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1. 发明申请

WO2012042667A9 METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENT, AND SUBSTRATE WITH BUILT-IN COMPONENT MANUFACTURED USING THE METHOD 审中-公开
标题翻译：使用内置元件制造基板的方法，以及使用该方法制造的具有内置元件的基板
公开(公告)号：WO2012042667A9
公开(公告)日：2013-08-22
申请号：PCT/JP2010067259
申请日：2010-10-01
申请人： MEIKO ELECTRONICS CO LTD , IMAMURA YOSHIO , MATSUMOTO TOHRU , SHIMIZU RYOICHI
发明人： IMAMURA YOSHIO , MATSUMOTO TOHRU , SHIMIZU RYOICHI
IPC分类号： H05K3/46
CPC分类号： H05K13/0023 , H01L21/568 , H01L21/6835 , H01L23/544 , H01L2221/68359 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/04105 , H01L2224/26175 , H01L2224/32245 , H01L2224/83005 , H01L2224/83132 , H05K1/0269 , H05K1/16 , H05K1/188 , H05K2201/09781 , H05K2201/09918
摘要： A thin-film conductive layer to be a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except at a plurality of actual connecting positions and at least one dummy connecting position, an actual solder pad (6) and a dummy solder pad (7) are respectively formed using a solder at each of the actual connecting positions exposed from the conductive layer, and at the dummy connecting position, and the connecting terminal (9) of an electric or electronic component (8) is connected to the actual solder pad (6). A resin insulating base material (16) is formed, said insulating base material being laminated on the conductive layer directly or with the mask layer (3) therebetween, and having the component (8) embedded therein, a part of the conductive layer is removed with the dummy solder pad (7) as reference, and the conductor pattern (18) is formed.
摘要翻译：制备作为导体图案（18）的薄膜导电层，除了多个实际连接位置和至少一个虚拟连接位置之外，在导电层上形成掩模层（3），实际的焊盘并且在虚拟连接位置和电气或电子部件的连接端子（9）上分别使用焊料形成虚拟焊盘（7），并且， 8）连接到实际的焊盘（6）。形成树脂绝缘基材（16），所述绝缘基材直接或者与导电层之间的掩模层（3）层叠在其上，并且其中嵌入有部件（8），导电层的一部分被去除以虚拟焊盘（7）为基准，形成导体图案（18）。

2. 发明申请

WO1987004977A1 PROCESS FOR PRODUCING COPPER-CLAD LAMINATE 审中-公开
标题翻译：生产铜箔层压板的方法
公开(公告)号：WO1987004977A1
公开(公告)日：1987-08-27
申请号：PCT/JP1987000112
申请日：1987-02-21
申请人： MEIKO ELECTRONICS CO., LTD. , WADA, Tatsuo , YAMASHITA, Keizo , TOUYAMA, Tasuku , YAMAMOTO, Teruaki
发明人： MEIKO ELECTRONICS CO., LTD.
IPC分类号： B32B31/12
CPC分类号： B32B15/20 , B32B15/01 , B32B38/0012 , B32B38/10 , B32B2307/202 , B32B2307/206 , B32B2457/08 , H05K3/025 , H05K3/382 , H05K2203/0152 , H05K2203/0307 , H05K2203/0361 , H05K2203/0723 , H05K2203/0726
摘要： A process for producing a copper-clad laminate, which comprises a step (S2) of forming a copper foil of at least several mum on a planar conductive base material by electrolysis, a step (S3) of roughening the surface of the copper foil, a step (S4) of laminating the copper foil together with the conductive base material on an insulating base material and tightly integrating the assembly by applying pressure and heat, and a step (S5) of peeling off only the conductive base material. A highly pure metal film may exist between the conductive base material and the copper foil. When the highly pure metal film has a thickness of 0.1 to 3 mum, only the conductive material is peeled off with the highly pure metal film being firmly adhered to the copper foil surface and, when the highly pure metal film has a thickness of 70 to 250 mum, it is peeled off together with the conductive base material after the lamination. The copper foil formed by high-speed plating under the conditions of 2.6 to 20.0 m/sec in liquid-contacting speed and 0.15 to 4.0 A/cm2 in current density has about the same flexibility as that of rolled and annealed copper. Thus extremely thin copper-clad laminates with a copper foil of 10 mum or less suited for flexible circuit boards can be produced in a short time using small equipment.

