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1. 发明授权

US09297571B1 Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door 有权
标题翻译：用于通过安装在门上的热交换器从设备架排出热量的装置和方法
公开(公告)号：US09297571B1
公开(公告)日：2016-03-29
申请号：US13540015
申请日：2012-07-02
申请人： Adrian Correa , Tien-Chieh (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
发明人： Adrian Correa , Tien-Chieh (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
IPC分类号： F25D19/02 , F25D19/00
CPC分类号： F25D19/00 , E05D11/0081 , E05Y2800/10 , E05Y2900/208 , H05K7/20781
摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes multiple heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes one or more swivel joints, each configured to provide one or more fluid paths between the cooling door and the frame. The cooling door assembly includes separate and independent fluid paths, where fluid is separately provided to each independent fluid path. Different groups of heat exchangers are coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.
摘要翻译：冷却门组件包括框架和联接到框架的冷却门。冷却门包括多个热交换器。框架被配置成以这样的方式安装到服务器机架或其他电子机柜的背面，使得冷却门打开以允许访问服务器机架内的电子服务器，同时保持与外部冷却系统的流体连接。框架联接到外部冷却系统，并且冷却门包括一个或多个旋转接头，每个旋转接头构造成在冷却门和框架之间提供一个或多个流体路径。冷却门组件包括独立和独立的流体路径，其中流体分别设置到每个独立的流体路径。不同组的热交换器耦合到每个独立的流体路径。在独立流体路径中的一个失效的情况下，另一个独立的流体路径保持运行。

2. 发明申请

US20110073292A1 FABRICATION OF HIGH SURFACE AREA, HIGH ASPECT RATIO MINI-CHANNELS AND THEIR APPLICATION IN LIQUID COOLING SYSTEMS 审中-公开
标题翻译：高表面积，高比例微通道的制造及其在液体冷却系统中的应用
公开(公告)号：US20110073292A1
公开(公告)日：2011-03-31
申请号：US12571265
申请日：2009-09-30
申请人： Madhav Datta , Peng Zhou , Hae-won Choi , Brandon Leong , Mark McMaster , Douglas E. Werner
发明人： Madhav Datta , Peng Zhou , Hae-won Choi , Brandon Leong , Mark McMaster , Douglas E. Werner
IPC分类号： F28F9/00 , F28F9/24 , B21D53/02
CPC分类号： F28F1/40 , F28F3/02 , F28F2260/02 , F28F2275/04 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention provides methods and apparatuses which achieve high heat transfer in a fluid cooling system, and which do so with a small pressure drop across the system. The present invention teaches the use of wall features on the fins of a heat exchanger to cool fluid in a fluid cooling system. The present invention also discloses high aspect ratio, high surface area structures applicable in micro-heat exchangers for fluid cooling systems and cost effective methods for manufacturing the same.
摘要翻译：本发明提供了在流体冷却系统中实现高热传递的方法和装置，并且在整个系统上具有小的压降。本发明教导了在热交换器的翅片上使用壁特征来冷却流体冷却系统中的流体。本发明还公开了可用于流体冷却系统的微型热交换器的高纵横比，高表面积结构和其制造成本有效的方法。

3. 发明授权

US07746634B2 Internal access mechanism for a server rack 有权
标题翻译：服务器机架的内部访问机制
公开(公告)号：US07746634B2
公开(公告)日：2010-06-29
申请号：US12221961
申请日：2008-08-07
申请人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
发明人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要翻译：电子外壳的后面板包括一个或多个热交换器。后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。可以通过在诸如标准门的铰链上使门打开来提供这种接近。在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。在一些实施例中，每个部分像标准门一样旋转打开。在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

