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1. 发明授权

US09691650B2 Substrate transfer robot with chamber and substrate monitoring capability 有权
公开(公告)号：US09691650B2
公开(公告)日：2017-06-27
申请号：US12890281
申请日：2010-09-24
申请人： Shinichi Kurita , Takayuki Matsumoto , Suhail Anwar , Makoto Inagawa
发明人： Shinichi Kurita , Takayuki Matsumoto , Suhail Anwar , Makoto Inagawa
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67742 , H01L21/67259
摘要： A method and apparatus for a transfer robot that having at least one image sensor disposed thereon is provided. The transfer robot includes a lift assembly having a first drive assembly for moving a first platform relative to a second platform in a first linear direction, an end effector assembly disposed on the second platform and movable in a second linear direction by a second drive assembly, the second linear direction being orthogonal to the first linear direction, at least one image sensor, and a lighting device associated with the at least one image sensor.

2. 发明授权

US09324597B2 Vertical inline CVD system 有权
标题翻译：垂直在线CVD系统
公开(公告)号：US09324597B2
公开(公告)日：2016-04-26
申请号：US13098255
申请日：2011-04-29
申请人： Shinichi Kurita , Jozef Kudela , Suhail Anwar , John M. White , Dong-Kil Yim , Hans Georg Wolf , Dennis Zvalo , Makoto Inagawa , Ikuo Mori
发明人： Shinichi Kurita , Jozef Kudela , Suhail Anwar , John M. White , Dong-Kil Yim , Hans Georg Wolf , Dennis Zvalo , Makoto Inagawa , Ikuo Mori
IPC分类号： H01J37/32 , H01L21/67 , C23C16/458 , C23C16/46 , C23C16/511 , C23C16/54 , H01L21/677
CPC分类号： H01L21/67712 , C23C16/4587 , C23C16/46 , C23C16/463 , C23C16/511 , C23C16/54 , H01J37/32192 , H01J37/3222 , H01J37/32513 , H01J37/32522 , H01J37/32889 , H01J37/32899 , H01L21/67098 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67201
摘要： The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.
摘要翻译：本发明一般涉及具有能够处理多个基板的处理室的垂直CVD系统。多个基板设置在处理室内的处理源的相对侧上，但处理环境彼此不隔离。处理源是水平居中的垂直等离子体发生器，其允许在等离子体发生器的任一侧上同时处理多个基板，但彼此独立。该系统被布置为双系统，由此两个相同的处理线各自具有它们自己的处理室，彼此相邻布置。多个机器人用于从处理系统装载和卸载基板。每个机器人可以访问系统内的两条处理线。

3. 发明申请

US20120031335A1 VERTICAL INLINE CVD SYSTEM 有权
标题翻译：立式CVD系统
公开(公告)号：US20120031335A1
公开(公告)日：2012-02-09
申请号：US13098255
申请日：2011-04-29
申请人： Shinichi Kurita , Jozef Kudela , Suhail Anwar , John M. White , Dong-Kil Yim , Hans Georg Wolf , Dennis Zvalo , Makoto Inagawa , Ikuo Mori
发明人： Shinichi Kurita , Jozef Kudela , Suhail Anwar , John M. White , Dong-Kil Yim , Hans Georg Wolf , Dennis Zvalo , Makoto Inagawa , Ikuo Mori
IPC分类号： C23C16/511 , C23C16/458 , C23C16/455
CPC分类号： H01L21/67712 , C23C16/4587 , C23C16/46 , C23C16/463 , C23C16/511 , C23C16/54 , H01J37/32192 , H01J37/3222 , H01J37/32513 , H01J37/32522 , H01J37/32889 , H01J37/32899 , H01L21/67098 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67201
摘要： The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.
摘要翻译：本发明一般涉及具有能够处理多个基板的处理室的垂直CVD系统。多个基板设置在处理室内的处理源的相对侧上，但处理环境彼此不隔离。处理源是水平居中的垂直等离子体发生器，其允许在等离子体发生器的任一侧上同时处理多个基板，但彼此独立。该系统被布置为双系统，由此两个相同的处理线各自具有它们自己的处理室，彼此相邻布置。多个机器人用于从处理系统装载和卸载基板。每个机器人可以访问系统内的两条处理线。

