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1. 发明专利

JPH08222572A METHOD OF MOUNTING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08222572A
公开(公告)日：1996-08-30
申请号：JP2564895
申请日：1995-02-14
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAGI TAKAHIKO , AZUMA KAZUJI , TSURUMI KOICHI
IPC分类号： H01L21/60 , H01L21/321
摘要： PURPOSE: To provide a method of mounting a semiconductor device, by which a semiconductor device can be mounted on a circuit board without dispersion of connection resistance value with a small number of processes. CONSTITUTION: This method includes a salient electrode formation process, which forms a salient electrode 8 on the electrode 2 of a semiconductor device 1 by wire bonding method, and a leveling transcription process which transcribes conductive adhesive films 11 to the head faces of the salient electrodes 8 by stopping them for a specified time, in condition that the head faces of the salient electrodes 8 equalized in level, when pulling up a semiconductor device 1 after equalizing the level of the salient electrode 8 by pushing the salient electrodes 8, with specified force, against the plane of a leveling transcription stage 10 where the conductive adhesive film 11 is applied. Furthermore, this has a mounting process, which positions the salient electrode 8 where the conductive adhesive film 11 is transcribed, on the electrode of a circuit board on which to mount the salient electrode, and a process of hardening the conductive adhesive transcribed on the salient electrode 8.

2. 发明专利

JPH07170060A FORMATION OF BONDING MATERIAL AND MOUNTING OF ELECTRONIC COMPONENT 失效
公开(公告)号：JPH07170060A
公开(公告)日：1995-07-04
申请号：JP31657093
申请日：1993-12-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSURUMI KOICHI
IPC分类号： H05K3/34 , H05K3/24
摘要： PURPOSE:To realize a mounting of a narrow-pitch multipin IC on a circuit board in high quality. CONSTITUTION:A method of mounting electronic components comprises a bonding material formation process, which consists of a creamy solder printing (1) and a reflow (2), and an electronic component mounting process, which consists of an application (3) of a flux on a circuit board 3 for electronic component, a mounting (4) and a reflow (5). In this method, a creamy solder 1, solder powder and a solder foil are used, a wetting spreads on bonding parts 8 by heating and melting the solder 1, the powder and the foil one time and the electrical connection of bonding parts 2 on the board 3 with the electronic components 6 and 7 can be made easily and simply.

3. 发明专利

JPH0637440A REFLOW SOLDERING 失效
公开(公告)号：JPH0637440A
公开(公告)日：1994-02-10
申请号：JP19043792
申请日：1992-07-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAGATA HARUTO , KUMAGAI KOICHI , TSURUMI KOICHI
IPC分类号： H05K3/34
摘要： PURPOSE:To provide a method of reflow soldering for surface mount devices, which improves solderability and prevents Manhattan phenomenon. CONSTITUTION:A land pattern is printed with solder paste on a printed-circuit board, and parts are mounted on it. The board is placed in a reflow furnace, which provides a nitrogen atmosphere and is capable of continuous control from a preheating temperature T1 to a reflow temperature T3, where the preheating temperature is such that flux can most effectively remove oxide from the circuit board and parts. Therefore, re-oxidization during preheating is prevented and the temperature distribution on the circuit board become uniform, so that adequate soldering is achieved.

