专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2005219312A Reversible thermal recording material 有权
标题翻译：可逆热记录材料
公开(公告)号：JP2005219312A
公开(公告)日：2005-08-18
申请号：JP2004028507
申请日：2004-02-04
申请人： Mitsubishi Paper Mills Ltd , 三菱製紙株式会社
发明人： NAZUKA MASANORI
IPC分类号： B41M5/337 , B41M5/26
摘要： PROBLEM TO BE SOLVED: To provide an excellent reversible thermal recording material capable of forming or erasing a recording image with a high contrast and a high sensitivity for a number of times, and not only improving furthermore heat resistance and repeating durability, but also simultaneously realizing stable image erasing properties, interlaminar adhesive properties, water resistance and preventing a low melting point recording layer composition from being dissolved. SOLUTION: The reversible thermal recording layer is provided with at least a reversible thermal recording layer comprising an ordinarily colorless or light-colored electron-donating dye precursor, a reversible color developing agent for generating a reversible color tone change on the dye precursor by difference in a cooling speed after heating, and a color erasing accelerator as main components, and a protective layer. The reversible thermal recording material is characterized by providing a crosslinking resin layer comprising a curable resin on the reversible thermal recording layer. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够以高对比度和高灵敏度形成或擦除记录图像多次的优异的可逆热记录材料，并且不仅提高了耐热性和重复耐久性，而且同时实现稳定的图像擦除性能，层间粘合性能，耐水性和防止低熔点记录层组合物溶解。解决方案：可逆热敏记录层设置有至少一个包含通常无色或浅色给电子染料前体的可逆热记录层，用于在染料前体上产生可逆色调变化的可逆彩色显影剂加热后的冷却速度的差别，作为主要成分的消色剂，以及保护层。可逆热记录材料的特征在于在可逆热敏记录层上提供包含可固化树脂的交联树脂层。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2004303856A Manufacturing method of substrate 有权
公开(公告)号：JP2004303856A
公开(公告)日：2004-10-28
申请号：JP2003093288
申请日：2003-03-31
申请人： Mitsubishi Paper Mills Ltd , 三菱製紙株式会社
发明人： NAZUKA MASANORI , KANEDA YASUO
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate by which a metallic conductive layer is formed selectively on a hole inner wall with a simple constitution.
SOLUTION: The manufacturing method for a substrate contains at least a process in which thermoplastic resin layers 4 are formed on both surfaces of the substrate for forming a circuit by using the substrate 10 for forming the circuit to which a hole 3 is formed, a process in which the resin layers in the opening section of the hole are removed and the thermoplastic resin layers are formed on both surfaces of the substrate with the exception of the opening section, a process in which the metallic conductive layers 2 are formed on the inner walls of the through-hole by a plating treatment, and a process in which the resin layers are removed.
COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2003251248A METHOD OF FORMING PHOTOSENSITIVE LAYER AND APPARATUS FOR THE SAME 审中-公开
公开(公告)号：JP2003251248A
公开(公告)日：2003-09-09
申请号：JP2002054312
申请日：2002-02-28
申请人： MITSUBISHI PAPER MILLS LTD
发明人： NAZUKA MASANORI , HYODO KENJI
IPC分类号： G03F7/16 , B05C5/02 , B05C9/10 , B05C13/02 , B05D1/26 , B05D7/00 , H05K3/00 , H05K3/06 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a photosensitive layer which enables the simultaneous coating of both surfaces of even a thick substrate having a thickness ranging from 0.1 mm to 0.8 mm thickness by a die coating method and by which the substrate having a uniform film thickness distribution in the substrate surface is stably obtained and the incorporation of foreign matters into a photosensitive layer is suppressed to the utmost. SOLUTION: Before coating, the foreign matter stuck on the substrate is removed and the photosensitive layer is formed by moving at least one of the substrate and a coating liquid discharge means relatively to each other in a state that the end part of the substrate is held. COPYRIGHT: (C)2003,JPO

4. 发明专利

JP2002314224A LAMINATE FOR ELECTROPHOTOGRAPHIC PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002314224A
公开(公告)日：2002-10-25
申请号：JP2001112601
申请日：2001-04-11
申请人： MITSUBISHI PAPER MILLS LTD
发明人： IRISAWA MUNETOSHI , KITO MASATOSHI , NAZUKA MASANORI
IPC分类号： H05K3/40 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a laminate for an electrophotographic method printed circuit without bringing about a conduction fault of a through hole or a non- through hole of a high aspect ratio, even by a double-side simultaneous toner developing method without developing step of hole filling or sequentially developing one side surfaces, in an electrophotographic printed circuit board having the through hole or the non-through hole. SOLUTION: The laminate for the electrophotographic method printed circuit is obtained by coating an electrophotographic coating liquid on a conductive base 1 having the through hole 4 or/and the non-through hole 5 and providing a photosensitive layer. The laminate for the printed board having the through hole or/and the non-through hole in which no bubble exists is obtained, is provided by fully filling a solvent at last in the through hole or/and the non-through hole, then coating the electrophotographic coating liquid and forming the photosensitive layer.

