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    • 3. 发明专利
    • REFLECTED ELECTRON BEAM DIFFRACTION APPARATUS
    • JPH02216040A
    • 1990-08-28
    • JP3714189
    • 1989-02-16
    • MIKOSHIBA NOBUOOMI TADAHIROTSUBOCHI KAZUOEKI KAZUYA
    • MIKOSHIBA NOBUOOMI TADAHIROTSUBOUCHI KAZUOEKI KAZUYA
    • G01N23/225G01N23/207
    • PURPOSE:To measure the distribution of individual crystals by arranging a reflected electron beam diffraction electron gun, a photomultiplier and an arithmetic circuit to permits the determination of crystal bearings in faces thereof parallel and vertical to the surface of a sample. CONSTITUTION:Diffraction pattern is formed on a fluorescent screen 6 by a diffraction electron beam 5 resulting from an electron beam 4 emitted from a reflected electron beam diffraction electron gun 1. A signal from a diffraction spot is introduced to photomultipliers 10-12 through optical fibers 7-9 to be amplified and computed with an arithmetic circuit 13. Then, with the circuit 13, intensities of the diffraction spots undergo a multiplication processing by an optional constant and a addition/subtraction processing between the intensities of the diffraction spots subjected to the multiplication processing. A signal 14 as the results of the arithmetic processing is inputted into a CRT 15 as brightness signal. Then, a diffraction intensity image from the surface of a sample is displayed on the CRT 15 by a scan signal synchronizing a scan signal 16 of the electron beam from the electron gun 1. Thus, the fibers 7-9 are disposed under vacuum and a allowed to select optional diffraction spots mechanically.
    • 5. 发明专利
    • REFLECTED ELECTRON BEAM DIFFRACTION APPARATUS
    • JPH02216042A
    • 1990-08-28
    • JP3714489
    • 1989-02-16
    • MIKOSHIBA NOBUOOMI TADAHIROTSUBOCHI KAZUOEKI KAZUYA
    • MIKOSHIBA NOBUOOMI TADAHIROTSUBOUCHI KAZUOEKI KAZUYA
    • G01N23/225G01N23/20G01N23/201
    • PURPOSE:To obtain information on a bearing and size of a crystal of a sample while enabling an analysis with high depth-wise resolutions by performing an arithmetic processing of a diffraction pattern as produced when the surface of a sample is irradiated with an electron beam converged to a fine diameter at an angle of incidence almost parallel with the surface thereof. CONSTITUTION:The surface of a sample 3 is irradiated with an electron beam converged to a fine diameter to observe a diffraction pattern. At this point, a relationship between intensities of electron beams at a plurality of points on the diffraction pattern does not change while a monocrystalline area in the surface of the sample 3 is scanned by an electron beam 4 incident into the sample 3 but changes depending on a difference in a direction or the like of a crystal face of an adjacent crystal when the scanning is shifted thereto. A change in this relationship is extracted by a arithmetic processing of a detection output at the points to be displayed two-dimensionally. Thus, only 10-20Angstrom is enough for the penetration depth of the electron beam 4 into the surface of the sample 3 to allow clear recognition of a construction of a fine area on the surface of the sample 3 and this is utilized to be combined with an ion etching of the surface of the sample 3 thereby enabling an structural analysis of the sample 3 with depth-resolutions at 10-20Angstrom .
    • 6. 发明专利
    • INTEGRATED CIRCUIT
    • JPH0348460A
    • 1991-03-01
    • JP10503890
    • 1990-04-20
    • MIKOSHIBA NOBUOTSUBOCHI KAZUOEKI KAZUYA
    • MIKOSHIBA NOBUOTSUBOUCHI KAZUOEKI KAZUYA
    • H01L29/78H01L21/8236H01L27/088H01L29/49
    • PURPOSE:To obtain a high-speed and high-density integrated circuit with a fewer MOSFETs, which operates both at room temperature and at the temperature of liquid nitrogen and which can be manufactured in a fewer processes, by using gates with a specific work function without doping the channel section of a semiconductor substrate immediately below a gate insulating film with an impurity which is different in conductivity type from the substrate. CONSTITUTION:The channel section 18' of an Si substrate 7 immediately below the insulating film 16 of a gate electrode 17 is not doped with an impurity which is different in conductivity type from the substrate. The gate electrode 17 is formed of a material having a work function smaller than that of the p type Si substrate 7. (When the conductivity of the substrate 7 is n-type, a material having a work function lager than that of an n-type substrate is used for the gate electrode.) The channel length 24 of the channel section 18 is constituted of very fine MOSFETs of 0.5mum in width by using such nitrides as LaB6, TiN, ZrN, TaN, VN, etc., and such carbides as ZrC, TiC, TaC, HfC, etc., as low-work function gate metals.
    • 8. 发明专利
    • ORGANIC METAL FEEDER
    • JPS63307717A
    • 1988-12-15
    • JP14305087
    • 1987-06-10
    • MIKOSHIBA NOBUO
    • MIKOSHIBA NOBUOTSUBOUCHI KAZUOEKI KAZUYASUZUKI NOBUMASA
    • F17C1/00H01L21/205
    • PURPOSE:To make it needless to fill an unnecessarily large quantity of organic metal in a cylinder containing organic metal for reducing any impurity in said cylinder to enhance the purity of a deposited film to be formed by a method wherein the cylinder containing organic metal is provided with a leading-in means of the organic metal and a removing means of the same. CONSTITUTION:An organic metal 3 is previously contained in a spare cylinder 8 while a valve 5 is opened to keep a thermostatic chamber 7 at a constant temperature for securing the pertinent saturated vapor pressure of the organic metal 3. When a main cylinder 4 is filled with the organic metal 3 to be used, the temperature in the thermostatic chamber 7 is restored to the room temperature and then the valve 5 is closed. In order to use the organic metal 3, carrier gas such as H2, Ar etc., is led in the organic metal 3 contained in the cylinder 4 passing through another valve 1 in the arrow direction and then the organic metal 3 fit for the saturated vapor pressure together with the carrier gas is carried to a substrate through the other valve 2. After using, the other valve 6 is opened to fill any waste liquid of the organic metal 3 in a waste liquid cylinder 9. Through these procedures, an unnecesarily large quantity of organic metal 3 need not be filled in the main cylinder 4 containing the organic metal 3.