3. 发明申请

WO1987005182A1 METHOD OF PRODUCING CONDUCTOR CIRCUIT BOARDS 审中-公开
标题翻译：制造导体电路板的方法
公开(公告)号：WO1987005182A1
公开(公告)日：1987-08-27
申请号：PCT/JP1987000111
申请日：1987-02-21
申请人： MEIKO ELECTRONICS CO., LTD. , WADA, Tatsuo , YAMASHITA, Keizo , TOUYAMA, Tasuku , YAMAMOTO, Teruaki
发明人： MEIKO ELECTRONICS CO., LTD.
IPC分类号： H05K03/20
CPC分类号： H05K3/205 , H05K2201/09881 , H05K2203/0152 , H05K2203/0726 , Y10T29/49158
摘要： A thin metal layer is formed by electrolysis (S2) maintaining a thickness of 1 to 5 mum on an electrically conductive single-plate substrate having a predetermined coarseness, a resist mask is formed (S3) on the surface of the thin metal layer, and then a conductor circuit is electroformed thereon (S4) using copper. After the surface of the conductor circuit is coarsened (S5), the conductor circuit is laminated on an insulating substrate for each single plate via the thin metal layer and is intimately adhered in a unitary structure by the application of heat and pressure (S7). Then, the single plate only is peeled off (S8), and the exposed thin metal layer is removed by etching (S9). The thin metal layer and the conductor circuit are electroplated at high speeds under the conditions of a liquid contact speed of 2.6 to 20 m/sec. and a current density of 0.15 to 4.0 A/cm2, so that a required intimate adhesion force is obtained between the thin metal layer and the resist mask. Further, the conductor circuit is provided with flexibility like that of rolled and annealed copper, thus making it possible to produce very thin and high-density conductor circuits having a thickness of smaller than 10 mum adapted not only to rigid printed wiring boards but also to flexible printed wiring boards.

4. 发明公开

US20230143088A1 PLANAR ANTENNA BOARD 审中-公开
公开(公告)号：US20230143088A1
公开(公告)日：2023-05-11
申请号：US17904951
申请日：2020-03-24
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Mitsuaki TODA , Kanemitsu NAGAI , Mitsuo IWAMOTO
IPC分类号： H01Q9/04 , H01Q1/48
CPC分类号： H01Q9/0407 , H01Q1/48
摘要： A planar antenna board (1) comprises a dielectric (2), an antenna layer (3) formed as a conductor for a signal line on one surface of the dielectric (2), and a ground layer (4) formed as a ground conductor on the other surface of the dielectric (2). The dielectric (2) has: a low-dielectric layer (2a) arranged on the antenna-layer (3) side; an intermediate layer (2b) for which the dielectric constant is higher than that of the low-dielectric layer (2a); and an adhesive layer (2c) for which the glass transition point is higher than that of the intermediate layer (2b), and the water absorption rate is higher than that of the low-dielectric layer (2a). The low-dielectric layer (2a) is arranged on the antenna-layer (3) side with respect to the intermediate layer (2b), and the adhesive layer (2c) is arranged on the ground-layer (4) side with respect to the intermediate layer (2b).

5. 发明授权

US10271432B2 Encapsulated circuit module, and production method therefor 有权
公开(公告)号：US10271432B2
公开(公告)日：2019-04-23
申请号：US15534401
申请日：2015-07-10
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Satoru Miwa
IPC分类号： H05K1/02 , H05K1/18 , H01L21/56 , H01L23/00 , H05K3/22 , H01L23/31 , H01L23/552 , H05K9/00
摘要： To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual influence, an embodiment provides an encapsulated circuit module M having a substrate 100 on which a number of electronic components 200 are mounted. An electronic component 200A is a high frequency oscillator. A metal side wall 320 of a partition member is provided on the substrate 100. One surface of the substrate 100 is entirely covered with a first resin 400 together with the electronic components 200 and the side wall 320. The first resin 400 is covered with a metal shield layer 600 for shielding electromagnetic waves. The electronic component 200A is surrounded by the side wall 320 and the shield layer 600.

