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    • 10. 发明专利
    • SOLDERING APPEARANCE INSPECTION INSTRUMENT
    • JPH03103706A
    • 1991-04-30
    • JP24141689
    • 1989-09-18
    • MITSUBISHI ELECTRIC CORP
    • KAWATO SHINJIROMIZUNO SHUJIHIBARA TATSUNORI
    • G01B11/24B23K1/00
    • PURPOSE:To decide whether a soldering state is normal or abnormal by providing one image pickup device and two lighting parts which differ in lighting angle, and using a 3rd image obtained by finding the difference between two images of the same solder zone which are obtained in their lighting states. CONSTITUTION:A chip component 4 which is soldered on a printed wiring board 6 is placed below a TV camera 1, a lighting switching circuit 24 turns on the 1st lighting part 2 and turns off the 2nd light part 2', and a 1st image is read in an image memory 21. Then the lighting part 2' is turned on and a 2nd image is read in an image memory 22. Further, the value in the memory 22 is subtracted from the value in the memory 21 in corresponding picture element units and the resulting value is read in an image memory 23 as the 3rd image; and its output is supplied to a binary coding part 11 and compared with a binary coding threshold level to obtain a binary-coded image, which is inputted to an area measurement part 13. Its output is inputted to an arithmetic decision part 14 and a value stored in a standard table 15 and the measured value obtained by the measurement part 13 are compared to output a normal or abnormal decision result 16.