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1. 发明申请

US20150257284A1 METHOD OF BENDING BACK RIGID PRINTED WIRING BOARD WITH FLEXIBLE PORTION 审中-公开
标题翻译：用柔性部分弯曲背面刚性印刷接线板的方法
公开(公告)号：US20150257284A1
公开(公告)日：2015-09-10
申请号：US14378810
申请日：2014-03-07
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Mitsuaki Toda , Kazuo Shishime , Hisanori Yoshimizu
IPC分类号： H05K3/46 , H05K3/22 , H05K3/00
CPC分类号： H05K3/4691 , H05K1/028 , H05K1/148 , H05K3/225 , H05K3/227 , H05K2203/1105 , Y10T156/1082
摘要： A method for bending back a rigid printed wiring board with a flexible portion includes: forming a preparation substrate on a surface of a prepreg made of thermosetting resin, the preparation substrate including a conducting layer made of a conductive material; laminating the plurality of preparation substrates; thermally hardening the thermosetting resin so as to integrate the plurality of laminated preparation substrates as an intermediate substrate while heating and pressing together the plurality of preparation substrates; cutting an insulating layer formed by thermally hardening the thermosetting resin in a lamination direction of the preparation substrate so as to form a flexible portion, the flexible portion being thinly formed across opposed both edges of the intermediate substrate to form a complete substrate; bending the flexible portion; bending-back the flexible portion; and dehydrating by raising a temperature of the bent flexible portion before bending-back the flexible portion.
摘要翻译：一种用柔性部分弯曲刚性印刷线路板的方法包括：在由热固性树脂制成的预浸料的表面上形成准备基材，所述制备基材包括由导电材料制成的导电层; 层叠多个制备基板; 热固化热固性树脂，以便将多个层压制备基材作为中间基材一体化，同时加热并将多个制备基材压在一起; 切割通过在所述制备基板的层叠方向上热固化所述热固性树脂而形成的绝缘层，以便形成柔性部分，所述柔性部分在所述中间基板的相对的两个边缘上被薄地形成以形成完整的基板; 弯曲柔性部分; 弯曲柔性部分; 并且通过在弯曲柔性部分之前提高弯曲的柔性部分的温度来脱水。

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