专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

DE19781578T1 未知
公开(公告)号：DE19781578T1
公开(公告)日：1999-06-17
申请号：DE19781578
申请日：1997-10-22
申请人： MITSUBISHI PAPER MILLS LTD
发明人： HYODO KENJI , AIZAWA WAKANA , TAKAGAMI YUJI , TSUDA KENJI
IPC分类号： B41C1/10 , B41M5/36 , B41N1/14 , G03F1/00 , H05K3/00 , H05K3/06
摘要： An image forming material and an image forming method which are capable of accommodating a direct laser drawing method, producing an image of a high resolution easily and performing an image forming operation easily in a bright room, lithographic printing plate manufacturing method and apparatus, a lithographic printing plate making method, and a printed wiring board manufacturing method are provided. Concretely speaking, an image forming material having a layer of thermally meltable fine particles on a base material, and a method of forming an image on a base material by melt-fixing the portion of a layer of the thermally meltable fine particles of the image forming material which corresponds to an image portion, and then removing the portion of the layer of thermally meltable fine paticles which corresponds to a non-image portion are provided. The layer of thermally meltable fine particles can be melt-fixed by a laser. The removing of the non-image portion of the layer of thermally meltable fine particles can be done more easily by providing a layer of an alkali-soluble resin between the base material and the layer of thermally meltable fine particles, and applying an alkali solution to this layer of an alkali-soluble resin.

2. 发明专利

DE112005000522T5 未知
公开(公告)号：DE112005000522T5
公开(公告)日：2007-01-18
申请号：DE112005000522
申请日：2005-03-02
申请人： SHINKO ELECTRIC IND CO , MITSUBISHI PAPER MILLS LTD
发明人： FUKASE KATSUYA , SAKAI TOYOAKI , IRISAWA MUNETOSHI , KOMURO TOYOKAZU , KANEDA YASUO , NATSUKA MASANORI , AIZAWA WAKANA
IPC分类号： H05K3/42 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/10
摘要： As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.

3. 发明专利

DE10192114T1 未知
公开(公告)号：DE10192114T1
公开(公告)日：2002-09-19
申请号：DE10192114
申请日：2001-05-23
申请人： MITSUBISHI PAPER MILLS LTD , NIPPON UNICAR CO LTD
发明人： TAKAOKA KAZUCHIYO , MATSUYAMA MUTSUHIRO , HYODO KENJI , AIZAWA WAKANA , HINO TAKAKAZU , SUZUKI NAOKI
IPC分类号： C08G77/60 , C08L83/16 , H01B1/12 , H01G9/02 , H01G9/022 , H01G11/56 , H01M6/16 , H01M6/18 , H01M10/052 , H01M10/0565 , H01M10/058 , H01M10/36 , H01B1/06 , H01G9/038 , H01M10/40
摘要： The present invention provides a gelled composition comprising a polymer and a solvent, said polymer being obtained by an addition reaction between a linear copolymer having two terminal hydrosilyl groups and a compound having 3 or more ethylenic double bonds, wherein said linear copolymer being formed by copolymerizing a compound represented by the formula (A): and a compound represented by the formula (B): said compound having 3 or more ethylenic double bonds being a compound represented by the formula (D):