4. 发明专利

JPH0637431A LAND PATTERN OF SURFACE-MOUNT BOARD 失效
公开(公告)号：JPH0637431A
公开(公告)日：1994-02-10
申请号：JP18913192
申请日：1992-07-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FURUSAWA AKIO , NAGATA HARUTO , KUMAGAI KOICHI , TSURUMI KOICHI
IPC分类号： H05K3/34 , H05K1/02 , H05K1/11
摘要： PURPOSE:To prevent generation of mounting defects such as Manhattan phenomenon of a chip when a substrate pattern for surface mounting suitable for a high frequency circuit of telecommunication equipment, for example, and to prevent effect on the dislocation of a land position by the dislocation of a resist film, at the time of manufacturing a substrate. CONSTITUTION:A board 1 is provided with a land section 8 having the radius R formed by etching a conductive material 2 adhered to the wide range on a substrate 1, and it is provided with a plurality of depressed sections composed of the conductive material 2 in the range from the radius R to the radius (R+100mum). The top of the land section 8 and the depressed sections 9 are covered with a resist film 10, and heat conductivity is reduced by providing the depressed sections 9 composed of the conductive material 2 around the land section 8, thereby the same degree of heat conductivity as its counterpart land pattern can be obtained, and Manhattan phenomenon of the chip can be eliminated. In addition, the dislocation of the position of the resist film 10 has no effect on dislocation of the position of the land, because the land section 8 is formed by etching.

5. 发明专利

JPH04220166A DEVICE FOR REFLOW SOLDERING 失效
公开(公告)号：JPH04220166A
公开(公告)日：1992-08-11
申请号：JP40001490
申请日：1990-12-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSURUMI KOICHI , KUWABARA KIMIHITO
IPC分类号： B23K1/00 , B23K1/008 , B23K31/02 , B23K101/40 , H05K3/34
摘要： PURPOSE:To prevent a base plate and soft solder from being oxidized and to reduce the residue of flux by making the atmosphere in a reflow body furnace vacuum state and keeping the atmosphere in a preheating furnace in an inert gas state. CONSTITUTION:An inlet shutter 6 is opened to bring the base plate 1 into the preheating furnace 2 and to heat it to a prescribed temperature. The interior of the preheating furnace 2 is kept in an inert gas atmosphere. The shutter 9 is opened, the preheated base plate 1 is received in the reflow body 3 and subjected to soldering. The interior of the reflow body 3 is kept vacuous by a vacuum pump 7. The pressure of the interior is preferred to be 0.7-0.2atm. An outlet shutter 10 is opened to carry away the soldered base plate 1. The flux can be vaporized and removed from the solder by pressure reduction effect. Further, the oxygen remaining volume is so small that the base plate can be prevented from being oxidized.

6. 发明专利

JPH04190967A ATMOSPHERE FURNACE 失效
公开(公告)号：JPH04190967A
公开(公告)日：1992-07-09
申请号：JP31849590
申请日：1990-11-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KUWABARA KIMIHITO , ISHIMOTO KAZUMI , SATO SHOJI , TSURUMI KOICHI
IPC分类号： B23K1/008 , B23K31/02 , G01N1/00 , H05K3/34
摘要： PURPOSE:To perform satisfactory heat treatment at a low cost by monitoring the concentration of oxygen in a furnace and setting it at an arbitrary value. CONSTITUTION:The concentration of oxygen in the furnace is monitored by a sensor 9. When it exceeds a prescribed concentration of oxygen, the gas in the furnace is circulated by an instruction of a control part 12 through a fan 11 and a duct 10. The oxygen in the gas in the furnace is eliminated by oxygen eliminating catalyst 13 and kept at an arbitrary constant concentration of oxygen. After the oxygen eliminating catalyst eliminates a constant volume of oxygen it is changed and reproduced. This invention does not require large scale inert gas replenishing tank and piping equipment in a plant as in the conventional manner. Further, a large volume of N2 gas, etc., is not consumed and the running cost can be reduced.