4. 发明申请

US20100011785A1 TUBE DIFFUSER FOR LOAD LOCK CHAMBER 审中-公开
标题翻译：用于负载锁箱的管子扩散器
公开(公告)号：US20100011785A1
公开(公告)日：2010-01-21
申请号：US12501799
申请日：2009-07-13
申请人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa
发明人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa
IPC分类号： C23C16/00
CPC分类号： C23C16/54 , H01L21/67109 , H01L21/67201
摘要： Embodiments disclosed herein generally provide a load lock chamber capable of controlling the temperature of the substrate therein. The load lock chamber may have one or more cooling fluid introduction passages that extend across the chamber. Cooling fluid, such as nitrogen gas, may flow through the cooling fluid passage and enter the load lock chamber. The cooling fluid passages may have openings to permit the cooling fluid to exit the passages and enter the load lock chamber. The openings may be arranged to permit a greater amount of cooling fluid to enter the load lock at locations corresponding to the substrate positions that are in contact with an end effector that places the substrate into the load lock chamber. Additionally, the openings may be arranged to permit a greater amount if cooling fluid to enter the load lock chamber in the center of the chamber as compared to the edge of the chamber.
摘要翻译：本文公开的实施例通常提供能够控制其中的基板的温度的负载锁定室。加载锁定室可以具有延伸穿过该腔室的一个或多个冷却流体引入通道。诸如氮气的冷却流体可以流过冷却流体通道并进入负载锁定室。冷却流体通道可以具有允许冷却流体离开通道并进入负载锁定室的开口。开口可以被布置成允许更大量的冷却流体在对应于与将基板放置到负载锁定室中的端部执行器接触的基板位置的位置处进入负载锁定。此外，与腔室的边缘相比，如果冷却流体进入腔室中心的负载锁定室，则开口可以被布置为允许更大的量。

5. 外观设计

USD687535S1 Heater plate and heater element assembly 有权
标题翻译：加热板和加热器组件
公开(公告)号：USD687535S1
公开(公告)日：2013-08-06
申请号：US29436342
申请日：2012-11-05
申请人： Makoto Inagawa , Shinichi Kurita
设计人： Makoto Inagawa , Shinichi Kurita

6. 发明申请

US20100122982A1 ELECTRON BEAM WELDING OF LARGE VACUUM CHAMBER BODY HAVING A HIGH EMISSIVITY COATING 有权
标题翻译：具有高电感涂层的大型真空室体的电子束焊接
公开(公告)号：US20100122982A1
公开(公告)日：2010-05-20
申请号：US12534534
申请日：2009-08-03
申请人： SHINICHI KURITA , Mehran Behdjat , Makoto Inagawa
发明人： SHINICHI KURITA , Mehran Behdjat , Makoto Inagawa
IPC分类号： B65D6/28 , B23K15/00
CPC分类号： B65D7/06 , B23K15/0006 , B65D7/38 , H01L21/67379
摘要： Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
摘要翻译：本文公开的实施例涉及已经焊接在一起的大型真空室主体。腔体可以在其中的至少一个表面上具有高发射率涂层。由于腔室主体的尺寸较大，可以通过将多个部件焊接在一起而不是从单个金属件锻造主体而形成腔体。这些部件可以在与身体的角部间隔开的位置处被焊接在一起，该位置在排空期间可能处于最大的应力下，以确保可能是身体中最弱点的焊缝不会失效。室主体的至少一个表面可以涂覆有高发射率涂层，以帮助来自加热的基底的热传递。高发射率涂层可以通过降低降低衬底温度所需的时间来增加衬底通量。

7. 发明申请

US20090321399A1 DYNAMIC SCRIBE ALIGNMENT FOR LASER SCRIBING, WELDING OR ANY PATTERNING SYSTEM 审中-公开
标题翻译：用于激光切割，焊接或任何绘图系统的动态筛选对准
公开(公告)号：US20090321399A1
公开(公告)日：2009-12-31
申请号：US12422208
申请日：2009-04-10
申请人： Makoto Inagawa , Shinichi Kurita , Bassam Shamoun , Sriram Krishnaswami , Michael D. Shirk , Kevin L. Cunningham
发明人： Makoto Inagawa , Shinichi Kurita , Bassam Shamoun , Sriram Krishnaswami , Michael D. Shirk , Kevin L. Cunningham
IPC分类号： B23K26/38
CPC分类号： B23K26/364 , B23K26/042 , B23K26/0673 , B23K26/082 , B23K26/083 , B23K26/40 , B23K2103/172
摘要： Methods and systems for improving the alignment between a previously formed feature and a subsequently formed feature are provided. An exemplary method can include laser scribing a workpiece (104, 550) having a previously formed first feature. The exemplary method includes imaging the workpiece (104, 550) with an imaging device (320, 420, 554, 640) so as to capture a plurality of positions of the first feature on the workpiece (104, 550) relative to the laser-scribing device (100). The exemplary method further includes using the captured positions to align output from the laser-scribing device (100) in order to form a second feature on the workpiece (104, 550) at a controlled distance from the first feature.
摘要翻译：提供了用于改善先前形成的特征与随后形成的特征之间的对准的方法和系统。示例性的方法可以包括激光划刻具有先前形成的第一特征的工件（104,550）。该示例性方法包括用成像装置（320,420,554,640）对工件（104,550）进行成像，以便相对于激光打印机捕获工件（104,550）上的第一特征的多个位置，划线装置（100）。该示例性方法还包括使用所捕获的位置来对齐来自激光划线装置（100）的输出，以便在距离第一特征的受控距离处在工件（104,550）上形成第二特征。

