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1. 发明申请

US20130062994A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20130062994A1
公开(公告)日：2013-03-14
申请号：US13411863
申请日：2012-03-05
申请人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Wataru OGAWA
发明人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Wataru OGAWA
IPC分类号： H01G4/12 , B32B38/00 , H01F5/00 , H01L41/00 , H01C7/13
CPC分类号： H01G4/30 , H01C7/13 , H01C7/18 , H01F17/0013 , H01F27/292 , H01G4/12 , H01G4/2325
摘要： A method for manufacturing a laminated ceramic electronic component enables formation of a plating film as at least a portion of an external electrode which connects exposed ends of internal electrodes. A component main body including a plurality of ceramic layers and a plurality of internal electrodes partially exposed from the component main body is prepared such that the component main body has a conductive region formed by diffusion of a conductive component included in the internal electrodes at the end surfaces of the ceramic layers located between adjacent exposed ends of the plurality of internal electrodes. The ceramic layers are preferably composed of a glass ceramic containing a glass component of about 10 weight % or more. A plating film is formed directly on the component main body by growing the exposed ends of the internal electrodes and the conductive region as nucleuses for plating deposition.
摘要翻译：层叠陶瓷电子部件的制造方法能够形成作为连接内部电极的露出端的外部电极的至少一部分的电镀膜。制备包括多个陶瓷层和从部件主体部分露出的多个内部电极的部件主体，使得部件主体具有由末端包括在内部电极中的导电部件的扩散形成的导电区域位于多个内部电极的相邻的露出端之间的陶瓷层的表面。陶瓷层优选由含有约10重量％以上的玻璃成分的玻璃陶瓷构成。通过使内部电极和导电区域的露出端生长成电镀沉积的核，直接在部件主体上形成镀膜。

2. 发明申请

US20120194031A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20120194031A1
公开(公告)日：2012-08-02
申请号：US13359519
申请日：2012-01-27
申请人： Wataru OGAWA , Makoto OGAWA , Masahito SARUBAN , Toshiyuki IWANAGA , Akihiro MOTOKI
发明人： Wataru OGAWA , Makoto OGAWA , Masahito SARUBAN , Toshiyuki IWANAGA , Akihiro MOTOKI
IPC分类号： H01L41/00 , H01F5/00 , B05D3/10 , H01C7/10 , B05D5/12 , H01G4/12 , H01C7/13
CPC分类号： H01G4/30 , H01G4/005 , H01G4/232
摘要： In a method of forming an external electrode by growing plated depositions on exposed ends of a plurality of internal electrodes in a component main body, the component main body is polished to increase exposure of the internal electrodes. To prevent decreased external electrode fixing strength, a radius of curvature is reduced to about 0.01 mm or less for an R chamfered section formed in a ridge section of the component main body during polishing by ion milling, and exposed ends of the internal electrodes are recessed from end surfaces of the component main body with a recess length of about 1 μm or less. Plating films to serve as external electrodes are formed to extend from the end surfaces of the component main body across the R chamfered section, and include end edges located on at least one of the principal surfaces and the side surfaces.
摘要翻译：在通过在组件主体中的多个内部电极的露出端上生长镀覆形成外部电极的方法中，抛光组件主体以增加内部电极的曝光。为了防止外部电极固定强度的降低，在通过离子铣削抛光时，在形成于部件主体的脊部的R倒角部分的曲率半径减小到约0.01mm以下，内部电极的露出端凹入从组件主体的端面大致为1μm以下的凹部。形成为用作外部电极的电镀膜，从组件主体的端面延伸穿过R倒角部分，并且包括位于至少一个主表面和侧表面上的端边缘。

3. 发明申请

US20120169180A1 LAMINATE TYPE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压型电子元件及其制造方法
公开(公告)号：US20120169180A1
公开(公告)日：2012-07-05
申请号：US13337445
申请日：2011-12-27
申请人： Masahito SARUBAN , Makoto OGAWA , Wataru OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Yoji YAMAMOTO
发明人： Masahito SARUBAN , Makoto OGAWA , Wataru OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Yoji YAMAMOTO
IPC分类号： H01L41/00 , H01F5/00 , B05D3/02 , H01C7/10 , B05D5/12 , H01G4/12 , H01C7/13
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30
摘要： In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.
摘要翻译：在层压型电子部件的制造方法中，在通过使成膜主体中的多个内部电极的露出端上沉积的镀层析出来形成至少部分地限定外部电极的镀膜之后进行热处理电镀膜的存在不仅可以干扰湿气的释放，而且还可能导致镀膜中的起泡或凸起缺陷，同时通过蒸发除去组分主体中的电镀溶液等水分。为了避免这种问题，在内部电极的延伸部分中形成将暴露端分割为多个部分的切割。因此，电镀膜包括在与切口的位置相对应的位置沿堆叠方向延伸的狭缝。