6. 发明申请

US20180160528A1 THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL WIRING BOARD, AND SUBSTRATE FOR THREE-DIMENSIONAL WIRING BOARD 审中-公开
公开(公告)号：US20180160528A1
公开(公告)日：2018-06-07
申请号：US15578484
申请日：2015-10-30
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Shigeru MICHIWAKI
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09 , H05K3/14 , H05K3/00
CPC分类号： H05K1/0284 , H05K1/0326 , H05K1/09 , H05K3/0014 , H05K3/0023 , H05K3/14 , H05K3/181 , H05K3/389 , H05K3/426 , H05K2201/0129 , H05K2201/0338 , H05K2201/0341 , H05K2201/0347 , H05K2201/09118 , H05K2203/072 , H05K2203/124 , H05K2203/1461
摘要： A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.

7. 发明申请

US20170347462A1 Encapsulated Circuit Module, And Production Method Therefor 审中-公开
公开(公告)号：US20170347462A1
公开(公告)日：2017-11-30
申请号：US15534427
申请日：2015-11-20
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Satoru Miwa
IPC分类号： H05K3/28 , H05K1/18 , H05K9/00 , H05K3/00 , H05K3/12 , H05K3/18
CPC分类号： H05K3/284 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L23/66 , H01L24/97 , H01L2223/6677 , H01L2924/1815 , H01L2924/3025 , H05K1/181 , H05K3/0044 , H05K3/0052 , H05K3/12 , H05K3/181 , H05K9/0022 , H05K9/0024 , H05K9/0088 , H05K2201/10371 , H05K2201/10522 , H05K2203/1316 , H05K2203/1322 , H05K2203/1327
摘要： To improve, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, a shielding property of the shield layer against electromagnetic waves.The encapsulated circuit module has a substrate 100 on which electronic components are mounted, covered with a first resin 400. A surface of the first resin 400 is covered with a shield layer 600 including a first metal covering layer 610 made of copper or iron and a second metal covering layer 620 made of nickel. Each of the first metal covering layer 610 and the second metal covering layer 620 is thicker than 5 μm.

8. 发明申请

US20160016318A1 SUCTION DEVICE 审中-公开
标题翻译：吸引装置
公开(公告)号：US20160016318A1
公开(公告)日：2016-01-21
申请号：US14760976
申请日：2013-01-15
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Shigeru Kawata , Noboru Shingai
IPC分类号： B25J15/06
CPC分类号： B25J15/0633 , B25J15/0616
摘要： The suction device (1) includes: an suction part (2) formed with a plurality of suction holes (8) and adapted to abut against an suction object (9); side walls (3) and a top wall (4) for forming a negative pressure chamber (10) in cooperation with the suction part (2); a pin-shaped valve body (13) extending from the negative pressure chamber (10) into a suction hole (8); and a closing part (16) adapted to close the suction hole (8) in such a way that the valve body (13) slides in the suction hole (8) causing a portion of the valve body (13) and a portion of the inner wall of the suction hole (8) to come into close contact, wherein the valve body (13) has a root part (13a), which is one end thereof located in the negative pressure chamber (10), the root part (13a) is fixed to a plate-shaped flexible body (17) having flexibility and being bridged between and fixed to the side walls (3) in the negative pressure chamber (10), and the flexible body (17) has a plurality of through-holes (19).
摘要翻译：抽吸装置（1）包括：形成有多个吸入孔（8）并适于抵靠抽吸物体（9）的吸入部分（2）; 侧壁（3）和用于与抽吸部分（2）协作形成负压室（10）的顶壁（4）; 从负压室（10）延伸到吸入孔（8）的销状阀体（13）; 以及闭合部分（16），其适于关闭所述吸入孔（8），使得所述阀体（13）在所述吸入孔（8）中滑动，从而导致所述阀体（13）的一部分和所述阀体所述吸入孔（8）的内壁紧密接触，其中所述阀体（13）具有根部（13a），所述根部位于所述负压室（10）的一端，所述根部（13a））固定在具有柔性的板状柔性体（17）上并桥接在负压室（10）中的侧壁（3）上并且固定到负压室（10）中的侧壁（3）之间，并且柔性体（17）具有多个通孔孔（19）。