4. 发明授权

US07660117B2 Deformable duct guides that accommodate electronic connection lines 有权
标题翻译：适应电子连接线的可变形导管
公开(公告)号：US07660117B2
公开(公告)日：2010-02-09
申请号：US12221945
申请日：2008-08-07
申请人： Douglas E. Werner , James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Richard Grant Brewer
发明人： Douglas E. Werner , James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Richard Grant Brewer
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.
摘要翻译：管道工作组件联接到容纳一个或多个发热设备（例如电子设备服务器）的电子设备外壳的端部。管道工作组件包括单独的管道引导件，每个管道引导件具有可变形的端部，该可变形端部构造成围绕从一个或多个电子服务器的后部延伸的电连接线局部变形。可变形端可由刷毛制成，如刷子或包括狭缝和/或孔的泡沫。

5. 发明授权

US07599184B2 Liquid cooling loops for server applications 有权
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：US07599184B2
公开(公告)日：2009-10-06
申请号：US11707350
申请日：2007-02-16
申请人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
发明人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

6. 发明授权

US07539020B2 Liquid cooling loops for server applications 有权
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：US07539020B2
公开(公告)日：2009-05-26
申请号：US11707332
申请日：2007-02-16
申请人： Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Girish Upadhya , Frederic Landry , Ian Spearing , Tim Schrader
发明人： Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Girish Upadhya , Frederic Landry , Ian Spearing , Tim Schrader
IPC分类号： H05K7/16
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.
摘要翻译：安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

7. 发明申请

US20090046430A1 Method and apparatus for providing supplemental cooling to server racks 审中-公开
标题翻译：为服务器机架提供补充冷却的方法和装置
公开(公告)号：US20090046430A1
公开(公告)日：2009-02-19
申请号：US12228053
申请日：2008-08-07
申请人： Richard Grant Brewer , Hae-won Choi , James Hom , Tien Chih (Eric) Lin , Douglas E. Werner
发明人： Richard Grant Brewer , Hae-won Choi , James Hom , Tien Chih (Eric) Lin , Douglas E. Werner
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： A cooling system includes a re-configurable duct work assembly for a server rack or other electronics enclosure. Heat generating devices are positioned within the electronics enclosure and heat exchangers are coupled to the heat generating devices via the duct work. The duct work is positioned within a plenum between the back of the electronics servers and the heat exchangers. The interior of the electronics enclosure is conceptually segmented into heat zones. The duct work is used to selectively direct heated air to the heat exchangers. In some embodiments, the heated air output from a single heat zone is directed by the duct work to a corresponding single heat exchanger. In other embodiments, the heated air output from a group of adjacent heat zones is combined within a single duct work guide that directs the combined heated air to a corresponding number of adjacent heat exchangers.
摘要翻译：冷却系统包括用于服务器机架或其他电子设备外壳的可重构管道工作组件。热产生装置位于电子设备外壳内，热交换器通过管道工作连接到发热装置。管道工作位于电子服务器的背面和热交换器之间的集气室内。电子外壳的内部在概念上分为热区。管道工作用于选择性地将加热的空气引导到热交换器。在一些实施例中，从单个加热区域输出的加热空气由管道工作引导到相应的单个热交换器。在其它实施例中，来自一组相邻加热区域的加热空气输出在单个管道工作导向器内组合，其将组合的加热空气引导到相应数量的相邻热交换器。

8. 发明授权

US08157001B2 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US08157001B2
公开(公告)日：2012-04-17
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： G05D23/00 , F28F7/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.
摘要翻译：集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

9. 发明申请

US20090046423A1 Internal access mechanism for a server rack 有权
标题翻译：服务器机架的内部访问机制
公开(公告)号：US20090046423A1
公开(公告)日：2009-02-19
申请号：US12221961
申请日：2008-08-07
申请人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
发明人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要翻译：电子外壳的后面板包括一个或多个热交换器。后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。可以通过在诸如标准门的铰链上使门打开来提供这种接近。在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。在一些实施例中，每个部分像标准门一样旋转打开。在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

10. 发明申请

US20070227708A1 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US20070227708A1
公开(公告)日：2007-10-04
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。储存器可以连接到流体路径。

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