4. 发明专利

DE19781578C2 未知
公开(公告)号：DE19781578C2
公开(公告)日：2001-11-15
申请号：DE19781578
申请日：1997-10-22
申请人： MITSUBISHI PAPER MILLS LTD
发明人： HYODO KENJI , AIZAWA WAKANA , TAKAGAMI YUJI , TSUDA KENJI
IPC分类号： B41C1/10 , B41M5/36 , B41N1/14 , G03F1/00 , H05K3/00 , H05K3/06 , H05K3/12 , G03F7/038 , B41M5/40 , B41N1/08 , G03G13/28
摘要： An image forming material and an image forming method which are capable of accommodating a direct laser drawing method, producing an image of a high resolution easily and performing an image forming operation easily in a bright room, lithographic printing plate manufacturing method and apparatus, a lithographic printing plate making method, and a printed wiring board manufacturing method are provided. Concretely speaking, an image forming material having a layer of thermally meltable fine particles on a base material, and a method of forming an image on a base material by melt-fixing the portion of a layer of the thermally meltable fine particles of the image forming material which corresponds to an image portion, and then removing the portion of the layer of thermally meltable fine paticles which corresponds to a non-image portion are provided. The layer of thermally meltable fine particles can be melt-fixed by a laser. The removing of the non-image portion of the layer of thermally meltable fine particles can be done more easily by providing a layer of an alkali-soluble resin between the base material and the layer of thermally meltable fine particles, and applying an alkali solution to this layer of an alkali-soluble resin.

5. 发明公开

EP2955773A4 NONWOVEN SUBSTRATE FOR LITHIUM-ION SECONDARY CELL SEPARATOR, AND LITHIUM-ION SECONDARY CELL SEPARATOR 有权
标题翻译：非织造基材锂离子二次电池和隔板的锂离子二次电池用隔膜
公开(公告)号：EP2955773A4
公开(公告)日：2017-02-15
申请号：EP14748767
申请日：2014-01-28
申请人： MITSUBISHI PAPER MILLS LTD
发明人： SATO TOMOHIRO , SHIGEMATSU TOSHIHIRO , KATO MAKOTO , HYODO KENJI , AIZAWA WAKANA
IPC分类号： H01M2/16 , D04H1/55 , H01M10/052
CPC分类号： H01M2/162 , D04H1/55 , H01M2/145 , H01M10/052 , H01M10/0525
摘要： A non-woven fabric base material for a lithium ion secondary battery separator composed mainly of a polyethylene terephthalate fiber, characterized in that the non-woven fabric base material comprises a polyethylene terephthalate binder fiber and a crystallized polyethylene terephthalate fiber, and the content of a polyethylene terephthalate binder fiber having a fiber length of 2.5 mm or less is 10 to 60 mass%.