7. 发明专利

JPH04188890A COMPONENT MOUNTING DEVICE 失效
公开(公告)号：JPH04188890A
公开(公告)日：1992-07-07
申请号：JP31849790
申请日：1990-11-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSURUMI KOICHI , SHIMAZAKI SHINJI
IPC分类号： H05K3/34
摘要： PURPOSE:To enhance a printed board in reliability by a method wherein an oxide film formed on the surface of an electrode on the printed board is removed just before cream solder is applied. CONSTITUTION:A board 10 is fed to a component mounting line making its component mounting surface face downward. In a pretreatment device, a water absorbing belt 21 of a pickling means 11 is made to slide on the underside of the board 10 keeping in contact with it to pickle the underside of the board 10 with a weak acid solution 22 while the board 10 is transferred on a transfer route 9, consequently an oxide film on the surface of electrodes is removed. Then, the solution 22 residual on the underside of the board 10 is wiped off with a water absorbing belt 31 which contains cleaning water 32 provided in a cleaning means 12. In succession, in a drying means 13, the board 10 is dried up with an air blower 37 and turned over through an inverting means 14 so as to make its component mounting surface face upward. By this setup, a board can be enhanced in reliability.

8. 发明专利

JPH02294055A IC PACKAGE 失效
公开(公告)号：JPH02294055A
公开(公告)日：1990-12-05
申请号：JP11470589
申请日：1989-05-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSURUMI KOICHI , KITAYAMA YOSHIFUMI , MAEDA YUKIO , KABESHITA AKIRA
IPC分类号： H01L23/28 , H05K1/18 , H05K3/34
摘要： PURPOSE:To prevent Manhattan phenomena of a chip parts mounted on the lower part of an IC by forming a protrusion on the lower surface of a main body. CONSTITUTION:A protrusion 2 is formed on the lower part of a main body 1, and the protruding length of protrusion 2 is so determined that the gap between the lower part of an IC and a chip parts 3 is filled. The area of the protrusion 2 is made smaller than the chip parts 3, thereby preventing the protrusion 3 coming into contact with fused solder. Hence an electrode of one side of the chip parts 3 can be restrained from levitating, so that Manhattan phenomena do not generate even when any kind of reflowing method, reflowing condition, and cream solder are used.

9. 发明专利

JP2000059011A ELECTRONIC CIRCUIT SUBSTRATE 失效
公开(公告)号：JP2000059011A
公开(公告)日：2000-02-25
申请号：JP22299598
申请日：1998-08-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSURUMI KOICHI , UBUKAWA TOYOMIZU , NAKAMURA HIROSUMI
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To avoid erroneous operations, even when substrate are bedewed or wetted with salt water. SOLUTION: A frame 14 is formed of non-fluid silicone resin, so as encircle an electronic component and then the inside of the frame 14 is coated with highly fluid silicone resin 15. The frame 14 encircling the whole electronic component is formed generally on the periphery of a printed substrate. The level of the frame 14 even if the level is lower than the sealing thickness, will not overflow with the silicone resin by the surface tension thereof, may be set to less than 0.5 mm with respect to e.g., a sealing thickness of 1 mm.

10. 发明专利

JPH0945733A ELECTRONIC COMPONENT AND MOUNTING THE ELECTRONIC COMPONENT 失效
公开(公告)号：JPH0945733A
公开(公告)日：1997-02-14
申请号：JP19273695
申请日：1995-07-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMOTO KENICHI , TSURUMI KOICHI , KUMAGAI KOICHI
IPC分类号： H01L21/60 , H01L23/12 , H01L25/00 , H05K3/34 , H01L21/321
摘要： PROBLEM TO BE SOLVED: To enable the connection of an electronic component to a circuit board with a high reliability. SOLUTION: The feed rate of a solder 9 between external electrode terminals 8 and electrode terminals 10 is the highest and those of solders 12 and 15 for forming peripheral bond zones of electronic components 1 are lower. After feeding the solders 9, 12, 15 at the difference rates, they are heated from outside to melt and solder. Resulting solder zones are shaped each like a middle-swollen barrel as the load of the component 1 is supported with the inside solder 9 to result in depression of the solder 9 by the load of the component 1. The solders 12 and 15 are drawn up by outer terminals 11 and 14 of the components 1 to form each of them into a circular columnar shape and a middle-necked shape. This relaxes the stress concentrated to the bonded parts at the periphery where the stress is the highest, thus improving the reliability of the bonded parts and prolong the life.

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