54),用于改变从光束辐射机构相对于电路板发射的高能束的辐射角;以及光束扫描控制器(47),其控制光束 辐射角度改变机构,使得高能束扫描安装在电路公猪上的电子部件的预定引线端子阵列 d预定次数。 使用该装置,在引线端子附近的温度升高和温度分布均匀的条件下进行焊接。