6. 发明专利

JP2008001040A Thin paper for screen printing 审中-公开
标题翻译：薄纸打印
公开(公告)号：JP2008001040A
公开(公告)日：2008-01-10
申请号：JP2006174588
申请日：2006-06-23
申请人： Mitsubishi Paper Mills Ltd , 三菱製紙株式会社
发明人： OGIYA HIROSHI , AIZAWA WAKANA
IPC分类号： B41N1/24 , D21H11/00 , D21H27/00
摘要： PROBLEM TO BE SOLVED: To provide a thin paper for screen printing which is thin, homogeneous, excellent in plate life and suitable for both an oil ink and an aqueous ink.
SOLUTION: The thin paper for screen printing includes at least fibers obtained from parenchyma cells of plants. The fibers at least includes fibers obtained from parenchyma cells of plants whose suspension stability is fibrillated by 50% or over and organic fibers whose average fiber diameter is 0.1 to 5 μm.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供薄而均匀的丝网印刷用薄纸，其平板寿命优异，适用于油墨和含水墨水。解决方案：用于丝网印刷的薄纸至少包括从植物薄壁细胞获得的纤维。纤维至少包括从其悬浮稳定性原纤化50％以上的植物薄壁细胞获得的纤维和平均纤维直径为0.1〜5μm的有机纤维。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2006281690A Tissue paper for stencil printing 审中-公开
标题翻译：组织纸印刷
公开(公告)号：JP2006281690A
公开(公告)日：2006-10-19
申请号：JP2005107321
申请日：2005-04-04
申请人： Mitsubishi Paper Mills Ltd , 三菱製紙株式会社
发明人： YOSHIDA MITSUO , AIZAWA WAKANA
IPC分类号： B41N1/24 , D21H13/02 , D21H13/24
摘要： PROBLEM TO BE SOLVED: To provide tissue paper for stencil printing, which is thin, homogeneous, excellent in printing resistance, and suitable for both an oil-based ink and a water-based ink.
SOLUTION: This tissue paper for stencil printing contains: at least either of two kinds of fibrillated fibers, that is, a fibrillated fiber (X) with a fiber diameter of 1 μm or less, separated from a stem part, or a fibrillated fiber (Y), where a branch part with a fiber diameter of 1 μm or less is developed from the stem part of with a fiber diameter of 2 μm or more; and an organic fiber (Z) with a fiber diameter of 1-30 μm.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供薄，均匀，耐印刷性优异并适用于油性油墨和水性油墨的模版印刷用薄纸。解决方案：用于模板印刷的这种纸巾包含：两种原纤化纤维中的至少一种，即纤维直径为1μm或更小的原纤化纤维（X），与茎部分离，或原纤化纤维（Y），其中纤维直径为1μm以下的分支部分从纤维直径为2μm以上的茎部展开; 和纤维直径为1-30μm的有机纤维（Z）。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2005286299A Method of manufacturing circuit board 审中-公开
标题翻译：制造电路板的方法
公开(公告)号：JP2005286299A
公开(公告)日：2005-10-13
申请号：JP2004362996
申请日：2004-12-15
申请人： Mitsubishi Paper Mills Ltd , Shinko Electric Ind Co Ltd , 三菱製紙株式会社 , 新光電気工業株式会社
发明人： IRISAWA MUNETOSHI , AIZAWA WAKANA , KOMURO TOYOICHI , FUKASE KATSUYA , SAKAI TOYOAKI
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a method by which a circuit board, having a wide tolerance of the alignment accuracy coping with landless holes or holes having narrow land widths required for increasing the density of the circuit board can be manufactured by using the subtractive method coping with fine wiring. SOLUTION: The method of manufacturing the circuit board includes a step of forming a first resin layer on the surface of an insulating substrate having a conductive layer on its surface and on the internal walls of a through hole or/and non-through hole; a step of forming a second resin layer on the first conductive layer, formed on the surface conductive layer; and a step of removing the first resin layer formed on the holes. The method also includes a step of forming conductive layers on the internal walls of the through hole or/and non-through hole, and a step of removing the first and second resin layers. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种方法，通过使用具有对准精度的宽的公差对准无线孔或具有用于增加电路板的密度所需的具有窄的覆盖区的孔的电路板，可以通过使用减法处理精细布线。解决方案：制造电路板的方法包括在其表面上和通孔的内壁上的绝缘基板的表面上形成第一树脂层的步骤和/或非贯通孔; 在所述第一导电层上形成第二树脂层的步骤，形成在所述表面导电层上; 以及去除形成在孔上的第一树脂层的步骤。该方法还包括在通孔或/或非通孔的内壁上形成导电层的步骤和去除第一和第二树脂层的步骤。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005286297A Method of manufacturing circuit board 审中-公开
标题翻译：制造电路板的方法
公开(公告)号：JP2005286297A
公开(公告)日：2005-10-13
申请号：JP2004362994
申请日：2004-12-15
申请人： Mitsubishi Paper Mills Ltd , Shinko Electric Ind Co Ltd , 三菱製紙株式会社 , 新光電気工業株式会社
发明人： IRISAWA MUNETOSHI , AIZAWA WAKANA , KOMURO TOYOICHI , FUKASE KATSUYA , SAKAI TOYOAKI