9. 发明申请

US20150382478A1 DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF DEVICE EMBEDDED SUBSTRATE 审中-公开
标题翻译：器件嵌入式基板和器件嵌入式基板的制造方法
公开(公告)号：US20150382478A1
公开(公告)日：2015-12-31
申请号：US14767536
申请日：2013-02-12
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Hiroshi SHIMADA , Mitsuaki TODA , Tohru MATSUMOTO
IPC分类号： H05K3/20 , C23F1/00 , H05K3/22 , H05K3/46 , H05K1/18 , H05K1/02
CPC分类号： H05K3/20 , C23F1/00 , H05K1/0298 , H05K1/185 , H05K1/188 , H05K3/22 , H05K3/4611 , H05K2201/0195 , H05K2201/0355 , H05K2201/09009 , H05K2201/10636 , H05K2203/11 , Y02P70/611
摘要： A device embedded substrate includes an insulating layer including an insulating resin material, a device embedded in the insulating layer, a metal film coating at least one face of the device, and a roughened portion formed by roughening at least part of the surface of the metal film. Preferably, the device embedded substrate further includes: a conductive layer pattern-formed on a bottom face, the bottom face being one face of the insulating layer; and a bonding agent made of a material different from the insulating layer and joining the conductive layer (6) and a mounting face, the mounting face being one face of the device. The metal film is formed only on a face opposite to the mounting face, and the bonding agent has a thickness smaller than a thickness from the metal film to a top face, the top face being the other face of the insulating layer.
摘要翻译：一种器件嵌入式衬底包括绝缘层，该绝缘层包括绝缘树脂材料，嵌入绝缘层中的器件，涂覆该器件的至少一个面的金属膜以及通过使金属的至少一部分表面粗糙化而形成的粗糙部分电影。优选地，装置嵌入式基板还包括：导电层图案形成在底面上，底面是绝缘层的一个面; 以及由与所述绝缘层不同的材料制成的接合剂，并且将所述导电层（6）和安装面接合，所述安装面是所述装置的一个面。金属膜仅形成在与安装面相反的面上，粘合剂的厚度小于从金属膜到顶面的厚度，顶面是绝缘层的另一面。

10. 发明申请

US20150257284A1 METHOD OF BENDING BACK RIGID PRINTED WIRING BOARD WITH FLEXIBLE PORTION 审中-公开
标题翻译：用柔性部分弯曲背面刚性印刷接线板的方法
公开(公告)号：US20150257284A1
公开(公告)日：2015-09-10
申请号：US14378810
申请日：2014-03-07
申请人： MEIKO ELECTRONICS CO., LTD.
发明人： Mitsuaki Toda , Kazuo Shishime , Hisanori Yoshimizu
IPC分类号： H05K3/46 , H05K3/22 , H05K3/00
CPC分类号： H05K3/4691 , H05K1/028 , H05K1/148 , H05K3/225 , H05K3/227 , H05K2203/1105 , Y10T156/1082
摘要： A method for bending back a rigid printed wiring board with a flexible portion includes: forming a preparation substrate on a surface of a prepreg made of thermosetting resin, the preparation substrate including a conducting layer made of a conductive material; laminating the plurality of preparation substrates; thermally hardening the thermosetting resin so as to integrate the plurality of laminated preparation substrates as an intermediate substrate while heating and pressing together the plurality of preparation substrates; cutting an insulating layer formed by thermally hardening the thermosetting resin in a lamination direction of the preparation substrate so as to form a flexible portion, the flexible portion being thinly formed across opposed both edges of the intermediate substrate to form a complete substrate; bending the flexible portion; bending-back the flexible portion; and dehydrating by raising a temperature of the bent flexible portion before bending-back the flexible portion.
摘要翻译：一种用柔性部分弯曲刚性印刷线路板的方法包括：在由热固性树脂制成的预浸料的表面上形成准备基材，所述制备基材包括由导电材料制成的导电层; 层叠多个制备基板; 热固化热固性树脂，以便将多个层压制备基材作为中间基材一体化，同时加热并将多个制备基材压在一起; 切割通过在所述制备基板的层叠方向上热固化所述热固性树脂而形成的绝缘层，以便形成柔性部分，所述柔性部分在所述中间基板的相对的两个边缘上被薄地形成以形成完整的基板; 弯曲柔性部分; 弯曲柔性部分; 并且通过在弯曲柔性部分之前提高弯曲的柔性部分的温度来脱水。

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