4. 发明申请

US20100302704A1 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20100302704A1
公开(公告)日：2010-12-02
申请号：US12788340
申请日：2010-05-27
申请人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
IPC分类号： H01G4/228 , B05D5/12
CPC分类号： H01G4/30 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant on at least a surface of the metal layer and on a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.
摘要翻译：层叠电子部件的制造方法包括以下步骤：制备具有层叠结构的部件主体，所述部件主体包括形成在其中的多个内部电极，所述内部电极部分地露出在所述内部电极的外表面上并且在所述部件主体的外表面上形成外部端子电极，使得所述外部端子电极与所述内部电极电连接。形成外部端子电极的步骤包括以下步骤：在组件主体的内部电极的暴露表面上形成金属层，在金属层的至少一个表面上以及外部表面的一部分上施加斥水剂在金属层的端缘所在的部件主体上形成导电性树脂层，并且在其上涂敷斥水剂的金属层上形成导电性树脂层。

5. 发明申请

US20110309718A1 CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US20110309718A1
公开(公告)日：2011-12-22
申请号：US13161535
申请日：2011-06-16
申请人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Toshiyuki IWANAGA , Syunsuke TAKEUCHI , Kiyoyasu SAKURADA
发明人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Toshiyuki IWANAGA , Syunsuke TAKEUCHI , Kiyoyasu SAKURADA
IPC分类号： H01L41/00 , H01F5/00 , C03B29/00 , H01C7/10 , B05D5/12 , H01G4/12 , H01C7/13
CPC分类号： H01G4/12 , H01C1/14 , H01G4/005 , H01G4/232
摘要： When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.
摘要翻译：当通过电镀形成层压陶瓷电容器等陶瓷电子部件的外部端子电极时，即使在不希望的位置也可能产生电镀生长。由组件主体提供的陶瓷表面被构造为包括例如呈现较高镀层生长的例如钛酸钡系陶瓷的高镀层生长区域和例如锆酸锆的低镀层生长区域其具有相对较低的电镀生长。构成用于限定外部端子电极的基底的第一层的电镀膜以这样的方式形成，使得以由内部电极的暴露端作为起点设置的导电表面沉积的镀覆沉积物的生长被限制为不交叉在高电镀生长区域和低电镀生长区域之间的边界朝向低电镀生长区域。

6. 发明申请

US20100328843A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20100328843A1
公开(公告)日：2010-12-30
申请号：US12821305
申请日：2010-06-23
申请人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
发明人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
IPC分类号： H01G4/008 , B05D5/12
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature. These steps preliminarily diffuse copper included in the plating layers, which has a relatively high diffusion velocity, into the internal electrodes primarily including nickel, thereby reducing a difference in diffusion velocity between copper and nickel at the top temperature, which causes the occurrence of voids.
摘要翻译：在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后，为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。这些步骤将包含在具有较高扩散速度的镀层中的铜初步扩散到主要包括镍的内部电极中，从而减少了在最高温度下铜和镍之间扩散速度的差异，这导致空隙的发生。

7. 发明申请

US20110235234A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US20110235234A1
公开(公告)日：2011-09-29
申请号：US13072932
申请日：2011-03-28
申请人： Yoji YAMAMOTO , Syunsuke TAKEUCHI , Akihiro MOTOKI , Makoto OGAWA , Masahito SARUBAN
发明人： Yoji YAMAMOTO , Syunsuke TAKEUCHI , Akihiro MOTOKI , Makoto OGAWA , Masahito SARUBAN
IPC分类号： H01G4/00 , H01G4/12
CPC分类号： H01G4/30 , H01G4/232 , Y10T29/435
摘要： A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface.
摘要翻译：层压体包括彼此层叠的陶瓷层。内部导体嵌入在层压体中，并且包括在层压体的下表面和上表面处暴露在陶瓷层之间的暴露部分。外部电极被直接电镀在下表面和上表面上以覆盖相应的暴露部分。设置有暴露部分的下表面的区域被布置成从下表面的其它区域突出，并且设置暴露部分的上表面的区域布置成从上表面的其它区域突出。

8. 发明申请

US20120039015A1 LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压型陶瓷电子元件及其制造方法
公开(公告)号：US20120039015A1
公开(公告)日：2012-02-16
申请号：US13208416
申请日：2011-08-12
申请人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
发明人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Takehisa SASABAYASHI , Takayuki KAYATANI
IPC分类号： H01G4/30 , H01G7/00
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译：在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度。为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积组件主体的端面。然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

9. 发明申请

US20110193448A1 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20110193448A1
公开(公告)日：2011-08-11
申请号：US13020886
申请日：2011-02-04
申请人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Kiyoyasu SAKURADA
发明人： Masahito SARUBAN , Makoto OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Kiyoyasu SAKURADA
IPC分类号： H01L41/00 , H01G4/30 , H01F5/00 , H01C7/13 , B05D5/12
CPC分类号： H01G4/30 , H01F17/0013 , H01G4/005 , H01G13/00 , H01L41/293
摘要： A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.
摘要翻译：一种层叠电子部件的制造方法，其中，当分别连接多个内部电极彼此连接的第一镀层和提高层压电子部件的安装性的第二镀层形成为外部端子电极时，整个部件主体在形成第一镀层之后，用防水剂处理体，然后在形成第二镀层之前去除第一镀层上的防水剂。在组件主体的外表面上的第一镀膜的端缘与部件主体的外表面之间的间隙填充有防水剂。

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