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    • 1. 发明专利
    • HOUSING FOR ELECTRONIC APPARATUS
    • JPH08317514A
    • 1996-11-29
    • JP12173295
    • 1995-05-19
    • MITSUBISHI ELECTRIC CORP
    • GANRIYUU YUUJIKIMURA SUMIONAKAJIMA YOSHINOBUHARAGA KOSUKEYAGI NAOKI
    • H05K5/04H02B1/30H02B1/36H05K5/02
    • PURPOSE: To provide a housing for electronic apparatus, which is assembled by using a bonding agent together with a fastener such as a rivet to obtain a sufficient rigidity having a necessary earthquake resistance by applying a bonding agent to a connecting metal fitting and making connection between metal panels and between the metal panel and a connection metal fitting. CONSTITUTION: An L-shaped corner metal fitting 57 which is a connection metal fitting with a bonding agent applied to (a part shown by hatching) is inserted into the slit 55 of a side plate panel 33, and the first leg part 57a of the connection metal fitting 57 is bonded to the inner surface of the inward bent part 54 of the side plate panel 33, and the second leg part 57b of the connection metal fitting 57 is bonded to the inner surface of the stand-up part 50 of a bottom plate panel 32. Next, a fastening tool such as a rivet is inserted into aligned rivet holes 56, 57 of two sheets of metal panels 32, 33 thus assembled, and the bottom plate panel 32 and the side plate panel 33 are firmly fastened to each other by plastic deformation. Therefore, this housing is assembled by using a bonding agent together with a fastening tool such as a rivet, thereby being able to obtain sufficient rigidity having a necessary earthquake resistance.