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1. 发明申请

US20110073292A1 FABRICATION OF HIGH SURFACE AREA, HIGH ASPECT RATIO MINI-CHANNELS AND THEIR APPLICATION IN LIQUID COOLING SYSTEMS 审中-公开
标题翻译：高表面积，高比例微通道的制造及其在液体冷却系统中的应用
公开(公告)号：US20110073292A1
公开(公告)日：2011-03-31
申请号：US12571265
申请日：2009-09-30
申请人： Madhav Datta , Peng Zhou , Hae-won Choi , Brandon Leong , Mark McMaster , Douglas E. Werner
发明人： Madhav Datta , Peng Zhou , Hae-won Choi , Brandon Leong , Mark McMaster , Douglas E. Werner
IPC分类号： F28F9/00 , F28F9/24 , B21D53/02
CPC分类号： F28F1/40 , F28F3/02 , F28F2260/02 , F28F2275/04 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention provides methods and apparatuses which achieve high heat transfer in a fluid cooling system, and which do so with a small pressure drop across the system. The present invention teaches the use of wall features on the fins of a heat exchanger to cool fluid in a fluid cooling system. The present invention also discloses high aspect ratio, high surface area structures applicable in micro-heat exchangers for fluid cooling systems and cost effective methods for manufacturing the same.
摘要翻译：本发明提供了在流体冷却系统中实现高热传递的方法和装置，并且在整个系统上具有小的压降。本发明教导了在热交换器的翅片上使用壁特征来冷却流体冷却系统中的流体。本发明还公开了可用于流体冷却系统的微型热交换器的高纵横比，高表面积结构和其制造成本有效的方法。

2. 发明申请

US20100032143A1 MICROHEAT EXCHANGER FOR LASER DIODE COOLING 有权
标题翻译：用于激光二极管冷却的MICROHEAT交换器
公开(公告)号：US20100032143A1
公开(公告)日：2010-02-11
申请号：US12536361
申请日：2009-08-05
申请人： Madhav Datta , Brandon Leong , Mark McMaster
发明人： Madhav Datta , Brandon Leong , Mark McMaster
IPC分类号： F28D15/00 , F28F7/00
CPC分类号： F28F7/02 , C04B37/026 , C04B2237/12 , C04B2237/122 , C04B2237/124 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/366 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/592 , C04B2237/62 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , C04B2237/74 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/0207 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/38 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/064 , Y10T428/24612 , Y10T428/31678 , H01L2924/00
摘要： A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.
摘要翻译：微型交换组件被配置为冷却一个或多个发热装置，例如集成电路或激光二极管。微型交换组件包括热耦合到第一表面的第一陶瓷组件，以及在与第二表面热耦合的第二陶瓷组件的情况下。陶瓷组件包括一个或多个热导热焊盘，其被热耦合到发热器件，每个导电焊盘彼此电隔离。陶瓷组件包括提供该电隔离的陶瓷层。使用中间接合材料，陶瓷层的顶表面和底表面各自与导电层（例如铜）接合。执行钎焊工艺以通过接合层将陶瓷层粘合到导电层。接合层是接合材料，陶瓷层和导电层的复合物。

3. 发明授权

US08254422B2 Microheat exchanger for laser diode cooling 有权
标题翻译：用于激光二极管冷却的微热交换器
公开(公告)号：US08254422B2
公开(公告)日：2012-08-28
申请号：US12536361
申请日：2009-08-05
申请人： Madhav Datta , Brandon Leong , Mark McMaster
发明人： Madhav Datta , Brandon Leong , Mark McMaster
IPC分类号： H01S3/04
CPC分类号： F28F7/02 , C04B37/026 , C04B2237/12 , C04B2237/122 , C04B2237/124 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/366 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/592 , C04B2237/62 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , C04B2237/74 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/0207 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/38 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/064 , Y10T428/24612 , Y10T428/31678 , H01L2924/00
摘要： A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.
摘要翻译：微型交换组件被配置为冷却一个或多个发热装置，例如集成电路或激光二极管。微型交换组件包括热耦合到第一表面的第一陶瓷组件，以及在与第二表面热耦合的第二陶瓷组件的情况下。陶瓷组件包括一个或多个热导热焊盘，其被热耦合到发热器件，每个导电焊盘彼此电隔离。陶瓷组件包括提供该电隔离的陶瓷层。使用中间接合材料，陶瓷层的顶表面和底表面各自与导电层（例如铜）接合。执行钎焊工艺以通过接合层将陶瓷层粘合到导电层。接合层是接合材料，陶瓷层和导电层的复合物。

4. 发明申请

US20070175621A1 Re-workable metallic TIM for efficient heat exchange 审中-公开
标题翻译：可重复使用的金属TIM，用于高效的热交换
公开(公告)号：US20070175621A1
公开(公告)日：2007-08-02
申请号：US11345556
申请日：2006-01-31
申请人： Madhav Datta , Peng Zhou , James Hom , Mark Munch , Mark McMaster
发明人： Madhav Datta , Peng Zhou , James Hom , Mark Munch , Mark McMaster
IPC分类号： H05K7/20
CPC分类号： H01L23/3736 , H01L23/3735 , H01L23/473 , H01L2224/73253
摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TIM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also reusable.
摘要翻译：热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。热源优选为耦合到电路板的集成电路。金属TIM优选包含铟。金属TIM由单独的金属TIM箔或金属材料的沉积层组成。金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。一旦分解，热交换器和金属TIM箔可以再次使用。如果金属TIM沉积在热交换器上，则拆卸产生也是可重复使用的热交换子组件。