8. 发明申请

US20120031333A1 VERTICAL INLINE CVD SYSTEM 有权
公开(公告)号：US20120031333A1
公开(公告)日：2012-02-09
申请号：US13098253
申请日：2011-04-29
申请人： Shinichi Kurita , Jozef Kudela , Suhail Anwar , John M. White , Dong-Kil Yim , Hans Georg Wolf , Dennis Zvalo , Makoto Inagawa , Ikuo Mori
发明人： Shinichi Kurita , Jozef Kudela , Suhail Anwar , John M. White , Dong-Kil Yim , Hans Georg Wolf , Dennis Zvalo , Makoto Inagawa , Ikuo Mori
IPC分类号： H01L21/677 , C23C16/511 , B25J9/00 , C23C16/44
CPC分类号： H01L21/67712 , C23C16/4587 , C23C16/46 , C23C16/463 , C23C16/511 , C23C16/54 , H01J37/32192 , H01J37/3222 , H01J37/32513 , H01J37/32522 , H01J37/32889 , H01J37/32899 , H01L21/67098 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67201
摘要： The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.

9. 发明申请

US20110076118A1 SUBSTRATE TRANSFER ROBOT WITH CHAMBER AND SUBSTRATE MONITORING CAPABILITY 有权
标题翻译：基板转移机架与底板监测能力
公开(公告)号：US20110076118A1
公开(公告)日：2011-03-31
申请号：US12890281
申请日：2010-09-24
申请人： Shinichi Kurita , Takayuki Matsumoto , Suhail Anwar , Makoto Inagawa
发明人： Shinichi Kurita , Takayuki Matsumoto , Suhail Anwar , Makoto Inagawa
IPC分类号： H01L21/677 , B25J11/00
CPC分类号： H01L21/67742 , H01L21/67259
摘要： A method and apparatus for a transfer robot that having at least one image sensor disposed thereon is provided. The transfer robot includes a lift assembly having a first drive assembly for moving a first platform relative to a second platform in a first linear direction, an end effector assembly disposed on the second platform and movable in a second linear direction by a second drive assembly, the second linear direction being orthogonal to the first linear direction, at least one image sensor, and a lighting device associated with the at least one image sensor.
摘要翻译：提供一种用于传送机器人的方法和装置，其具有设置在其上的至少一个图像传感器。传送机器人包括具有第一驱动组件的提升组件，该第一驱动组件用于沿第一线性方向相对于第二平台移动第一平台;设置在第二平台上并通过第二驱动组件在第二线性方向上可移动的端部执行器组件，所述第二线性方向与所述第一线性方向正交，至少一个图像传感器和与所述至少一个图像传感器相关联的照明装置。

10. 发明申请

US20100050534A1 SLOTTED TSSL DOOR TO COUPLE O-RING WITH MOVING MATING PART 有权
标题翻译：滑动TSSL门与移动部件接合O形圈
公开(公告)号：US20100050534A1
公开(公告)日：2010-03-04
申请号：US12548553
申请日：2009-08-27
申请人： Mehran Behdjat , Shinichi Kurita , John M. White , Suhail Anwar , Makoto Inagawa
发明人： Mehran Behdjat , Shinichi Kurita , John M. White , Suhail Anwar , Makoto Inagawa
IPC分类号： E06B7/16 , E06B3/00
CPC分类号： H01L21/67201 , F16K15/147 , F16K51/02 , H01L21/67126
摘要： Embodiments disclosed herein generally relate to a slit valve door assembly for sealing an opening in a chamber. A slit valve door that is pressed against the chamber to seal the slit valve opening moves with the chamber as the slit valve opening shrinks so that an o-ring pressed between the slit valve door and the chamber may move with the slit valve door and the chamber. Thus, less rubbing of the o-ring against the chamber may occur. With less rubbing, fewer particles may be generated and the o-ring lifetime may be extended. With a longer lifetime for the o-ring, substrate throughput may be increased.
摘要翻译：本文公开的实施例通常涉及用于密封腔室中的开口的狭缝阀门组件。当狭缝阀开口收缩时，被压靠在腔室上以密封狭缝阀开口的狭缝阀门随着腔室移动，使得压紧在狭缝阀门和腔室之间的O形环可以与狭缝阀门一起移动，并且房间。因此，可能会发生O形环相对于室的摩擦较少。随着摩擦的减少，可能产生更少的颗粒，并且可以延长O形环的寿命。随着O形圈的寿命更长，衬底产量可能会增加。

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