5. 发明专利

JP2005286301A Method of manufacturing circuit board 有权
标题翻译：制造电路板的方法
公开(公告)号：JP2005286301A
公开(公告)日：2005-10-13
申请号：JP2004362998
申请日：2004-12-15
申请人： Mitsubishi Paper Mills Ltd , Shinko Electric Ind Co Ltd , 三菱製紙株式会社 , 新光電気工業株式会社
发明人： IRISAWA MUNETOSHI , NAZUKA MASANORI , KANEDA YASUO , KOMURO TOYOICHI , AIZAWA WAKANA , FUKASE KATSUYA , SAKAI TOYOAKI
IPC分类号： H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a means by which the problem, wherein the land widths of holes become nonuniform, positional deviations occur between lands and holes, and so on, caused by alignment performed at the forming of etching resist layer and plating resist layer, in a method of manufacturing circuit board using the subtractive method, additive method, semi-additive method, etc., can be solved.
SOLUTION: The method of manufacturing circuit board includes a step of forming a first resin layer on the surface of an insulating substrate, having a through hole or/and a non-through hole and a conductive layer on its surface, except the internal walls of the holes; a step of forming a second resin layer which is insoluble or hardly soluble in a first resin layer developing solution on the first resin layer formed on the surface conductive layer; and a step of removing the first resin layer formed on the holes by using the first resin layer developing solution. The method also includes a step of inducing a potential difference between the first resin layer formed on the holes and the first resin layer formed on the surface conductive layer, by uniformly charging the surface of the first resin layer, before the second resin layer is formed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种问题，其中孔的平面宽度变得不均匀，由于在形成抗蚀剂层时进行的取向引起的焊盘和孔之间发生位置偏差等电镀抗蚀剂层，在使用减法法制造电路板的方法，添加剂法，半添加法等中可以解决。解决方案：制造电路板的方法包括在绝缘基板的表面上形成第一树脂层的步骤，其表面上具有通孔或/和非贯通孔和导电层，除了孔的内壁; 在形成在所述表面导电层上的所述第一树脂层上形成不溶或难溶于第一树脂层显影液的第二树脂层的步骤; 以及通过使用第一树脂层显影液除去形成在孔上的第一树脂层的步骤。该方法还包括在形成第二树脂层之前，在形成在孔上的第一树脂层和形成在表面导电层上的第一树脂层之间通过均匀地充电第一树脂层的表面来引起电位差的步骤。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004349358A Plating resist composite, plating resist sheet, and method for manufacturing substrate using the sheet 审中-公开
公开(公告)号：JP2004349358A
公开(公告)日：2004-12-09
申请号：JP2003142787
申请日：2003-05-21
申请人： Mitsubishi Paper Mills Ltd , 三菱製紙株式会社
发明人： NAZUKA MASANORI , KANEDA YASUO , IRISAWA MUNETOSHI
IPC分类号： C08K5/37 , C08L101/00 , H05K3/18 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide plating resist composite, a plating resist sheet and a method for manufacturing a substrate which uses the sheet wherein a metal conductive layer is selectively formed on a hole inner wall by simple configuration without needing a process in which positioning like exposure is necessary.
SOLUTION: The plating resist composite contains at least thermoplastic resin and heterocyclic mercaptan compound, and may contain the second resin component on a case. The plating resist sheet is composed of the plating resist composite. The method for manufacturing a substrate is characterized by forming plating resist layers on both surfaces of the substrate for circuit formation except an opening by using the plating resist sheet.
COPYRIGHT: (C)2005,JPO&NCIPI