IPC分类号： H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a method, by which a circuit board that is wide in the tolerance of alignment accuracy corresponding to a landless holes or holes having narrow land widths required for increasing the density of the circuit board can be manufactured by using the semi-additive method.
SOLUTION: The method of manufacturing the circuit board is composed of a step of forming a photo-crosslinking resin layer on the surface of an insulating substrate having a first conductive layer on its surface and on the internal walls of a through hole or/and a non-through hole, a step of forming a second resin layer on the photo-crosslinking resin layer formed on the surface conductive layer, and a step of removing the photo-crosslinking resin layer formed on the holes. The method is also composed of a step of crosslinking the photo-crosslinking resin layer in the portion, corresponding to a non-circuit section, a step of removing the unreacted photo-crosslinking resin layer and second resin layer, and a step of forming a second conductive layer on the exposed first conductive layer. In addition, the method is also composed of a step of removing the crosslinked photo-crosslinking resin layer and the first conductive layer underlying the removed photo-crosslinking resin layer.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种方法，通过该方法可以制造宽度对准具有用于增加电路板的密度所需的具有窄的底面宽度的无人化孔或对准孔的公差的电路板通过使用半添加法。解决方案：制造电路板的方法包括在其表面上和通孔的内壁上具有第一导电层的绝缘基板的表面上形成光交联树脂层的步骤，或 /和非通孔，在形成在表面导电层上的光交联树脂层上形成第二树脂层的步骤，以及除去形成在孔上的光交联树脂层的步骤。该方法还包括在相当于非电路部分的部分中交联光交联树脂层的步骤，除去未反应的光交联树脂层和第二树脂层的步骤，以及形成第二导电层在暴露的第一导电层上。此外，该方法还包括除去交联的光交联树脂层和除去的光交联树脂层下面的第一导电层的步骤。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005251946A Method for manufacturing circuit board 审中-公开
标题翻译：制造电路板的方法
公开(公告)号：JP2005251946A
公开(公告)日：2005-09-15
申请号：JP2004059628
申请日：2004-03-03
申请人： Mitsubishi Paper Mills Ltd , Shinko Electric Ind Co Ltd , 三菱製紙株式会社 , 新光電気工業株式会社
发明人： IRISAWA MUNETOSHI , AIZAWA WAKANA , KOMURO TOYOICHI , FUKASE KATSUYA , SAKAI TOYOAKI
IPC分类号： H05K3/42 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board by a semi-additive method using highly sensitive materials for a plating resist layer, and to provide a method for manufacturing a circuit board having holes by surely preventing the plating resist layer from being formed in the hole without being affected by the shapes of the holes or the positioning precision of an exposure process.
SOLUTION: This method for manufacturing a circuit board comprises a process for forming a first metallic conductive layer on the surface of an insulating substrate which may be provided with through-holes and/or non-through-holes, and for forming a plating resist layer at a circuit non-formation section; a process for carrying out electrolytic plating, and for forming a second metallic conductive layer on the surface of the section where the first metallic conductive layer is exposed; a process for removing the plating resist layer; and a process for etching-removing the first metallic conductive layer under the plating resist layer, and for forming the circuit. This method for forming the plating resist layer comprises a process for forming an electrolytic latent image on the first resist layer formed on the first metallic conductive layer, a process for forming the second resin layer on the first resist layer at the section equivalent to the circuit non-formation part, and a process for removing the first resist layer equivalent to the circuit formation part.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过使用用于电镀抗蚀剂层的高灵敏度材料的半添加方法来制造电路板的方法，并且提供一种通过可靠地防止电镀来制造具有孔的电路板的方法抗蚀剂层不会形成在孔中而不受孔的形状或曝光处理的定位精度的影响。解决方案：该电路板的制造方法包括在绝缘基板的表面形成第一金属导电层的工序，绝缘基板的表面可以设置有贯通孔和/或非贯通孔，电路非形成部分的电镀抗蚀剂层; 用于在第一金属导电层露出的部分的表面上形成电解电镀和形成第二金属导电层的工艺; 去除电镀抗蚀剂层的工艺; 以及在电镀抗蚀剂层下蚀刻去除第一金属导电层并形成电路的工艺。形成电镀抗蚀剂层的方法包括在形成在第一金属导电层上的第一抗蚀剂层上形成电解潜像的方法，在与电路相当的部分在第一抗蚀剂层上形成第二树脂层的工艺非形成部分，以及用于去除与电路形成部分相当的第一抗蚀剂层的工艺。版权所有（C）2005，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式