5. 发明授权

US07836597B2 Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system 有权
标题翻译：制造高表面与体积比结构的方法及其集成在液体冷却系统的微热交换器中
公开(公告)号：US07836597B2
公开(公告)日：2010-11-23
申请号：US11326690
申请日：2006-01-06
申请人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
发明人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
IPC分类号： B23P15/26 , F28D15/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F13/185 , F28F2245/04 , H01L21/4882 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49366 , Y10T29/49369 , H01L2924/00
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

6. 发明申请

US20080210405A1 Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems 有权
标题翻译：制造高表面与体积比的结构及其集成在液体冷却系统的微型换热器中
公开(公告)号：US20080210405A1
公开(公告)日：2008-09-04
申请号：US11326690
申请日：2006-01-06
申请人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
发明人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
IPC分类号： F28F27/02 , B21D53/02
CPC分类号： F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F13/185 , F28F2245/04 , H01L21/4882 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49366 , Y10T29/49369 , H01L2924/00
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

7. 发明授权

US08299604B2 Bonded metal and ceramic plates for thermal management of optical and electronic devices 有权
标题翻译：粘合金属和陶瓷板用于光学和电子设备的热管理
公开(公告)号：US08299604B2
公开(公告)日：2012-10-30
申请号：US12536402
申请日：2009-08-05
申请人： Madhav Datta , Mark McMaster
发明人： Madhav Datta , Mark McMaster
IPC分类号： B32B3/00 , B32B15/04
CPC分类号： F28F7/02 , C04B37/026 , C04B2237/12 , C04B2237/122 , C04B2237/124 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/366 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/592 , C04B2237/62 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , C04B2237/74 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/0207 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/38 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/064 , Y10T428/24612 , Y10T428/31678 , H01L2924/00
摘要： A ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. The ceramic layer has high thermal conductivity and high electrical resistivity. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer. The top conductive layer and the joining layer are etched to form the electrically isolated conductive pads. The conductive layers are bonded to the ceramic layer using a bare ceramic approach or a metallized ceramic approach.
摘要翻译：陶瓷组件包括一个或多个热耦合到发热装置的导电和导热焊盘，每个导电焊盘彼此电隔离。陶瓷组件包括提供该电隔离的陶瓷层。陶瓷层具有高导热性和高电阻率。使用中间接合材料，陶瓷层的顶表面和底表面各自与导电层（例如铜）接合。执行钎焊工艺以通过接合层将陶瓷层粘合到导电层。接合层是接合材料，陶瓷层和导电层的复合物。蚀刻顶部导电层和接合层以形成电隔离的导电焊盘。使用裸陶瓷方法或金属化陶瓷方法将导电层结合到陶瓷层。

8. 发明申请

US20100035024A1 BONDED METAL AND CERAMIC PLATES FOR THERMAL MANAGEMENT OF OPTICAL AND ELECTRONIC DEVICES 有权
标题翻译：粘合金属和陶瓷板用于光学和电子设备的热管理
公开(公告)号：US20100035024A1
公开(公告)日：2010-02-11
申请号：US12536402
申请日：2009-08-05
申请人： Madhav Datta , Mark McMaster
发明人： Madhav Datta , Mark McMaster
IPC分类号： B32B3/00 , B32B15/04
CPC分类号： F28F7/02 , C04B37/026 , C04B2237/12 , C04B2237/122 , C04B2237/124 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/366 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/592 , C04B2237/62 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , C04B2237/74 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/0207 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/38 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/064 , Y10T428/24612 , Y10T428/31678 , H01L2924/00
摘要： A ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. The ceramic layer has high thermal conductivity and high electrical resistivity. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer. The top conductive layer and the joining layer are etched to form the electrically isolated conductive pads. The conductive layers are bonded to the ceramic layer using a bare ceramic approach or a metallized ceramic approach.
摘要翻译：陶瓷组件包括一个或多个热耦合到发热装置的导电和导热焊盘，每个导电焊盘彼此电隔离。陶瓷组件包括提供该电隔离的陶瓷层。陶瓷层具有高导热性和高电阻率。使用中间接合材料，陶瓷层的顶表面和底表面各自与导电层（例如铜）接合。执行钎焊工艺以通过接合层将陶瓷层粘合到导电层。接合层是接合材料，陶瓷层和导电层的复合物。蚀刻顶部导电层和接合层以形成电隔离的导电焊盘。使用裸陶瓷方法或金属化陶瓷方法将导电层结合到陶瓷层。

9. 发明申请

US20070256825A1 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect 审中-公开
标题翻译：通过使用具有柔性流体互连的远程驱动室热交换器来安装在个人计算机的子卡/扩展卡上的发热部件的液体冷却的方法
公开(公告)号：US20070256825A1
公开(公告)日：2007-11-08
申请号：US11800303
申请日：2007-05-03
申请人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
发明人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
IPC分类号： G05D23/00 , H01L23/467
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

10. 发明授权

US08952550B2 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same 有权
公开(公告)号：US08952550B2
公开(公告)日：2015-02-10
申请号：US12655975
申请日：2010-01-12
申请人： Madhav Datta , Dave Emory , Subhash M. Joshi , Susanne Menezes , Doowon Suh
发明人： Madhav Datta , Dave Emory , Subhash M. Joshi , Susanne Menezes , Doowon Suh
IPC分类号： H01L23/48
CPC分类号： H01L24/11 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05572 , H01L2224/05647 , H01L2224/10126 , H01L2224/11009 , H01L2224/1147 , H01L2224/1148 , H01L2224/11849 , H01L2224/11901 , H01L2224/11912 , H01L2224/13023 , H01L2224/13099 , H01L2224/13111 , H01L2224/13116 , H01L2224/13147 , H01L2224/13166 , H01L2924/0002 , H01L2924/01005 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01046 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2224/05552
摘要： The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.

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