7. 发明专利

JP2004214254A Method of manufacturing printed wiring board through electrophotographic process 有权
公开(公告)号：JP2004214254A
公开(公告)日：2004-07-29
申请号：JP2002378982
申请日：2002-12-27
申请人： Mitsubishi Paper Mills Ltd , 三菱製紙株式会社
发明人： NAZUKA MASANORI , KANEDA YASUO
IPC分类号： H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board through an electrophotographic process, which is capable of easily and surely coating a resist to a through-hole and/or a non-through-hole when the printed wiring board equipped with the through-hole and/or the non-through-hole is manufactured.
SOLUTION: In the method of manufacturing the printed wiring board, a dry film composed of, at least, two layers, an electrophotographic photosensitive layer 3 and a carrier film 4, is laminated on each surface of a circuit forming board 1 making its surface opposite to the carrier film 4 confront the board 1, the carrier film 4 is removed, and the electrophotographic photosensitive layer 3 is removed from the openings of the through-hole 2 and/or the non-through-hole before the electrophotographic photosensitive layer 3 is subjected to an electrostatic charge treatment, and the electrophotographic photosensitive layer is formed on each surface of the circuit forming board 1 excluding the openings.
COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2002304062A SQUEEZING ROLL 失效
公开(公告)号：JP2002304062A
公开(公告)日：2002-10-18
申请号：JP2001109966
申请日：2001-04-09
申请人： MITSUBISHI PAPER MILLS LTD
发明人： KANEDA YASUO , KOMURO TOYOICHI , NAZUKA MASANORI
IPC分类号： G03G5/02 , G03G9/12 , G03G15/11 , G03G15/22 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a squeezing roll where excessive liquid can be eliminated well and a good image without any fogging in a non image part can be obtained in liquid toner developing where an electrostatic latent image is converted to a toner image. SOLUTION: In the squeezing roll, the outermost layer is provided as a liquid absorbing layer and an insulating layer which shields against liquids is formed inside of it.

9. 发明专利

JP2002280708A ELECTROPHOTOGRAPHIC RECEPTOR FOR PRINTED WIRING BOARD 失效
公开(公告)号：JP2002280708A
公开(公告)日：2002-09-27
申请号：JP2001077014
申请日：2001-03-16
申请人： MITSUBISHI PAPER MILLS LTD
发明人： TAKADA MASAKAZU , TSUDA KENJI , NAZUKA MASANORI
IPC分类号： G03G5/05 , G03G5/06 , G03G5/14 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide an electrophotographic receptor that is used for manufacturing an electrophotographic printed wiring board having practical sensitivity to ultraviolet rays. SOLUTION: This electrophotographic receptor for manufacturing printed wiring board has a metallic conductive layer provided on an electrical insulation substrate, and a photoconductive layer containing a charge transferring material provided on the conductive layer. Since the charge transporting material, an alkaline treating liquid-soluble polymer, and an anthraquinone-based dye are mixed in the photoconductive layer, an electrophotographic printed wiring board which has practical sensitivity to ultraviolet rays and is excellent in thin-line reproducibility can be obtained.

10. 发明专利

JP2007062086A Reversible thermal recording material 有权
标题翻译：可逆热记录材料
公开(公告)号：JP2007062086A
公开(公告)日：2007-03-15
申请号：JP2005249665
申请日：2005-08-30
申请人： Mitsubishi Paper Mills Ltd , 三菱製紙株式会社
发明人： NAZUKA MASANORI
IPC分类号： B41M5/337
摘要： PROBLEM TO BE SOLVED: To provide an excellent reversible thermal recording material which can perform a forming or erasing cycle of a recorded image with sharp contrast and high sensitivity a large number of times and at the same time, enables the compatibility of repetitive durability with low curling properties. SOLUTION: This reversible thermal recording material is formed of a reversible thermal recording layer which contains as main components a normally colorless or pale-color electron-donative dye precursor and a reversible developer responsible for a reversible color tone change in the dye precursor due to a difference of cooling rate after heating, and a single or a plurality of protecting layers formed on the reversible thermal recording layer, on a support. Besides, the thermal recording material is characterized in that at least its one constituent layer contains at least one dendritic branched resin with a functional group selected from the group consisting of an ethylenic unsaturated linkage group, an isocyanate group and a hydroxyl group, at a molecular terminal and that the arborescent branched resin is cured. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种优异的可逆热敏记录材料，其可以以高对比度和高灵敏度执行多次的记录图像的形成或擦除循环，并且同时，使得重复的具有低卷曲性能的耐久性。解决方案：这种可逆热敏记录材料由可逆热敏记录层形成，其主要成分包含常规无色或浅色电子供体染料前体和负责染料前体中可逆色调变化的可逆显影剂由于加热后的冷却速度的差异以及形成在可逆热敏记录层上的单个或多个保护层在支撑体上。此外，热敏记录材料的特征在于，至少其一个构成层在分子中含有至少一种具有选自烯属不饱和键基，异氰酸酯基和羟基的官能团的枝状支化树脂并且固化支化树枝状树脂。版权所有（C）2007，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式